JPS59176150U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS59176150U
JPS59176150U JP1983070394U JP7039483U JPS59176150U JP S59176150 U JPS59176150 U JP S59176150U JP 1983070394 U JP1983070394 U JP 1983070394U JP 7039483 U JP7039483 U JP 7039483U JP S59176150 U JPS59176150 U JP S59176150U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
wiring board
hybrid integrated
stopper member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983070394U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311721Y2 (enrdf_load_stackoverflow
Inventor
史 伊藤
幸二 田中
園部　俊夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983070394U priority Critical patent/JPS59176150U/ja
Publication of JPS59176150U publication Critical patent/JPS59176150U/ja
Application granted granted Critical
Publication of JPS6311721Y2 publication Critical patent/JPS6311721Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1983070394U 1983-05-10 1983-05-10 混成集積回路装置 Granted JPS59176150U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983070394U JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983070394U JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS59176150U true JPS59176150U (ja) 1984-11-24
JPS6311721Y2 JPS6311721Y2 (enrdf_load_stackoverflow) 1988-04-05

Family

ID=30200543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983070394U Granted JPS59176150U (ja) 1983-05-10 1983-05-10 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS59176150U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6311721Y2 (enrdf_load_stackoverflow) 1988-04-05

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