JPS59171360U - 自動插入用発光ダイオ−ドランプ - Google Patents

自動插入用発光ダイオ−ドランプ

Info

Publication number
JPS59171360U
JPS59171360U JP1983064655U JP6465583U JPS59171360U JP S59171360 U JPS59171360 U JP S59171360U JP 1983064655 U JP1983064655 U JP 1983064655U JP 6465583 U JP6465583 U JP 6465583U JP S59171360 U JPS59171360 U JP S59171360U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
diode lamp
automatic injection
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983064655U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442946Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
隆 山岡
梅崎　昌昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP1983064655U priority Critical patent/JPS59171360U/ja
Publication of JPS59171360U publication Critical patent/JPS59171360U/ja
Application granted granted Critical
Publication of JPH0442946Y2 publication Critical patent/JPH0442946Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
JP1983064655U 1983-04-28 1983-04-28 自動插入用発光ダイオ−ドランプ Granted JPS59171360U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983064655U JPS59171360U (ja) 1983-04-28 1983-04-28 自動插入用発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983064655U JPS59171360U (ja) 1983-04-28 1983-04-28 自動插入用発光ダイオ−ドランプ

Publications (2)

Publication Number Publication Date
JPS59171360U true JPS59171360U (ja) 1984-11-16
JPH0442946Y2 JPH0442946Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-10-12

Family

ID=30194840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983064655U Granted JPS59171360U (ja) 1983-04-28 1983-04-28 自動插入用発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS59171360U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5163952U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-11-14 1976-05-20
JPS56137466U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1980-03-18 1981-10-17

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5163952U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-11-14 1976-05-20
JPS56137466U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1980-03-18 1981-10-17

Also Published As

Publication number Publication date
JPH0442946Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-10-12

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