JPS5915510Y2 - 発光ダイオ−ド素子 - Google Patents

発光ダイオ−ド素子

Info

Publication number
JPS5915510Y2
JPS5915510Y2 JP13751178U JP13751178U JPS5915510Y2 JP S5915510 Y2 JPS5915510 Y2 JP S5915510Y2 JP 13751178 U JP13751178 U JP 13751178U JP 13751178 U JP13751178 U JP 13751178U JP S5915510 Y2 JPS5915510 Y2 JP S5915510Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
diode element
type region
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13751178U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5554965U (enrdf_load_stackoverflow
Inventor
隆夫 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP13751178U priority Critical patent/JPS5915510Y2/ja
Publication of JPS5554965U publication Critical patent/JPS5554965U/ja
Application granted granted Critical
Publication of JPS5915510Y2 publication Critical patent/JPS5915510Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP13751178U 1978-10-05 1978-10-05 発光ダイオ−ド素子 Expired JPS5915510Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13751178U JPS5915510Y2 (ja) 1978-10-05 1978-10-05 発光ダイオ−ド素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13751178U JPS5915510Y2 (ja) 1978-10-05 1978-10-05 発光ダイオ−ド素子

Publications (2)

Publication Number Publication Date
JPS5554965U JPS5554965U (enrdf_load_stackoverflow) 1980-04-14
JPS5915510Y2 true JPS5915510Y2 (ja) 1984-05-08

Family

ID=29109773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13751178U Expired JPS5915510Y2 (ja) 1978-10-05 1978-10-05 発光ダイオ−ド素子

Country Status (1)

Country Link
JP (1) JPS5915510Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3315785A1 (de) * 1983-04-30 1984-11-08 Robert Bosch Gmbh, 7000 Stuttgart Kraftfahrzeugleuchte

Also Published As

Publication number Publication date
JPS5554965U (enrdf_load_stackoverflow) 1980-04-14

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