JPS59119788A - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- JPS59119788A JPS59119788A JP22685682A JP22685682A JPS59119788A JP S59119788 A JPS59119788 A JP S59119788A JP 22685682 A JP22685682 A JP 22685682A JP 22685682 A JP22685682 A JP 22685682A JP S59119788 A JPS59119788 A JP S59119788A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- circuit board
- solder resist
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
この発明は、はんだレジスト膜を施す印刷回路基板に関
するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] This invention relates to a printed circuit board to which a solder resist film is applied.
従来の印刷回路基板に施されるはんだレジスト膜は、は
んだ接続が必要な導体部分を非塗布部とし、導体部分間
を接続する配線導体上は全てはんだレジスト膜が塗布さ
れているため、はんだレジスト膜の印刷ずれにより配線
導体端面が露出した場合、はんだ付時の加熱により溶融
した配線導体上のはんだメッキが、溶融時ｔこはんだレ
ジスト膜とはんだメッキ間に発生するガスの圧力により
、上記配線導体端面露出部より球状に噴き出し、導体間
隔が狭い場合は、この噴き出したはんだにより電気的に
短絡するという問題があった。The solder resist film applied to conventional printed circuit boards leaves the conductor parts that require solder connection uncoated, and the solder resist film is coated on all the wiring conductors that connect the conductor parts, so the solder resist film is not coated. If the end face of the wiring conductor is exposed due to misprinting of the film, the solder plating on the wiring conductor that is melted by heating during soldering will be damaged by the gas pressure generated between the solder resist film and the solder plating during melting. There was a problem that the solder spouted out in a spherical shape from the exposed portion of the end face of the conductor, and when the spacing between the conductors was narrow, the spouted solder caused an electrical short circuit.
これを具体的に図面を用いて以下説明する。This will be specifically explained below using the drawings.
第１図は、従来のはんだレジスト膜を施した印刷回路基
板の斜視図を、第２図は、上記印刷回路基板が、はんだ
付加熱時にはんだメッキ溶融物を球状に噴き出している
状態を示す斜視図を、第３図は、前記状態の断面図を示
す。印刷回路基板１の配線導体２上には、はんだメッキ
３が施され、更にこの上に、はんだ付着防止用のはんだ
レジスト膜４が施されており、一方はんだ付接続を必要
とする導体部５周辺には、はんだレジスト非塗布部７が
設けられており、はんだレジスト膜４の塗布時の装置ず
れにより、配線導体２の導体端面露出部６が、はんだレ
ジスト非塗布部７の外周に存在する。はんだ付加熱時、
はんだメッキ３は加熱により溶融し、はんだレジスト膜
４との間ζこ空隙８が発生し、この部分にガス圧力が発
生し溶融したはんだメツキロを押し流す力となり、導体
端面露出部６より球状にはんだ溶融物９を噴き出し、は
んだ付加熱終了と共に、導体端面露出部６にて凝固付着
する。Fig. 1 is a perspective view of a printed circuit board coated with a conventional solder resist film, and Fig. 2 is a perspective view showing the printed circuit board spewing out molten solder plating in a spherical shape when the solder is heated. FIG. 3 shows a sectional view of the above state. A solder plating 3 is applied to the wiring conductor 2 of the printed circuit board 1, and a solder resist film 4 for preventing solder adhesion is further applied to the wiring conductor 2 of the printed circuit board 1. On the other hand, a conductor portion 5 that requires soldering connection is applied. A solder resist non-applied area 7 is provided around the periphery, and due to device misalignment during application of the solder resist film 4, the conductor end face exposed portion 6 of the wiring conductor 2 exists on the outer periphery of the solder resist non-applied area 7. . When applying soldering heat,
The solder plating 3 is melted by heating, and a gap 8 is generated between it and the solder resist film 4. Gas pressure is generated in this part, which becomes a force that pushes away the molten solder, and the solder is spherically formed from the exposed part 6 of the conductor end surface. The molten material 9 is spouted out and solidified and adhered to the exposed portion 6 of the conductor end surface when the soldering heat is completed.
この発明の目的とするところは、上記のごとき従来の問
題点を除去するものであり、はんだ何時の加熱による配
線導体上のはんだメッキの溶融物が配線導体端面露出部
より球状に噴き出すことを防止する印刷回路基板を提供
することにある。The purpose of this invention is to eliminate the above-mentioned conventional problems, and to prevent the melted solder plating on the wiring conductor from spouting out in a spherical shape from the exposed end surface of the wiring conductor due to heating during soldering. The purpose of the present invention is to provide a printed circuit board that can be used.
この発明の特徴とするところは、配線導体端面からのは
んだメッキの球状溶融物の発生を防止するために、配線
導体上のはんだレジスト膜に断続的に非塗布部分を設け
、はんだ付加熱時のはんだレジスト膜と溶融はんだメッ
キ間に発生するガス圧力を放出可能としでいることであ
る０
〔発明の実施例〕
以下本発明の一実施例を図面を用いて詳細に説明する。The feature of this invention is that in order to prevent the generation of spherical melted solder plating from the end face of the wiring conductor, the solder resist film on the wiring conductor is provided with intermittent non-applied portions. It is possible to release the gas pressure generated between the solder resist film and the molten solder plating. [Embodiment of the Invention] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
第４図は、本発明の一実施例である印刷回路基板の斜視
図を示す。従来の印刷回路基板との相違点は、配線導体
２上に断続的に配置されたはんだレジスト非塗布部１０
を有することであり；はんだ付加熱時に、溶融したはん
だメッキ３とはんだレジスト膜４の間に発生した空隙８
内の゛カス圧力は、このはんだレジスト非塗布部１０よ
り放散し、導体端面露出部６よりの球状はんだ溶融物９
の発生を抑止することができる。FIG. 4 shows a perspective view of a printed circuit board that is an embodiment of the present invention. The difference from conventional printed circuit boards is that solder resist non-applied portions 10 are disposed intermittently on wiring conductors 2.
voids 8 generated between the molten solder plating 3 and the solder resist film 4 during soldering heat application;
The pressure inside the solder resist radiates from the solder resist non-applied area 10, and the spherical solder melt 9 from the conductor end face exposed area 6 is released.
can be prevented from occurring.
以上述べたごとき構成であるから、本発明にあたっては
、はんだ付加熱時、配線導体上に施されたはんだメッキ
が溶融し、導体端面露出部より球状はんだ溶融物と成り
噴き出し、Ｆｉ８接導接部体部気的に短絡することを防
止する効果が有る。Because of the configuration described above, in the present invention, when the solder is applied and heated, the solder plating applied on the wiring conductor melts and forms a spherical melted solder from the exposed portion of the conductor end face and gushes out from the exposed portion of the end surface of the conductor. It has the effect of preventing air short circuits in the body.
第１図は、従来のはんだレジスト膜を施した印刷回路基
板の斜視図、第２図は、第１図に示した印刷回路基板が
、はんだ付加熱時にはんだメッキ溶融物を球状に噴き出
している状態を示す斜視図、第３図は、前記状態の断面
図であ５第４図は、本発明の一実施例である印刷回路基
板の斜視図である。
１・・印刷回路基板、 ２・・・配線導体、３・
・・はんだメッキ、 ４・・・はんだレジスト膜
、５・・・導体部、 ６・導体端面露出部
、７・・・はんだレジスト非塗布部、
８・・空隙、 ９ はんだ溶融物、１０
・はんだレジスト非塗布部。Figure 1 is a perspective view of a printed circuit board coated with a conventional solder resist film, and Figure 2 shows the printed circuit board shown in Figure 1 spewing out molten solder plating in a spherical shape when soldering is heated. FIG. 3 is a sectional view of the state, and FIG. 4 is a perspective view of a printed circuit board according to an embodiment of the present invention. 1...Printed circuit board, 2...Wiring conductor, 3...
...Solder plating, 4.Solder resist film, 5.Conductor portion, 6.Conductor end face exposed portion, 7.Solder resist non-applied portion, 8.Gap, 9. Solder melt, 10
- Areas where solder resist is not applied.
Claims (1)
、はんだ付着防止のためはんだレジスト膜を施す印刷回
路基板において、前記はんだ付接続する導体部分間を電
気的に接続する配線導体上に断続的に配置したはんだレ
ジスト非塗布部を設けることにより、はんだ付時の加熱
により配線導体表面とはんだレジスト膜間で発生するガ
スを放出することを特徴とする印刷回路基板。In a printed circuit board where a solder resist film is applied to prevent solder adhesion, except for the conductor parts to which electrical component lead wires are soldered and connected, intermittent contact is applied to the wiring conductor that electrically connects the conductor parts to be soldered to each other. What is claimed is: 1. A printed circuit board characterized in that a solder resist-uncoated portion is provided to release gas generated between a wiring conductor surface and a solder resist film due to heating during soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22685682A JPS59119788A (en) | 1982-12-27 | 1982-12-27 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22685682A JPS59119788A (en) | 1982-12-27 | 1982-12-27 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59119788A true JPS59119788A (en) | 1984-07-11 |
Family
ID=16851636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22685682A Pending JPS59119788A (en) | 1982-12-27 | 1982-12-27 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119788A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6076064U (en) * | 1983-10-29 | 1985-05-28 | パイオニア株式会社 | printed board |
| WO2012120722A1 (en) * | 2011-03-09 | 2012-09-13 | 千代田電機工業株式会社 | Pressure vessel |
| US11368081B2 (en) | 2018-01-24 | 2022-06-21 | Kardion Gmbh | Magnetic coupling element with a magnetic bearing function |
| US11754075B2 (en) | 2018-07-10 | 2023-09-12 | Kardion Gmbh | Impeller for an implantable, vascular support system |
| US11944805B2 (en) | 2020-01-31 | 2024-04-02 | Kardion Gmbh | Pump for delivering a fluid and method of manufacturing a pump |
| US12005248B2 (en) | 2018-05-16 | 2024-06-11 | Kardion Gmbh | Rotor bearing system |
| US12064615B2 (en) | 2018-05-30 | 2024-08-20 | Kardion Gmbh | Axial-flow pump for a ventricular assist device and method for producing an axial-flow pump for a ventricular assist device |
-
1982
- 1982-12-27 JP JP22685682A patent/JPS59119788A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6076064U (en) * | 1983-10-29 | 1985-05-28 | パイオニア株式会社 | printed board |
| WO2012120722A1 (en) * | 2011-03-09 | 2012-09-13 | 千代田電機工業株式会社 | Pressure vessel |
| JP5865344B2 (en) * | 2011-03-09 | 2016-02-17 | チヨダエレクトリック株式会社 | Pressure vessel |
| US11368081B2 (en) | 2018-01-24 | 2022-06-21 | Kardion Gmbh | Magnetic coupling element with a magnetic bearing function |
| US11804767B2 (en) | 2018-01-24 | 2023-10-31 | Kardion Gmbh | Magnetic coupling element with a magnetic bearing function |
| US12005248B2 (en) | 2018-05-16 | 2024-06-11 | Kardion Gmbh | Rotor bearing system |
| US12064615B2 (en) | 2018-05-30 | 2024-08-20 | Kardion Gmbh | Axial-flow pump for a ventricular assist device and method for producing an axial-flow pump for a ventricular assist device |
| US11754075B2 (en) | 2018-07-10 | 2023-09-12 | Kardion Gmbh | Impeller for an implantable, vascular support system |
| US11944805B2 (en) | 2020-01-31 | 2024-04-02 | Kardion Gmbh | Pump for delivering a fluid and method of manufacturing a pump |
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