JPS59174677A - 保護フイルムの剥離方法 - Google Patents

保護フイルムの剥離方法

Info

Publication number
JPS59174677A
JPS59174677A JP58051182A JP5118283A JPS59174677A JP S59174677 A JPS59174677 A JP S59174677A JP 58051182 A JP58051182 A JP 58051182A JP 5118283 A JP5118283 A JP 5118283A JP S59174677 A JPS59174677 A JP S59174677A
Authority
JP
Japan
Prior art keywords
protective film
article
adhesive
peeling
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58051182A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322235B2 (https=
Inventor
Keigo Funakoshi
船越　啓吾
Kozo Nomura
野村　晃三
Minoru Ametani
雨谷　稔
Kenji Onishi
大西　建二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP58051182A priority Critical patent/JPS59174677A/ja
Priority to KR1019840002489A priority patent/KR870000002B1/ko
Publication of JPS59174677A publication Critical patent/JPS59174677A/ja
Priority to US06/917,236 priority patent/US4775438A/en
Publication of JPS6322235B2 publication Critical patent/JPS6322235B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D491/00—Heterocyclic compounds containing in the condensed ring system both one or more rings having oxygen atoms as the only ring hetero atoms and one or more rings having nitrogen atoms as the only ring hetero atoms, not provided for by groups C07D451/00 - C07D459/00, C07D463/00, C07D477/00 or C07D489/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44D—PAINTING OR ARTISTIC DRAWING, NOT OTHERWISE PROVIDED FOR; PRESERVING PAINTINGS; SURFACE TREATMENT TO OBTAIN SPECIAL ARTISTIC SURFACE EFFECTS OR FINISHES
    • B44D3/00—Accessories or implements for use in connection with painting or artistic drawing, not otherwise provided for; Methods or devices for colour determination, selection, or synthesis, e.g. use of colour tables
    • B44D3/16—Implements or apparatus for removing dry paint from surfaces, e.g. by scraping, by burning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs
    • H05B3/36—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
JP58051182A 1983-03-24 1983-03-24 保護フイルムの剥離方法 Granted JPS59174677A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP58051182A JPS59174677A (ja) 1983-03-24 1983-03-24 保護フイルムの剥離方法
KR1019840002489A KR870000002B1 (ko) 1983-03-24 1984-05-09 보호필름의 박리방법
US06/917,236 US4775438A (en) 1983-03-24 1986-10-07 Process for peeling protective film off a thin article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58051182A JPS59174677A (ja) 1983-03-24 1983-03-24 保護フイルムの剥離方法

Publications (2)

Publication Number Publication Date
JPS59174677A true JPS59174677A (ja) 1984-10-03
JPS6322235B2 JPS6322235B2 (https=) 1988-05-11

Family

ID=12879701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58051182A Granted JPS59174677A (ja) 1983-03-24 1983-03-24 保護フイルムの剥離方法

Country Status (3)

Country Link
US (1) US4775438A (https=)
JP (1) JPS59174677A (https=)
KR (1) KR870000002B1 (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155332U (https=) * 1984-09-17 1986-04-14
JPS6362328A (ja) * 1986-09-03 1988-03-18 Matsushita Electronics Corp 半導体基板の裏面処理方法
JPH01125947A (ja) * 1987-11-11 1989-05-18 Ryoji Wakabayashi 半導体ウェハーの保護膜剥離装置
JPH0228950A (ja) * 1988-07-19 1990-01-31 Nitto Denko Corp 半導体ウエハ保護フィルムの剥離方法
JPH02139927A (ja) * 1988-11-21 1990-05-29 Nitto Denko Corp 半導体ウエハのテープ貼付け方法およびテープ剥離方法
US5310442A (en) * 1991-05-13 1994-05-10 Nitto Denko Corporation Apparatus for applying and removing protective adhesive tape to/from semiconductor wafer surfaces
WO1997008745A1 (en) * 1995-08-31 1997-03-06 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP2002124494A (ja) * 2000-08-07 2002-04-26 Nitto Denko Corp 半導体ウエハの不要物除去方法およびその装置
KR100425429B1 (ko) * 2001-05-02 2004-04-08 주식회사 엠앤엘 코팅 비닐 제거용 진공롤러 장치
JP2014063882A (ja) * 2012-09-21 2014-04-10 Disco Abrasive Syst Ltd 樹脂剥がし方法及び樹脂剥がし装置
CN110938386A (zh) * 2018-09-25 2020-03-31 上海和辉光电有限公司 一种薄膜封装结构保护膜及其褪膜方法
JP2022074816A (ja) * 2020-11-05 2022-05-18 三菱電機株式会社 清掃装置および清掃方法

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5154793A (en) * 1988-09-27 1992-10-13 General Electric Company Method and apparatus for removing components bonded to a substrate
AT392949B (de) * 1989-03-17 1991-07-10 Gfm Holding Ag Vorrichtung zum abnehmen eines flaechigen werkstueckes von einer anklebenden unterfolie
JPH0682750B2 (ja) * 1989-08-30 1994-10-19 日東電工株式会社 ウエハ保護シートの剥離方法
JP3156419B2 (ja) * 1993-02-15 2001-04-16 松下電器産業株式会社 異方性導電フィルム保護用セパレータの剥離方法
US5482899A (en) * 1994-03-21 1996-01-09 Texas Instruments Incorporated Leveling block for semiconductor demounter
US5609714A (en) * 1994-05-10 1997-03-11 Sterling Dry Imaging, Inc. Apparatus for dry processing of optical print media
US5651846A (en) * 1995-08-17 1997-07-29 Hurst; Richard Francis Method and apparatus for removing the printed layer of labels from semirigid containers
US5810962A (en) * 1996-09-30 1998-09-22 Magnatech Computer Services, Inc. Apparatus and process for removing computer diskette labels
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US6149758A (en) * 1997-06-20 2000-11-21 Lintec Corporation Sheet removing apparatus and method
JPH11162805A (ja) * 1997-12-02 1999-06-18 Nitto Denko Corp レジスト除去方法
JP3888754B2 (ja) * 1997-12-08 2007-03-07 日東電工株式会社 半導体ウエハの自動貼付け装置
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
JP4166920B2 (ja) * 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
US7413626B2 (en) * 2001-01-12 2008-08-19 3M Innovative Properties Company Adhesive film removal method and apparatus
DE10046594A1 (de) * 2000-09-20 2002-04-25 Hermann Werner Entetikettierverfahren und zugehörige Vorrichtung
US20030037877A1 (en) * 2000-10-18 2003-02-27 Fritz Brinkmann Delabelling method and device for carrying out said method
EP1259953A2 (de) * 2000-10-18 2002-11-27 Pacimex Verpackungen GmbH Entetikettierverfahren und vorrichtung zum durchführen des verfahrens
JP2003147300A (ja) * 2001-11-12 2003-05-21 Lintec Corp ウエハ裏面研削時の表面保護シートおよび半導体チップの製造方法
TWI336603B (en) * 2004-12-03 2011-01-21 Ngk Spark Plug Co Method and apparatus for producing a wiring board, including film-peeling
JP2007230740A (ja) * 2006-03-02 2007-09-13 Tokyo Seimitsu Co Ltd 表面保護フィルム剥離方法および表面保護フィルム剥離装置
BR112015018027A2 (pt) * 2013-01-31 2017-07-11 Michelin Rech Tech Encontrador de prevenção de rachadura de banda de rodagem e de redução de força de desmoldagem
JP6914587B2 (ja) * 2017-05-25 2021-08-04 株式会社ディスコ ウェーハの加工方法
US11130329B2 (en) 2020-02-07 2021-09-28 The Boeing Company Apparatus and method for peeling a liner away from a substrate
CN119176305A (zh) * 2023-06-21 2024-12-24 纬创资通(重庆)有限公司 除膜设备与揭膜机构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4858909A (https=) * 1971-11-23 1973-08-18
JPS5374534A (en) * 1976-12-15 1978-07-03 Seiko Epson Corp Method and apparatus for peeling protector paper or release paper

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029536A (en) * 1976-04-07 1977-06-14 Western Electric Company, Inc. Methods of and apparatus for mounting articles to a carrier member
US4285759A (en) * 1979-11-19 1981-08-25 E. I. Du Pont De Nemours And Company Apparatus for stripping a cover sheet
US4421586A (en) * 1982-09-20 1983-12-20 Ronald Bargman Process, disposable roller cover, and masking preform for removing adhesive tape
JPS59104649A (ja) * 1982-12-08 1984-06-16 Somar Corp 保護膜の剥離装置
US4466852A (en) * 1983-10-27 1984-08-21 At&T Technologies, Inc. Method and apparatus for demounting wafers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4858909A (https=) * 1971-11-23 1973-08-18
JPS5374534A (en) * 1976-12-15 1978-07-03 Seiko Epson Corp Method and apparatus for peeling protector paper or release paper

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155332U (https=) * 1984-09-17 1986-04-14
JPS6362328A (ja) * 1986-09-03 1988-03-18 Matsushita Electronics Corp 半導体基板の裏面処理方法
JPH01125947A (ja) * 1987-11-11 1989-05-18 Ryoji Wakabayashi 半導体ウェハーの保護膜剥離装置
JPH0228950A (ja) * 1988-07-19 1990-01-31 Nitto Denko Corp 半導体ウエハ保護フィルムの剥離方法
JPH02139927A (ja) * 1988-11-21 1990-05-29 Nitto Denko Corp 半導体ウエハのテープ貼付け方法およびテープ剥離方法
US5310442A (en) * 1991-05-13 1994-05-10 Nitto Denko Corporation Apparatus for applying and removing protective adhesive tape to/from semiconductor wafer surfaces
WO1997008745A1 (en) * 1995-08-31 1997-03-06 Nitto Denko Corporation Method and apparatus for peeling protective adhesive tape from semiconductor wafer
JP2002124494A (ja) * 2000-08-07 2002-04-26 Nitto Denko Corp 半導体ウエハの不要物除去方法およびその装置
KR100425429B1 (ko) * 2001-05-02 2004-04-08 주식회사 엠앤엘 코팅 비닐 제거용 진공롤러 장치
JP2014063882A (ja) * 2012-09-21 2014-04-10 Disco Abrasive Syst Ltd 樹脂剥がし方法及び樹脂剥がし装置
CN110938386A (zh) * 2018-09-25 2020-03-31 上海和辉光电有限公司 一种薄膜封装结构保护膜及其褪膜方法
JP2022074816A (ja) * 2020-11-05 2022-05-18 三菱電機株式会社 清掃装置および清掃方法

Also Published As

Publication number Publication date
US4775438A (en) 1988-10-04
KR850000297A (ko) 1985-02-26
JPS6322235B2 (https=) 1988-05-11
KR870000002B1 (ko) 1987-01-28

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