JPS59206155A - Method for applying soldering treatment - Google Patents
Method for applying soldering treatmentInfo
- Publication number
- JPS59206155A JPS59206155A JP7900083A JP7900083A JPS59206155A JP S59206155 A JPS59206155 A JP S59206155A JP 7900083 A JP7900083 A JP 7900083A JP 7900083 A JP7900083 A JP 7900083A JP S59206155 A JPS59206155 A JP S59206155A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- board
- solder
- carrier
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Abstract
Description
【発明の詳細な説明】
本発明ははんだ処理を施す方法において、配線基板上の
導体パターンおよびスルーホール等の表面に薄いはんだ
膜を形成するはんだコーティング工法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a solder coating method for forming a thin solder film on the surfaces of conductive patterns, through holes, etc. on a wiring board, in a method of performing soldering.
従来のはんだコーティング工法の工程は、（１）配線基
板の一辺あるいは一辺の一部をキャリアで保持゛し、（
２）キャリア下端の位置まで配線基板を融けたはんだに
浸漬し、（３）引き上げ時ノズルから熱風を配線基板に
吹き付けて余分なはんだを吹き飛ばし、（４）配線基板
をキャリアから取シ外す等の順序で行なわれる。The conventional solder coating process consists of (1) holding one side or part of one side of the wiring board with a carrier;
2) Immerse the wiring board in molten solder up to the bottom edge of the carrier, (3) blow off excess solder by blowing hot air onto the wiring board from a nozzle when pulling it up, and (4) remove the wiring board from the carrier. done in order.
この際、配線基板金はんだ中に浸漬した時の熱によって
、（５）配線基板の基板製造時に包含した歪が開放され
、（６）配線基板を構成しているガラス、繊維、エボキ
ン、銅パターン等の熱膨張による歪が発生し、その後歪
が開放されるから、配線基板にソリやねじれ等の変形を
起こすという欠点があった。At this time, due to the heat generated when the wiring board is immersed in the gold solder, (5) the distortion that was included during the manufacturing of the wiring board is released, and (6) the glass, fiber, Evokin, and copper patterns that make up the wiring board are released. Since strain is generated due to thermal expansion, and then the strain is released, there is a drawback that deformation such as warping or twisting occurs in the wiring board.
本発明は、融けたはんだ中に配線基板を浸漬後引き上げ
、熱風で前記配線基板上の不要部分の融けたはんだを吹
き飛ばす工程を備えたはんだ処理を施す方法において、
前記配線基板の少くとも２辺を保持する工程と、前記不
要部分の融けたはんだ吹き飛ばした後に強制空冷する工
程を設けたことを特徴とするはんだ処理を施す方法にあ
る。The present invention provides a soldering process comprising the steps of immersing a wiring board in molten solder, pulling it up, and blowing away the molten solder on unnecessary parts of the wiring board with hot air.
The method of performing soldering processing is characterized by comprising a step of holding at least two sides of the wiring board, and a step of forced air cooling after blowing off the melted solder from the unnecessary portions.
本発明によれば、従来のはんだコーティング工法で発生
しがちであった配線基板のソリやねじれ等の変形を防止
することができる。According to the present invention, it is possible to prevent deformations such as warpage and twisting of the wiring board that tend to occur in conventional solder coating methods.
次に本発明の実施例について工程順に図面を参照して説
明する。第１図（５）、第１図の）乃至第４図は本発明
の実施例のはんだ処理を施す方法を示す側面図である。Next, embodiments of the present invention will be described in order of steps with reference to the drawings. FIG. 1(5) and FIG. 1) to FIG. 4 are side views showing a method of performing soldering according to an embodiment of the present invention.
第１の工程；第１図（５）、第１図（Ｂ）に示すように
、配線基板２をキャリア１に保持する。このキャリア１
は配線基板２の寸法に合わせて４辺を保持しておシ、寸
法の調整が可能であることが好ましい。First step: As shown in FIG. 1(5) and FIG. 1(B), the wiring board 2 is held on the carrier 1. This career 1
It is preferable that the four sides be held according to the dimensions of the wiring board 2, and that the dimensions can be adjusted.
第２の工程；第２図に示すように、キャリアｌに保持し
た配線基板２を融けたけんだ４の入ったはんだ槽３に浸
漬する。この際、配線基板が加熱されると、基板が僅か
やわらかくなる為、基板製造時に内在した応力を基板の
変形によシ開放しようとする現象や、配線基板を構成し
ているガラス繊維、エボキ／、パター／の膨張率の差に
よって応力を生じ、基板の変形によシ開放しょうとする
等の現象を生じるが、基板が変形しない様にあらかじめ
固定し、冷却するとやわらかくなった基板がもとにもど
るとき基板の変形が防止出来る。Second step: As shown in FIG. 2, the wiring board 2 held on the carrier I is immersed in a solder bath 3 containing melted solder 4. At this time, when the wiring board is heated, it becomes slightly soft, so there is a phenomenon in which the stress inherent in the manufacturing of the board is released by deformation of the board, and the glass fibers, epoxy, etc. , Stress is generated due to the difference in the expansion coefficient of the putter, which causes phenomena such as the board trying to open due to deformation of the board, but the board is fixed in advance so that it does not deform, and when cooled, the board becomes soft. This prevents the board from deforming when returning.
第３の工程；キャリア１に保持した配線基板２をはんだ
槽３から引き上げ、第３図に示すように、ノズル５から
の熱風７で配線基板２０余分なはんだを吹き飛ばした後
、第４図に示すように空気をファン６で当てて強制空冷
を行う。第４の工程；配線基板２をキャリアｌから取り
外し、はんだコーティング処理が完了する。Third step: The wiring board 2 held on the carrier 1 is pulled up from the solder bath 3, and the excess solder on the wiring board 20 is blown off with hot air 7 from the nozzle 5 as shown in FIG. Forced air cooling is performed by applying air with a fan 6 as shown. Fourth step: The wiring board 2 is removed from the carrier 1, and the solder coating process is completed.
同、強制空冷を行う方法として、ファ／６を用いてよい
が、その他にノズル５を用いて、熱風でなく冷却した風
またはそのまま大気中の空気を吹き付けてもよい。Similarly, F/6 may be used as a method for performing forced air cooling, but the nozzle 5 may also be used to blow not hot air but cooled air or air directly from the atmosphere.
本発明によれば以上説明したように、配線基板の２辺あ
るいは２辺以上の辺上の任意の個所をキャリアで保持し
、配線基板上の余分なはんだを熱風で吹き飛ばし、後に
強制空冷する工程を設けることによシ、配線基板のソリ
、ねじれ等の変形を少くするという効果が得られる。According to the present invention, as explained above, the process of holding two sides or two or more sides of the wiring board with a carrier, blowing away excess solder on the wiring board with hot air, and then cooling with forced air By providing this, it is possible to reduce deformations such as warping and twisting of the wiring board.
第１図（ト）、第１図（至）は配線基板をキャリアで保
持した本発明の実施例の方法を示す側面図、第２図は融
けたはんだに第１図（５）のキャリアで保持した配線基
板を浸漬した側面図、第３図ははんだ槽から第２図のキ
ャリアで保持した配線基板を引き上げた後ノズルで熱風
を吹き付けている側面図、第４図は強制空冷している側
面図である。
伺図において、１・・・・・・キャリア、２・・・・・
・配線基板、３・・・・・・はんだ槽、４・・・・・・
融けたはんだ、５・・・・・・ノズル、６・・・・・・
ファ／、７・・・・・・熱風。
）ト１ 固（Ａ） ）１１ ℃
４（８）’＝４−２唾
を３１） を４回Figures 1 (G) and 1 (To) are side views showing the method of the embodiment of the present invention in which a wiring board is held by a carrier, and Figure 2 is a side view showing the method of the embodiment of the present invention in which a wiring board is held by a carrier. Figure 3 is a side view of the held wiring board being immersed, Figure 3 is a side view of the wiring board held by the carrier shown in Figure 2 being blown from the solder bath with hot air being blown by a nozzle, and Figure 4 is of forced air cooling. FIG. In the map, 1...carrier, 2...
・Wiring board, 3...Solder bath, 4...
Melted solder, 5... Nozzle, 6...
F/, 7...Hot wind. ) 1 hard (A) ) 11 ℃
4(8)'=4-2 spit 31) 4 times
Claims (1)
記配線基板上の不要部分の融けたはんだを吹き飛ばす工
程を備えたはんだ処理を施す方法において、前記配線基
板の少くとも２辺を保持する工程と、前記不要部分の融
けたはんだを吹き飛ばした後に強制空冷する工程とを設
けたことを特徴とするはんだ処理を施す方法。Holding at least two sides of the wiring board in a soldering method comprising the steps of immersing the wiring board in molten solder and then pulling it up and blowing away the melted solder on unnecessary parts of the wiring board with hot air. and a step of forced air cooling after blowing away the melted solder in the unnecessary portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7900083A JPS59206155A (en) | 1983-05-06 | 1983-05-06 | Method for applying soldering treatment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7900083A JPS59206155A (en) | 1983-05-06 | 1983-05-06 | Method for applying soldering treatment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59206155A true JPS59206155A (en) | 1984-11-21 |
Family
ID=13677634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7900083A Pending JPS59206155A (en) | 1983-05-06 | 1983-05-06 | Method for applying soldering treatment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59206155A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63503585A (en) * | 1986-06-18 | 1988-12-22 | マクダーミッド，インコーポレーテッド | Improved methods for printed circuit board manufacturing |
| JPH06350228A (en) * | 1993-06-08 | 1994-12-22 | Matsushita Electric Works Ltd | Production of soldered printed wiring board |
| US5711473A (en) * | 1995-12-22 | 1998-01-27 | Sund; William | Inert atmosphere soldering apparatus |
-
1983
- 1983-05-06 JP JP7900083A patent/JPS59206155A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63503585A (en) * | 1986-06-18 | 1988-12-22 | マクダーミッド，インコーポレーテッド | Improved methods for printed circuit board manufacturing |
| JPH06350228A (en) * | 1993-06-08 | 1994-12-22 | Matsushita Electric Works Ltd | Production of soldered printed wiring board |
| US5711473A (en) * | 1995-12-22 | 1998-01-27 | Sund; William | Inert atmosphere soldering apparatus |
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