JPS59196385A - 化学研摩液 - Google Patents

化学研摩液

Info

Publication number
JPS59196385A
JPS59196385A JP7196983A JP7196983A JPS59196385A JP S59196385 A JPS59196385 A JP S59196385A JP 7196983 A JP7196983 A JP 7196983A JP 7196983 A JP7196983 A JP 7196983A JP S59196385 A JPS59196385 A JP S59196385A
Authority
JP
Japan
Prior art keywords
polishing liquid
hydrogen peroxide
surfactant
window
chemical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7196983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219511B2 (cs
Inventor
Takeshi Yoda
依田　猛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP7196983A priority Critical patent/JPS59196385A/ja
Publication of JPS59196385A publication Critical patent/JPS59196385A/ja
Publication of JPS6219511B2 publication Critical patent/JPS6219511B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
JP7196983A 1983-04-23 1983-04-23 化学研摩液 Granted JPS59196385A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7196983A JPS59196385A (ja) 1983-04-23 1983-04-23 化学研摩液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7196983A JPS59196385A (ja) 1983-04-23 1983-04-23 化学研摩液

Publications (2)

Publication Number Publication Date
JPS59196385A true JPS59196385A (ja) 1984-11-07
JPS6219511B2 JPS6219511B2 (cs) 1987-04-28

Family

ID=13475805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7196983A Granted JPS59196385A (ja) 1983-04-23 1983-04-23 化学研摩液

Country Status (1)

Country Link
JP (1) JPS59196385A (cs)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2634498A1 (fr) * 1988-07-20 1990-01-26 Organisation Europ Rech Nucle Bain de polissage chimique de metaux et alliages de metaux
EP0351772A3 (en) * 1988-07-19 1990-07-04 HENKEL CORPORATION (a Delaware corp.) Stabilized hydrogen peroxide
EP0698917A1 (de) * 1994-08-25 1996-02-28 Wacker-Siltronic Gesellschaft für Halbleitermaterialien mbH Reinigungsmittel und Verfahren zum Reinigen von Halbleiterscheiben
US5827542A (en) * 1996-02-12 1998-10-27 Healthpoint, Ltd. Quick acting chemical sterilant
US6033596A (en) * 1996-09-24 2000-03-07 Cabot Corporation Multi-oxidizer slurry for chemical mechanical polishing
US6039891A (en) * 1996-09-24 2000-03-21 Cabot Corporation Multi-oxidizer precursor for chemical mechanical polishing
WO2004085707A1 (en) * 2003-03-21 2004-10-07 Swagelok Company Aqueous metal finishing solution, methods for finishing metal components, system for cleaning metal components and finished brass products
EP1837393A3 (en) * 2006-03-22 2008-05-21 FUJIFILM Corporation Cleaning solution for substrate for use in semiconductor device and cleaning method using the same
US7897061B2 (en) * 2006-02-01 2011-03-01 Cabot Microelectronics Corporation Compositions and methods for CMP of phase change alloys
US8778211B2 (en) 2012-07-17 2014-07-15 Cabot Microelectronics Corporation GST CMP slurries

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351772A3 (en) * 1988-07-19 1990-07-04 HENKEL CORPORATION (a Delaware corp.) Stabilized hydrogen peroxide
FR2634498A1 (fr) * 1988-07-20 1990-01-26 Organisation Europ Rech Nucle Bain de polissage chimique de metaux et alliages de metaux
EP0698917A1 (de) * 1994-08-25 1996-02-28 Wacker-Siltronic Gesellschaft für Halbleitermaterialien mbH Reinigungsmittel und Verfahren zum Reinigen von Halbleiterscheiben
US5695572A (en) * 1994-08-25 1997-12-09 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Aktiengesellschaft Cleaning agent and method for cleaning semiconductor wafers
CN1057330C (zh) * 1994-08-25 2000-10-11 瓦克硅电子半导体材料有限公司 半导体晶片的清洗方法
US6096348A (en) * 1996-02-12 2000-08-01 Healthpoint, Ltd. Quick acting chemical sterilant
US5827542A (en) * 1996-02-12 1998-10-27 Healthpoint, Ltd. Quick acting chemical sterilant
US6039891A (en) * 1996-09-24 2000-03-21 Cabot Corporation Multi-oxidizer precursor for chemical mechanical polishing
US6033596A (en) * 1996-09-24 2000-03-07 Cabot Corporation Multi-oxidizer slurry for chemical mechanical polishing
US6316366B1 (en) 1996-09-24 2001-11-13 Cabot Microelectronics Corporation Method of polishing using multi-oxidizer slurry
WO2004085707A1 (en) * 2003-03-21 2004-10-07 Swagelok Company Aqueous metal finishing solution, methods for finishing metal components, system for cleaning metal components and finished brass products
US7897061B2 (en) * 2006-02-01 2011-03-01 Cabot Microelectronics Corporation Compositions and methods for CMP of phase change alloys
EP1837393A3 (en) * 2006-03-22 2008-05-21 FUJIFILM Corporation Cleaning solution for substrate for use in semiconductor device and cleaning method using the same
US8778211B2 (en) 2012-07-17 2014-07-15 Cabot Microelectronics Corporation GST CMP slurries

Also Published As

Publication number Publication date
JPS6219511B2 (cs) 1987-04-28

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