JPS59150691U - Anti-freezing device for tanks on ships in ice seas - Google Patents

Anti-freezing device for tanks on ships in ice seas

Info

Publication number
JPS59150691U
JPS59150691U JP4608983U JP4608983U JPS59150691U JP S59150691 U JPS59150691 U JP S59150691U JP 4608983 U JP4608983 U JP 4608983U JP 4608983 U JP4608983 U JP 4608983U JP S59150691 U JPS59150691 U JP S59150691U
Authority
JP
Japan
Prior art keywords
tanks
ships
freezing device
ice
seas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4608983U
Other languages
Japanese (ja)
Inventor
西本　綱徳
Original Assignee
日立造船株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立造船株式会社 filed Critical 日立造船株式会社
Priority to JP4608983U priority Critical patent/JPS59150691U/en
Publication of JPS59150691U publication Critical patent/JPS59150691U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の１実施例を示す横断面図、第２図は
回能の実施例を示す横断面図である。 Ｔ・・・・・・タンク、２．　４．　２２・・・・・２
・加熱流体区画、５．２３・・・・・・加熱装置、６．
２４・・・・・・循環管。FIG. 1 is a cross-sectional view showing one embodiment of this invention, and FIG. 2 is a cross-sectional view showing an embodiment of the invention. T...Tank, 2. 4. 22...2
- Heating fluid compartment, 5.23... Heating device, 6.
24...Circulation pipe.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] タンクＴ内の低温外気と接する部分に、該部分にそうよ
うに加熱流体区画２．　４．　２２が設けられるととも
に、その下部に加熱装置５．２３が配置せられ、加熱流
体区画２．　４．　２２の下部と同上部とをつなぐ循環
管６．２４が設けられた氷海船におけるタンクの凍結防
止装置。A heated fluid compartment 2. is placed in the part of the tank T that comes into contact with the cold outside air, so as to correspond to that part. 4. 22 and in the lower part of which a heating device 5.23 is arranged, the heated fluid compartment 2. 4. An anti-freeze system for tanks in ice-water vessels equipped with a circulation pipe 6.24 connecting the lower part of 22 and the upper part of the same.
JP4608983U 1983-03-29 1983-03-29 Anti-freezing device for tanks on ships in ice seas Pending JPS59150691U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4608983U JPS59150691U (en) 1983-03-29 1983-03-29 Anti-freezing device for tanks on ships in ice seas

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4608983U JPS59150691U (en) 1983-03-29 1983-03-29 Anti-freezing device for tanks on ships in ice seas

Publications (1)

Publication Number Publication Date
JPS59150691U true JPS59150691U (en) 1984-10-08

Family

ID=30176635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4608983U Pending JPS59150691U (en) 1983-03-29 1983-03-29 Anti-freezing device for tanks on ships in ice seas

Country Status (1)

Country Link
JP (1) JPS59150691U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8933369B2 (en) 2000-09-13 2015-01-13 Hamamatsu Photonics K.K. Method of cutting a substrate and method of manufacturing a semiconductor device
US8946589B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US8969761B2 (en) 2000-09-13 2015-03-03 Hamamatsu Photonics K.K. Method of cutting a wafer-like object and semiconductor chip
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

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