JPS59136484A - 銅箔の粗面化処理方法 - Google Patents

銅箔の粗面化処理方法

Info

Publication number
JPS59136484A
JPS59136484A JP1178683A JP1178683A JPS59136484A JP S59136484 A JPS59136484 A JP S59136484A JP 1178683 A JP1178683 A JP 1178683A JP 1178683 A JP1178683 A JP 1178683A JP S59136484 A JPS59136484 A JP S59136484A
Authority
JP
Japan
Prior art keywords
metal foil
roughened
roughening treatment
copper foil
rolling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1178683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242022B2 (https=
Inventor
Takeshi Fukuda
健 福田
Tamio Mizutani
水谷　民穂
Yoshinao Sakamoto
坂本　善尚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Kinzoku Hakufun Kogyo Kk
Fukuda Metal Foil and Powder Co Ltd
Original Assignee
Fukuda Kinzoku Hakufun Kogyo Kk
Fukuda Metal Foil and Powder Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fukuda Kinzoku Hakufun Kogyo Kk, Fukuda Metal Foil and Powder Co Ltd filed Critical Fukuda Kinzoku Hakufun Kogyo Kk
Priority to JP1178683A priority Critical patent/JPS59136484A/ja
Publication of JPS59136484A publication Critical patent/JPS59136484A/ja
Publication of JPS6242022B2 publication Critical patent/JPS6242022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Metal Rolling (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
JP1178683A 1983-01-26 1983-01-26 銅箔の粗面化処理方法 Granted JPS59136484A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1178683A JPS59136484A (ja) 1983-01-26 1983-01-26 銅箔の粗面化処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1178683A JPS59136484A (ja) 1983-01-26 1983-01-26 銅箔の粗面化処理方法

Publications (2)

Publication Number Publication Date
JPS59136484A true JPS59136484A (ja) 1984-08-06
JPS6242022B2 JPS6242022B2 (https=) 1987-09-05

Family

ID=11787612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1178683A Granted JPS59136484A (ja) 1983-01-26 1983-01-26 銅箔の粗面化処理方法

Country Status (1)

Country Link
JP (1) JPS59136484A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897761A (en) * 1996-01-16 1999-04-27 Mitsui Mining & Smleting Co., Ltd. Electrodeposited copper foil for printed wiring board and method for manufacturing the same
JP2001234325A (ja) * 2000-02-28 2001-08-31 Nikko Materials Co Ltd パーティクルゲッター用高強度電解銅箔、該銅箔を内部に配設した薄膜形成装置及び該電解銅箔の製造方法
JP2008086999A (ja) * 2006-09-29 2008-04-17 Hitachi Cable Ltd 圧延銅箔及びその製造方法並びに圧延銅箔を用いたフレキシブルプリント基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116717A (ja) * 1981-12-29 1983-07-12 エルナ−株式会社 アルミニウム電極箔の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58116717A (ja) * 1981-12-29 1983-07-12 エルナ−株式会社 アルミニウム電極箔の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897761A (en) * 1996-01-16 1999-04-27 Mitsui Mining & Smleting Co., Ltd. Electrodeposited copper foil for printed wiring board and method for manufacturing the same
JP2001234325A (ja) * 2000-02-28 2001-08-31 Nikko Materials Co Ltd パーティクルゲッター用高強度電解銅箔、該銅箔を内部に配設した薄膜形成装置及び該電解銅箔の製造方法
JP2008086999A (ja) * 2006-09-29 2008-04-17 Hitachi Cable Ltd 圧延銅箔及びその製造方法並びに圧延銅箔を用いたフレキシブルプリント基板

Also Published As

Publication number Publication date
JPS6242022B2 (https=) 1987-09-05

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