JPS59185769A - 短冊状メツキ物のメツキ処理方法 - Google Patents
短冊状メツキ物のメツキ処理方法Info
- Publication number
- JPS59185769A JPS59185769A JP6037183A JP6037183A JPS59185769A JP S59185769 A JPS59185769 A JP S59185769A JP 6037183 A JP6037183 A JP 6037183A JP 6037183 A JP6037183 A JP 6037183A JP S59185769 A JPS59185769 A JP S59185769A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating
- grooves
- strips
- rolls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 18
- 238000002203 pretreatment Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 238000012805 post-processing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/40—Plates; Strips
- C23C2/405—Plates of specific length
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Coating By Spraying Or Casting (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Tunnel Furnaces (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
- Electroplating Methods And Accessories (AREA)
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
- Chemically Coating (AREA)
- Coating With Molten Metal (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6037183A JPS59185769A (ja) | 1983-04-06 | 1983-04-06 | 短冊状メツキ物のメツキ処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6037183A JPS59185769A (ja) | 1983-04-06 | 1983-04-06 | 短冊状メツキ物のメツキ処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59185769A true JPS59185769A (ja) | 1984-10-22 |
JPH0259877B2 JPH0259877B2 (enrdf_load_stackoverflow) | 1990-12-13 |
Family
ID=13140203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6037183A Granted JPS59185769A (ja) | 1983-04-06 | 1983-04-06 | 短冊状メツキ物のメツキ処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59185769A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260153A (ja) * | 1988-08-26 | 1990-02-28 | Electroplating Eng Of Japan Co | メッキ装置 |
US6802419B2 (en) | 2002-10-11 | 2004-10-12 | Bert Co Industries, Inc. | Package form and method of making a package |
US6899223B2 (en) | 2002-05-09 | 2005-05-31 | Bert-Co Industries, Inc. | Form for a package and method of making same |
-
1983
- 1983-04-06 JP JP6037183A patent/JPS59185769A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260153A (ja) * | 1988-08-26 | 1990-02-28 | Electroplating Eng Of Japan Co | メッキ装置 |
US6899223B2 (en) | 2002-05-09 | 2005-05-31 | Bert-Co Industries, Inc. | Form for a package and method of making same |
US6802419B2 (en) | 2002-10-11 | 2004-10-12 | Bert Co Industries, Inc. | Package form and method of making a package |
Also Published As
Publication number | Publication date |
---|---|
JPH0259877B2 (enrdf_load_stackoverflow) | 1990-12-13 |
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