JPS59226171A - Automatic monitoring device for electroless plating speed - Google Patents

Automatic monitoring device for electroless plating speed

Info

Publication number
JPS59226171A
JPS59226171A JP10134283A JP10134283A JPS59226171A JP S59226171 A JPS59226171 A JP S59226171A JP 10134283 A JP10134283 A JP 10134283A JP 10134283 A JP10134283 A JP 10134283A JP S59226171 A JPS59226171 A JP S59226171A
Authority
JP
Japan
Prior art keywords
peak voltage
voltage
amplifier
inputted
obtd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10134283A
Other languages
Japanese (ja)
Other versions
JPH0359142B2 (en
Inventor
Takeshi Miyabayashi
Original Assignee
Brother Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brother Ind Ltd filed Critical Brother Ind Ltd
Priority to JP58101342A priority Critical patent/JPH0359142B2/ja
Publication of JPS59226171A publication Critical patent/JPS59226171A/en
Publication of JPH0359142B2 publication Critical patent/JPH0359142B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1676Heating of the solution

Abstract

PURPOSE:To maintain the specified quality of a material to be plated by detecting the waveform of a change in the potential between electrodes in a plating liquid on arising of a difference in said potential, comparing the peak voltage thereof with a set voltage, supplying correcting current between the two electrodes and calculating the plating rate when the prescribed voltage is attained. CONSTITUTION:When a potential difference arises between a sample electrode W and a reference electrode R, said difference is inputted via a differential amplifier 3 to an addition amplifier 6 and a prescribed curve is obtd. from the output of said amplifier and the output of an inversion amplifier 7 stored in a holding circuit 8. The output obtd. from said curve is inputted from a logarithmic converter 9 to a high-speed selector 10 which inputs the peak voltage obtd. from the curve via a peak voltage storage circuit 12 to a high-speed selector 10. Said voltage is inputted to a CPU4 via an A/D converter 11 while the voltage is adequately selected by the selector 10. The CPU4 compares the peak voltage value with an optimum peak voltage value and operates to supply correcting current to both electrodes W, R so as to attain an optimum value. When the peak voltage is brought within the set range of the optimum peak voltage, the electroless plating speed in an electroless plating bath 1 is calculated.
JP58101342A 1983-06-07 1983-06-07 Expired - Lifetime JPH0359142B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58101342A JPH0359142B2 (en) 1983-06-07 1983-06-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58101342A JPH0359142B2 (en) 1983-06-07 1983-06-07

Publications (2)

Publication Number Publication Date
JPS59226171A true JPS59226171A (en) 1984-12-19
JPH0359142B2 JPH0359142B2 (en) 1991-09-09

Family

ID=14298164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58101342A Expired - Lifetime JPH0359142B2 (en) 1983-06-07 1983-06-07

Country Status (1)

Country Link
JP (1) JPH0359142B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194103A2 (en) * 1985-02-28 1986-09-10 C. UYEMURA & CO LTD Method and apparatus for detecting start of electroless plating
EP0242745A1 (en) * 1986-04-21 1987-10-28 International Business Machines Corporation Method and apparatus for controlling the chemical state of an electroless plating bath

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155362A (en) * 1981-03-19 1982-09-25 Toshiba Corp Simple electroless plating monitor
JPS57155361A (en) * 1981-03-19 1982-09-25 Toshiba Corp Simple electroless plating monitor
JPS57155359A (en) * 1981-03-19 1982-09-25 Toshiba Corp Apparatus for measuring electroless plating speed rate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57155362A (en) * 1981-03-19 1982-09-25 Toshiba Corp Simple electroless plating monitor
JPS57155361A (en) * 1981-03-19 1982-09-25 Toshiba Corp Simple electroless plating monitor
JPS57155359A (en) * 1981-03-19 1982-09-25 Toshiba Corp Apparatus for measuring electroless plating speed rate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194103A2 (en) * 1985-02-28 1986-09-10 C. UYEMURA & CO LTD Method and apparatus for detecting start of electroless plating
EP0242745A1 (en) * 1986-04-21 1987-10-28 International Business Machines Corporation Method and apparatus for controlling the chemical state of an electroless plating bath

Also Published As

Publication number Publication date
JPH0359142B2 (en) 1991-09-09

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