JPS59215299A - ホツトプレス - Google Patents

ホツトプレス

Info

Publication number
JPS59215299A
JPS59215299A JP58087409A JP8740983A JPS59215299A JP S59215299 A JPS59215299 A JP S59215299A JP 58087409 A JP58087409 A JP 58087409A JP 8740983 A JP8740983 A JP 8740983A JP S59215299 A JPS59215299 A JP S59215299A
Authority
JP
Japan
Prior art keywords
hot press
adhered
bolster
hot
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58087409A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0322280B2 (forum.php
Inventor
Akemi Miyashita
宮下　明己
Motohiro Ohashi
大橋　基宏
Masami Nemoto
根本　正美
Kiyonori Furukawa
古川　清則
Taketoshi Yomogida
蓬田　健利
Osamu Yamada
収 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58087409A priority Critical patent/JPS59215299A/ja
Publication of JPS59215299A publication Critical patent/JPS59215299A/ja
Publication of JPH0322280B2 publication Critical patent/JPH0322280B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B7/00—Presses characterised by a particular arrangement of the pressing members
    • B30B7/02—Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Control Of Presses (AREA)
  • Press Drives And Press Lines (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Presses And Accessory Devices Thereof (AREA)
JP58087409A 1983-05-20 1983-05-20 ホツトプレス Granted JPS59215299A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58087409A JPS59215299A (ja) 1983-05-20 1983-05-20 ホツトプレス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58087409A JPS59215299A (ja) 1983-05-20 1983-05-20 ホツトプレス

Publications (2)

Publication Number Publication Date
JPS59215299A true JPS59215299A (ja) 1984-12-05
JPH0322280B2 JPH0322280B2 (forum.php) 1991-03-26

Family

ID=13914076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58087409A Granted JPS59215299A (ja) 1983-05-20 1983-05-20 ホツトプレス

Country Status (1)

Country Link
JP (1) JPS59215299A (forum.php)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262740A (ja) * 1985-09-14 1987-03-19 Meiki Co Ltd ホツトプレス装置
JPS62140811A (ja) * 1985-12-14 1987-06-24 Meiki Co Ltd 多段式ホツトプレス
JPH02160200A (ja) * 1988-12-14 1990-06-20 Hitachi Ltd ホツトプレス
US5558015A (en) * 1993-12-28 1996-09-24 Hitachi Techno Engineering Co., Ltd. Hot press with pressure vessels to uniformly distribute pressure to the work piece
JP2012166263A (ja) * 2011-01-24 2012-09-06 Bondtech Inc 加圧装置および加圧方法
JP2021187026A (ja) * 2020-05-28 2021-12-13 ニッコー・マテリアルズ株式会社 積層装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998759A (forum.php) * 1973-01-30 1974-09-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4998759A (forum.php) * 1973-01-30 1974-09-18

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262740A (ja) * 1985-09-14 1987-03-19 Meiki Co Ltd ホツトプレス装置
JPS62140811A (ja) * 1985-12-14 1987-06-24 Meiki Co Ltd 多段式ホツトプレス
JPH02160200A (ja) * 1988-12-14 1990-06-20 Hitachi Ltd ホツトプレス
US5558015A (en) * 1993-12-28 1996-09-24 Hitachi Techno Engineering Co., Ltd. Hot press with pressure vessels to uniformly distribute pressure to the work piece
JP2012166263A (ja) * 2011-01-24 2012-09-06 Bondtech Inc 加圧装置および加圧方法
JP2021187026A (ja) * 2020-05-28 2021-12-13 ニッコー・マテリアルズ株式会社 積層装置

Also Published As

Publication number Publication date
JPH0322280B2 (forum.php) 1991-03-26

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