JPS5920633U - バンプ接合型半導体装置 - Google Patents

バンプ接合型半導体装置

Info

Publication number
JPS5920633U
JPS5920633U JP1982116344U JP11634482U JPS5920633U JP S5920633 U JPS5920633 U JP S5920633U JP 1982116344 U JP1982116344 U JP 1982116344U JP 11634482 U JP11634482 U JP 11634482U JP S5920633 U JPS5920633 U JP S5920633U
Authority
JP
Japan
Prior art keywords
type semiconductor
semiconductor device
bump
junction type
bump junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982116344U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0215321Y2 (https=
Inventor
前川　通
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1982116344U priority Critical patent/JPS5920633U/ja
Publication of JPS5920633U publication Critical patent/JPS5920633U/ja
Application granted granted Critical
Publication of JPH0215321Y2 publication Critical patent/JPH0215321Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/332—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Wire Bonding (AREA)
JP1982116344U 1982-07-30 1982-07-30 バンプ接合型半導体装置 Granted JPS5920633U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982116344U JPS5920633U (ja) 1982-07-30 1982-07-30 バンプ接合型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982116344U JPS5920633U (ja) 1982-07-30 1982-07-30 バンプ接合型半導体装置

Publications (2)

Publication Number Publication Date
JPS5920633U true JPS5920633U (ja) 1984-02-08
JPH0215321Y2 JPH0215321Y2 (https=) 1990-04-25

Family

ID=30268230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982116344U Granted JPS5920633U (ja) 1982-07-30 1982-07-30 バンプ接合型半導体装置

Country Status (1)

Country Link
JP (1) JPS5920633U (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109757A (ja) * 1987-09-30 1989-04-26 American Teleph & Telegr Co <Att> 集積回路チップの組立品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4895774A (https=) * 1972-03-17 1973-12-07
JPS51147255A (en) * 1975-06-13 1976-12-17 Hitachi Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4895774A (https=) * 1972-03-17 1973-12-07
JPS51147255A (en) * 1975-06-13 1976-12-17 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01109757A (ja) * 1987-09-30 1989-04-26 American Teleph & Telegr Co <Att> 集積回路チップの組立品

Also Published As

Publication number Publication date
JPH0215321Y2 (https=) 1990-04-25

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