JPS59157247A - Copper alloy for lead frame - Google Patents

Copper alloy for lead frame

Info

Publication number
JPS59157247A
JPS59157247A JP3126783A JP3126783A JPS59157247A JP S59157247 A JPS59157247 A JP S59157247A JP 3126783 A JP3126783 A JP 3126783A JP 3126783 A JP3126783 A JP 3126783A JP S59157247 A JPS59157247 A JP S59157247A
Authority
JP
Japan
Prior art keywords
alloy
lead frame
copper
weight
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3126783A
Other languages
Japanese (ja)
Inventor
Yasuhiko Miyake
三宅 保彦
Sadahiko Sanki
参木 貞彦
Koichi Tamura
幸一 田村
Kikuo Watanabe
渡辺 喜久男
Kenji Konishi
健司 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP3126783A priority Critical patent/JPS59157247A/en
Publication of JPS59157247A publication Critical patent/JPS59157247A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a Cu alloy for a lead frame for IC with superior workability in manufacture as well as strength, electric conductivity, heat resistance and assembling workability which are comparable to those of phosphor bronze by adding specified amounts of Zn and Zr to Cu. CONSTITUTION:This Cu alloy for a lead frame for IC consists of, by weight, 5.0-20.0% Zn, 0.05-0.5% Zr and the balance Cu. The alloy may further contain about 0.05-0.5% rare earth element and/or about 0.03-0.20% P. The alloy is melted by high-frequency heating in the air, and it is hot-rolled to a plate of about 7mm. thickness at about 800-850 deg.C. After cleaning the surface by pickling, the plate is repeatedly subjected to cold rolling and annealing to obtain a thin plate of about 0.25mm. thickness. About 85% high draft can be attained in the cold rolling stages except the final finish rolling stage.

Description

【発明の詳細な説明】 不発1y](は」C用リードフレームに用いられる銅基
合金、特に良好な高強度型銅合金に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a copper-based alloy, particularly a good high-strength type copper alloy, used in a lead frame for C.

IC用り一12フレームとしては、機種に応じて各種の
桐材が使用されているが、強度と導電性を要する場合に
は燐青銅が多く使用されている。しかしながら、燐青銅
は製造時の加工性が悪く、鋳塊製造より始めて仕上げの
薄肉の条材に至るまで加工に多大の類を要し、引いては
コストの上昇をきたす。このような観点から、製造加工
性に優れ、燐青銅に代替し得る銅基合金・が望1れてい
る。
Various types of paulownia wood are used for IC frames depending on the model, but phosphor bronze is often used when strength and conductivity are required. However, phosphor bronze has poor workability during production, and requires a large amount of processing from ingot production to finished thin-walled strips, which results in an increase in costs. From this point of view, there is a desire for a copper-based alloy that has excellent manufacturing processability and can be used as a substitute for phosphor bronze.

本発明の目的は製造加工性に優れ、燐青銅に匹敵する強
度、導電性、耐熱性及び組立加工性を有するI Cリー
ドフレーム用銅基台金を提供するにある。
An object of the present invention is to provide a copper base metal for an IC lead frame that has excellent manufacturing processability and has strength, conductivity, heat resistance, and assembly processability comparable to that of phosphor bronze.

すなわち、本発明は亜鉛5.0〜20.0重量%、ジル
コニウム0.05〜0.5重量%、及び残部実質的に鋼
からなるととを特徴とするリードフレーム用銅基台金で
ある。
That is, the present invention is a copper base metal for a lead frame characterized by containing 5.0 to 20.0% by weight of zinc, 0.05 to 0.5% by weight of zirconium, and the remainder substantially consisting of steel.

本発明の銅基合金はさらに、希土類元素0.05〜0.
5重量%及び/又は燐0.03〜0.20重量係含有す
ることができる。
The copper-based alloy of the present invention further contains a rare earth element of 0.05 to 0.
It can contain 5% by weight and/or 0.03 to 0.20% by weight of phosphorus.

以下、本発明の銅基合金について説明する。The copper-based alloy of the present invention will be explained below.

本発明の銅基合金は上記の如き組成を有する。The copper-based alloy of the present invention has a composition as described above.

亜鉛の量が5.0%以下では実用上強度が不足し、20
.0係以上では製造加工性が低下する。ジルコニウムの
量が0.05 %以下では耐熱性向上への寄与が不足し
、0.5係以」二では鋳造性が低下する。寸だ、本発明
の銅基合金(d、希土類元素及び/又は燐を含有し得る
が、これらを含有する場合には、希土類元素の量が0.
05%以下では製造加工性(圧延力仔丁性)向上への寄
与が不足し、0.5%以上では鋳造性が低下し、燐の量
が0.03%以下では鋳造性向上への富力が不足し、0
.20%以上では製造加工性(圧延加工性)が低下する
If the amount of zinc is less than 5.0%, the strength will be insufficient for practical use, and the
.. If the coefficient is 0 or higher, manufacturing processability will decrease. When the amount of zirconium is less than 0.05%, its contribution to improving heat resistance is insufficient, and when it is more than 0.5%, castability deteriorates. The copper-based alloy of the present invention (d) may contain a rare earth element and/or phosphorus, but when it contains these, the amount of the rare earth element is 0.
If the amount of phosphorus is less than 0.05%, there will be insufficient contribution to improving the manufacturing processability (rolling force control property), if it is more than 0.5%, the castability will decrease, and if the amount of phosphorus is less than 0.03%, there will be insufficient contribution to improving the castability. is insufficient and becomes 0
.. If it exceeds 20%, manufacturing processability (rolling processability) decreases.

本発明の銅基合金は上記の組成を主体とするものである
が、Fc、N夏、 co、 Mn、 Si等の元素を少
量含有しても同様な性能を有するので、これ等を少量含
イ1していても差支えない。
Although the copper-based alloy of the present invention has the above-mentioned composition as its main component, it has the same performance even if it contains small amounts of elements such as Fc, N, co, Mn, and Si. There is no problem even if you have a 1.

次に、第1表に示す如き本発明合金を試料とし、高周波
大気溶M後、800〜850℃で熱間圧延し、7 n+
II+厚の板とした。どの熱間圧延板を表面清浄化のた
め酸洗処理した後に、冷間圧延と焼鈍の繰り返しにより
0.25m+++厚の板とi〜だ。こXで、焼鈍間加工
度は、最後の仕上圧延を除いて約85%の高い水準を確
保することができた。このように、本発明銅基合金は、
鋳造性、圧延加工性共に良好で優れた製造加工性を確保
することができた。
Next, the alloy of the present invention as shown in Table 1 was used as a sample, and after high-frequency atmospheric melting M, hot rolling was performed at 800 to 850°C, and 7 n+
A plate of II+ thickness was used. Which hot-rolled plate is subjected to pickling treatment for surface cleaning, and then subjected to repeated cold rolling and annealing to produce a plate with a thickness of 0.25m+++. With this method, the workability during annealing was able to be maintained at a high level of about 85%, except for the final finish rolling. In this way, the copper-based alloy of the present invention
Both castability and rolling workability were good, and excellent manufacturing processability could be ensured.

第1表 次に、第1表に示す本発明合金と同様な成分を含み、本
発明の組成外の組成よりなる比較用合金及び従来例とし
ての燐青銅(Sn:4.2%、 P O,04%。
Table 1 Next, a comparison alloy containing the same components as the present invention alloy shown in Table 1 but having a composition other than the present invention, and a conventional example of phosphor bronze (Sn: 4.2%, P O ,04%.

残部Cu)について上記と同様なテストを行い、又、本
発明の合金と共にその諸性能を調べた結果を第2表に示
した。
The same tests as above were conducted on the remaining Cu alloy, and the various performances thereof were investigated along with the alloy of the present invention. The results are shown in Table 2.

上記の結果より、本発明の合金は従来多用されている燐
青銅に比較し、繰り返し曲げ性が若干劣るものの、引張
り強さ、導電率はほぼ同等又は優れた性能を示しており
、特に軟化温度については著しく高い値を示しており、
優れた耐熱性を有していることが分る。又、比較用台金
は、使用性能に関しては、本発明合金と同等程度の値を
示しているが、いずれも鋳造性又は圧延性等の製造加工
性に黄11点があるものが多く、実際に製造する場合、
生産コストが著しく上がり、経済性の点で実用に供し得
ないことに°なる。賦香9など製造加工性の良いものは
、使用性能が著しく悪いという問題がある。なお、比較
用合金のうちで、賦香13,15のものは使用性能、製
造加工性とも本発明合金と同様な良好な性能を示してい
るが、RE 、 ]’の添加の効果が、添加量が少いた
めに明かでない。
From the above results, the alloy of the present invention is slightly inferior in repeated bending properties compared to phosphor bronze, which has been widely used in the past, but has approximately the same or superior performance in terms of tensile strength and electrical conductivity, especially at softening temperature. shows a significantly high value for
It can be seen that it has excellent heat resistance. In addition, although the comparison base metals show values comparable to the inventive alloys in terms of usability, many of them have yellow 11 points in manufacturing processability such as castability or rollability. If manufactured in
The production cost would increase significantly, making it impractical from an economic point of view. Products that are easy to manufacture and process, such as Fuka 9, have a problem of extremely poor usability. Among the comparison alloys, those with fragrances 13 and 15 show good performance in both usability and manufacturing processability, which is similar to that of the invention alloy, but the effect of the addition of RE, ]' It is not clear because the amount is small.

本発明の銅基合金は次の如き効果を有する。The copper-based alloy of the present invention has the following effects.

1)高強度型リードフレーム合金として代表的な従来合
金である燐青銅に比較し、耐熱性及び導電性に優れてい
る。
1) It has superior heat resistance and electrical conductivity compared to phosphor bronze, which is a typical conventional high-strength lead frame alloy.

2)同様に、燐青銅に比較し、一般に製a加丁性に優れ
、安価である。
2) Similarly, compared to phosphor bronze, it generally has better machinability and is cheaper.

Claims (3)

【特許請求の範囲】[Claims] (1)  亜鉛5.0〜20.0重量%、ジルコニウム
0.05〜0.5重量%、及び残部実質的に銅からなる
ことを特徴とするリードフレーム用銅基台金。
(1) A copper base metal for a lead frame, comprising 5.0 to 20.0% by weight of zinc, 0.05 to 0.5% by weight of zirconium, and the remainder substantially copper.
(2)  0.05〜0.5重量%の希土類元素を含む
特許請求の範囲第(1)項に記載のリードフレーム用銅
基台金。
(2) The copper base metal for a lead frame according to claim (1), which contains 0.05 to 0.5% by weight of a rare earth element.
(3)  o、o3〜0,20重量%の燐を含む特S′
F請求の・ 範囲第(1)項又は第(2)項に記載のリ
ードフレーム用銅基合金。
(3) Special S' containing o, o3 to 0,20% by weight of phosphorus
Copper-based alloy for lead frames according to Scope (1) or (2) of Claim F.
JP3126783A 1983-02-25 1983-02-25 Copper alloy for lead frame Pending JPS59157247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3126783A JPS59157247A (en) 1983-02-25 1983-02-25 Copper alloy for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3126783A JPS59157247A (en) 1983-02-25 1983-02-25 Copper alloy for lead frame

Publications (1)

Publication Number Publication Date
JPS59157247A true JPS59157247A (en) 1984-09-06

Family

ID=12326558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3126783A Pending JPS59157247A (en) 1983-02-25 1983-02-25 Copper alloy for lead frame

Country Status (1)

Country Link
JP (1) JPS59157247A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04231005A (en) * 1990-12-27 1992-08-19 Masaatsu Yoshikawa Brief case with portable telephone housing part

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5690944A (en) * 1979-12-24 1981-07-23 Furukawa Kinzoku Kogyo Kk Alloy for wire cut electrospark machining electrode
JPS5794540A (en) * 1980-12-05 1982-06-12 Sumitomo Electric Ind Ltd Copper alloy for terminal and its production
JPS57108235A (en) * 1980-12-24 1982-07-06 Sumitomo Electric Ind Ltd Copper alloy for lead frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5690944A (en) * 1979-12-24 1981-07-23 Furukawa Kinzoku Kogyo Kk Alloy for wire cut electrospark machining electrode
JPS5794540A (en) * 1980-12-05 1982-06-12 Sumitomo Electric Ind Ltd Copper alloy for terminal and its production
JPS57108235A (en) * 1980-12-24 1982-07-06 Sumitomo Electric Ind Ltd Copper alloy for lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04231005A (en) * 1990-12-27 1992-08-19 Masaatsu Yoshikawa Brief case with portable telephone housing part

Similar Documents

Publication Publication Date Title
US4589938A (en) Single phase copper-nickel-aluminum-alloys
JP2593107B2 (en) Manufacturing method of high strength and high conductivity copper base alloy
JPS5816044A (en) Copper alloy
JP2002266042A (en) Copper alloy sheet having excellent bending workability
JP3511648B2 (en) Method for producing high-strength Cu alloy sheet strip
JP3049137B2 (en) High strength copper alloy excellent in bending workability and method for producing the same
JPS59157247A (en) Copper alloy for lead frame
JPH0711363A (en) High strength and high conductivity copper alloy member and its production
JPS62250136A (en) Copper alloy terminal and connector
JPS6033328A (en) Copper-based alloy for lead frame and manufacture thereof
JPS6376839A (en) Copper alloy for electronic equipment and its production
JP3032869B2 (en) High strength and high conductivity copper-based alloy
JPS628491B2 (en)
JPS59157246A (en) Copper alloy for lead frame
JP2945208B2 (en) Method for producing copper alloy for electrical and electronic equipment
JPH0453935B2 (en)
JPS6141751A (en) Manufacture of copper alloy material for lead frame
JPS5989743A (en) High-strength copper alloy with high electric conductivity
JP3050763B2 (en) Heat resistant automotive terminal materials
JPS62130247A (en) Copper alloy for electronic appliance
JPS62227052A (en) Copper-base alloy for terminal and connector and its production
JPH0525568A (en) Easy-to-work high strength copper alloy and its production
JPH0849028A (en) Copper/zirconium/cerium/lanthanum alloy and method of processing and heat-treating same
JPH05271850A (en) Free cutting white alloy
JPH01127637A (en) Copper alloy for semiconductor apparatus and production thereof