JPS59136955A - 熱伝導性電気絶縁シ−トの製造方法 - Google Patents
熱伝導性電気絶縁シ−トの製造方法Info
- Publication number
- JPS59136955A JPS59136955A JP1076483A JP1076483A JPS59136955A JP S59136955 A JPS59136955 A JP S59136955A JP 1076483 A JP1076483 A JP 1076483A JP 1076483 A JP1076483 A JP 1076483A JP S59136955 A JPS59136955 A JP S59136955A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- molecule
- silicone rubber
- boron nitride
- glass cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000203 mixture Substances 0.000 claims abstract description 13
- 239000011521 glass Substances 0.000 claims abstract description 11
- 229910052582 BN Inorganic materials 0.000 claims abstract description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 8
- 238000007259 addition reaction Methods 0.000 claims abstract description 4
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 4
- 125000003342 alkenyl group Chemical group 0.000 claims abstract 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000010292 electrical insulation Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000004744 fabric Substances 0.000 abstract description 10
- 239000002904 solvent Substances 0.000 abstract description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 238000001035 drying Methods 0.000 abstract description 5
- 239000004945 silicone rubber Substances 0.000 abstract description 3
- 229920001971 elastomer Polymers 0.000 abstract description 2
- 238000012644 addition polymerization Methods 0.000 abstract 3
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101000840258 Homo sapiens Immunoglobulin J chain Proteins 0.000 description 1
- 102100029571 Immunoglobulin J chain Human genes 0.000 description 1
- -1 Methyl hydrogen Chemical compound 0.000 description 1
- 206010073150 Multiple endocrine neoplasia Type 1 Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1076483A JPS59136955A (ja) | 1983-01-25 | 1983-01-25 | 熱伝導性電気絶縁シ−トの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1076483A JPS59136955A (ja) | 1983-01-25 | 1983-01-25 | 熱伝導性電気絶縁シ−トの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59136955A true JPS59136955A (ja) | 1984-08-06 |
| JPS6412099B2 JPS6412099B2 (enrdf_load_stackoverflow) | 1989-02-28 |
Family
ID=11759393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1076483A Granted JPS59136955A (ja) | 1983-01-25 | 1983-01-25 | 熱伝導性電気絶縁シ−トの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59136955A (enrdf_load_stackoverflow) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313505A (en) * | 1976-07-21 | 1978-02-07 | Takeshige Shimonohara | Retaining wall by assemblage |
| JPS5565533A (en) * | 1978-11-10 | 1980-05-17 | Denki Kagaku Kogyo Kk | Production of insulating radiator sheet |
| JPS5580461A (en) * | 1978-12-13 | 1980-06-17 | Shin Etsu Chem Co Ltd | Thermal conductive silicone rubber composition |
| JPS56161140A (en) * | 1980-05-16 | 1981-12-11 | Denki Kagaku Kogyo Kk | Manufacture of insulating heat radiating sheet |
| JPS5763246A (en) * | 1980-10-06 | 1982-04-16 | Denki Kagaku Kogyo Kk | Heat radiating sheet |
| JPS5847341A (ja) * | 1981-09-16 | 1983-03-19 | Nippon Telegr & Teleph Corp <Ntt> | 移動通信方式 |
| JPS6145325A (ja) * | 1984-08-10 | 1986-03-05 | Hitachi Ltd | プリント装置 |
-
1983
- 1983-01-25 JP JP1076483A patent/JPS59136955A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5313505A (en) * | 1976-07-21 | 1978-02-07 | Takeshige Shimonohara | Retaining wall by assemblage |
| JPS5565533A (en) * | 1978-11-10 | 1980-05-17 | Denki Kagaku Kogyo Kk | Production of insulating radiator sheet |
| JPS5580461A (en) * | 1978-12-13 | 1980-06-17 | Shin Etsu Chem Co Ltd | Thermal conductive silicone rubber composition |
| JPS56161140A (en) * | 1980-05-16 | 1981-12-11 | Denki Kagaku Kogyo Kk | Manufacture of insulating heat radiating sheet |
| JPS5763246A (en) * | 1980-10-06 | 1982-04-16 | Denki Kagaku Kogyo Kk | Heat radiating sheet |
| JPS5847341A (ja) * | 1981-09-16 | 1983-03-19 | Nippon Telegr & Teleph Corp <Ntt> | 移動通信方式 |
| JPS6145325A (ja) * | 1984-08-10 | 1986-03-05 | Hitachi Ltd | プリント装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6412099B2 (enrdf_load_stackoverflow) | 1989-02-28 |
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