JPS59106131A - Sample carrying method - Google Patents
Sample carrying methodInfo
- Publication number
- JPS59106131A JPS59106131A JP21643682A JP21643682A JPS59106131A JP S59106131 A JPS59106131 A JP S59106131A JP 21643682 A JP21643682 A JP 21643682A JP 21643682 A JP21643682 A JP 21643682A JP S59106131 A JPS59106131 A JP S59106131A
- Authority
- JP
- Japan
- Prior art keywords
- air
- carrier
- samples
- receiving chamber
- automatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
Abstract
Description
【発明の詳細な説明】
(a) 発明の技術分野
本発明は集積回路基板等の試料を処理装置間に供給する
搬送方法に係9、特に外気に影響壬れない7^浄な雰囲
気内に収容し7、インライン方式等で構成される装置間
に供給する試料搬送方法に関する0
(b) 技術の背景
半導体フロセスにおいて、集積回路基板に施す各種の処
理は厳しい管埋条件のもとて各ね」の物理的、化学的処
理がなされ、高い信頼度が徴求される。1だ一方ではI
c、LSI寺の各戸F業分野への普及が拡大されるにつ
れて、生産は急増し、何組加工抄術6’−) M展に伴
い半導体ウニ/・の大口径化、冒集4JEz高密度化が
進むにつノア、て歩哨シの同上、あるいは品質維持のた
め自動化は半導体プロセスの必須の条件になりつ\ある
。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a transportation method for supplying a sample such as an integrated circuit board between processing devices9, particularly in a clean atmosphere that is not affected by outside air. (b) Background of the technology In semiconductor processing, various treatments performed on integrated circuit boards are performed under severe tube embedding conditions. ” physical and chemical treatments are performed, and a high degree of reliability is required. 1 on the other hand I
c. As the spread of LSI temples to each F industry field expanded, production rapidly increased, and with the M exhibition, the diameter of semiconductor uni/... became larger, and the 4JEz high density As technology advances, automation is becoming an essential condition for semiconductor processing in order to maintain quality.
(c) 従来技術と問題点
一般的なMO8ICの製造プロセスでは40から60工
程の処理が必璧であり、それら処理装置間の搬送が畑雑
となるため装置間の搬送自動化か近/4γ土目δ八てい
るO
ナレ送方法としては走行区IBコが限定される例えばベ
ル) ta送があシ、又は指定区間を自在に走行する自
走車1−があり、何れの編付も搬送域内の清浄15−か
必′;Aなものとなる。(c) Conventional technology and problems A typical MO8IC manufacturing process requires 40 to 60 processing steps, and transportation between these processing devices becomes a nuisance. There are two types of transport methods: one is limited to the running area (for example, Bell), and the other is a self-propelled vehicle that freely travels in a designated section. The area must be clean 15-A.
1〜かl、斤がら多棟多様の処理装飯を配設し、その間
にウェハが搬送されるようなIC工陽VLおいては大力
も模な清浄スペースが必要となり、清浄な雰囲気の空調
設置は費用が高み製品のコストアノグとなる。IC factory VL, which has a large number of buildings with various processing facilities and wafers are transported between them, requires a large amount of clean space, and requires air conditioning to create a clean atmosphere. Installation is expensive and increases the cost of the product.
処理装置−間f:被処理試料である半導体ウェハを供給
する搬送設つ11例えばエアベルト又はコンベアは大月
、模となりメカを主体とするため保守が容易でなく落下
等によシ破損する恐れがある。このだめ経済的な白妙1
化瞑伽で信頼性の切られる搬送方法がル」待される。Between processing equipment and f: Transport equipment for supplying semiconductor wafers, which are samples to be processed 11 For example, air belts or conveyors are mechanical, so maintenance is not easy and there is a risk of damage due to falls, etc. be. Konodame economical mystery 1
We are looking forward to a transportation method that will be less reliable in the future.
(d) 発明の目的
本発明i−i上記の点に鑑み、自動化された処理装置間
に被処理試料を目#J伽送するに有効な搬送車を氏供し
、史にf蔽送車自体に苗昂空[b]を−ル成する機能を
持たせることにより、自動化設備の経済化を計ることを
目的とする。(d) Object of the Invention The present invention ii In view of the above points, a transport vehicle effective for transporting a sample to be processed between automated processing devices is provided, and the transport vehicle itself is The purpose is to make automated equipment more economical by giving it the ability to create a Miao Kong air [b] rule.
(e) 発明の編成
上記目的は本発明によれは、処理装置間を該処理装置6
″によって処理される試料を搬送する方θミにおいて、
該試料を収容する収容室と、該収谷岸に気体を供給する
送風部と該気体の条件を制(財)する空調部を備えた搬
送車を用いて該処理装置間の該試料の搬送を行なうこと
によって達ぜらfLる。(e) Organization of the invention According to the present invention, the above object is achieved by connecting processing devices 6 to 6.
In the way of transporting the sample to be processed by
Transporting the sample between the processing devices using a transport vehicle equipped with a storage chamber that accommodates the sample, a blower unit that supplies gas to the collection bank, and an air conditioning unit that controls the conditions of the gas. By doing this, we can reach fL.
(f) 発明の実施例
」−ソ、下本発明の実施例を図[nIによりiト述する
。(f) Embodiments of the Invention - Embodiments of the present invention will be described below with reference to Figures [nI].
第1図は自動化された谷秒の処理・装置をイノライン方
式で連結した叛施例全示すイ’i4 j反履、第2図は
本づ(5明の一ソL施匈」で凌2る1」妬娘送車をボす
構成し1、第3図は本ろ1−明の一列施191である自
動振込車のtl)肺ごブロック図−〇ある。Figure 1 shows all the examples of automated processing and equipment connected in the Innoline system. Figure 3 is a block diagram of an automatic transfer car, which is a 191 block diagram of the main line.
図において午へq体つェハ%の試料を加エタ、↓珪する
一谷イ2すの自Iトり処理装置1−1〜7会−処理する
工り呈j胆にイへって1已設し各装置f;i: 1:4
1にレール8をW父眩し連結する。レール8は固定化ひ
?Lず、レイアウトに比、じて自由に≦艮更可能なフレ
キシビリテイを耘)らこのレール8」二を第2図で示−
3−口直1鉛り因斯−13が疋イ丁し[]I上1j:
5HQ込J1弓3の、慟る切れ15に俯え/−1己号受
イ日4νにノリ処理装置1へ〜7101を移動及c”
f’i’ 」J:するものでイアる。In the figure, a sample of q body % is processed, ↓ Ichitani is processed, and the processing equipment 1-1 to 7 is shown. 1 unit installed and each device f;i: 1:4
Connect rail 8 to 1. Is rail 8 fixed? This rail 8'' is shown in Fig. 2, with the flexibility to change it freely according to the layout.
3-Kuchi straight 1 lead reason-13 is 疋I-cho [] I upper 1j:
5 HQ included J1 bow 3, look down at 15 in the middle of the day/-1 self-signed date 4ν, move ~7101 to the nori processing device 1 and c”
f'i' J: I'm angry at what I do.
白層・11に送国1.13の払込は矢づバッテリ電ωで
駆ありする駆虫!J昔1キりを設け、レール8」二をノ
厄、音i〕に俯えた隼*s、14にfシ走行し、その移
動停止はリモコンお4作又は走行センサーの仁号受信に
よって行なわれる。フィルター10aを介して外気を取
入れる壁調部10は外気を定温、定湿度に保ち、隣接す
る送風部11より一定温湿良に換気÷わ、たエアを上方
に送り込み、フィルタ層11′を介してiA、料収容室
12に供給される。このように試料収容室12をクリー
ンル−ムにする朴I造としたものである。この試料収容
室12に被処理試料を収容し自動給材伝梧−(図示せず
)により各装置に結材及び再ひ収容し、次工程にjb1
次館送するものである。The payment of 1.13 to send to the white layer 11 is deworming with Yazu battery electric ω! The Hayabusa looks down at the rail 8'' and the second is no misfortune, sound i], runs f on 14, and stops its movement by using the remote control or by receiving the signal from the running sensor. It will be done. The wall control section 10 that takes in outside air through the filter 10a maintains the outside air at a constant temperature and humidity, and sends air upward from the adjacent ventilation section 11 at a constant temperature and humidity, dividing the air into the filter layer 11'. iA is supplied to the food storage chamber 12 through the iA. In this way, the sample storage chamber 12 is constructed as a clean room. The sample to be processed is stored in this sample storage chamber 12, and is bound and reloaded into each device by an automatic material feeder (not shown), and transferred to the next process.
This will be sent to the next library.
各処理装置′の処理1I−6,間を略同時Vこ管理すれ
icl処理効率にし更に向上する。By managing the processes 1I-6 of each processing device' almost simultaneously, the ICL processing efficiency is further improved.
このように試料収容水12をクリーンエリアとすること
によシ各装ビニを設置する空間はI’!i易的な防塵室
ですむから従来のような犬μ;、模空調設備は大幅に紋
>Uさえ1.る大きな効果がある。By making the sample storage water 12 a clean area in this way, the space for installing each container is reduced to I'! Because it only requires a simple dust-proof room, the air-conditioning equipment is significantly smaller than the conventional one. It has a big effect.
しかも鉛相は人為的妥素荀含まない光全自”yb万式で
あるから商品Hの安定した製品が得られ生連性も向上す
る。自動振3六車13の機能は第3図に示すように外気
はコンブレノザー15を介[2て冷却コイル16.加熱
コイル17で構成される空調部(第2図10参照)を経
由して込JK機18によυ試料収容室(第2図12)に
フィルタ一層11′を介して尋人される。Furthermore, since the lead phase is fully automatic and does not contain any artificial elements, a stable product of Product H can be obtained and the production continuity will be improved.The functions of the automatic vibration 3-wheel 13 are shown in Figure 3. As shown in FIG. ) through the filter layer 11'.
フィルター74tt’と加熱コイル17間に温湿度調節
様19を備えて一定の温湿製となるよう構成される。A temperature/humidity adjustment member 19 is provided between the filter 74tt' and the heating coil 17 to maintain constant temperature and humidity.
(!j) 発明の効果
以j: irl’ホiilに説明したように本発明の目
動輸送方法とすることによシ従来に比して経爵的な目動
化力・司fjヒとなり化層効率は向上し高い(m頼性が
得らi%る等大きな先・朱がある。(!j) Effects of the invention: As explained in the previous section, by using the moving transportation method of the present invention, it is possible to achieve more efficient moving power and transportation than in the past. The layering efficiency is improved and high (m reliability is obtained, i%, etc.), and there is a large tip and vermilion.
紀1図は目動化された各柚の処理装kkインライン方式
で連絡した実施例を示すイイリ成図、第2図は本丸明の
一実施例である自動霜送車を示す構成図、第3図は本発
明の一実施例である自動鈑送車の機能ブロック図である
。
図+1〜7・・処理装置、8・・・レール、9・・・駆
動部、10・・・空調部、11・・・送風車、12・・
・試料収容室、13・・・自動碗送車、14・・・知輪
、15・・・コンブレノザー、16−N却コイル、17
・・加熱コイル、18・・・送FA機、19・・温湿度
al’:Iアiii機O[−]Figure 1 is a complete diagram showing an example of an in-line system for processing each citrus fruit that has been visualized. FIG. 3 is a functional block diagram of an automatic sheet transport vehicle that is an embodiment of the present invention. Figures 1 to 7: Processing device, 8: Rail, 9: Drive section, 10: Air conditioning section, 11: Blower, 12...
・Sample storage room, 13...Automatic bowl transport, 14...Chiwa, 15...Combre noser, 16-N coil, 17
... Heating coil, 18... FA machine, 19... Temperature and humidity al': I III machine O [-]
Claims (1)
方法において、該試料を収容する収容室と、該収容室に
気体を供給する送風部と該気体の条件を割引jする空調
部を備えた搬送車を用いて該処理装置間の該試料の搬送
を行なうように(7たことを特徴とする試料搬送方法。A method for transporting a sample to be processed by the process between processing apparatuses, comprising a storage chamber for accommodating the sample, a blower section for supplying gas to the storage chamber, and an air conditioning section for discounting the conditions of the gas. 7. A sample transport method characterized in that the sample is transported between the processing apparatuses using a transport vehicle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21643682A JPS59106131A (en) | 1982-12-10 | 1982-12-10 | Sample carrying method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21643682A JPS59106131A (en) | 1982-12-10 | 1982-12-10 | Sample carrying method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59106131A true JPS59106131A (en) | 1984-06-19 |
Family
ID=16688516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21643682A Pending JPS59106131A (en) | 1982-12-10 | 1982-12-10 | Sample carrying method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59106131A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02153546A (en) * | 1988-03-31 | 1990-06-13 | N M B Semiconductor:Kk | Semiconductor dust-free manufacturing system |
-
1982
- 1982-12-10 JP JP21643682A patent/JPS59106131A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02153546A (en) * | 1988-03-31 | 1990-06-13 | N M B Semiconductor:Kk | Semiconductor dust-free manufacturing system |
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