JPS59105392A - Semiconductor laser device - Google Patents

Semiconductor laser device

Info

Publication number
JPS59105392A
JPS59105392A JP21389682A JP21389682A JPS59105392A JP S59105392 A JPS59105392 A JP S59105392A JP 21389682 A JP21389682 A JP 21389682A JP 21389682 A JP21389682 A JP 21389682A JP S59105392 A JPS59105392 A JP S59105392A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
receiving element
photo receiving
fixed
heat block
element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21389682A
Inventor
Hisatoshi Uchida
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02236Mounts or sub-mounts
    • H01S5/02248Mechanically integrated components on a mount or an optical microbench, e.g. optical components, detectors, etc.
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01SDEVICES USING STIMULATED EMISSION
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068Stabilisation of laser output parameters
    • H01S5/0683Stabilisation of laser output parameters by monitoring the optical output parameters

Abstract

PURPOSE:To prevent the damage of a photo receiving element so that the stress due to stem deformation is not directly applied on the photo receiving element by a method wherein a semiconductor laser element and the photo receiving element are respectively fixed opposite to a heat block of an L-shaped structure. CONSTITUTION:The semiconductor laser element 4 radiating a laser light 5 from the upper and lower ends is fixed, at the center upper edge of the vertical wall of the heat block 2, via a sub mount 3. The horizontal surface part of the heat block 2 continuous to the vertical wall is provided with an inclined surface 7 for mounting the photo receiving element. The photo receiving element 6 is fixed on this mounting surface 7. This mounting surface 7 is inclined at a several degree angle, in order to prevent the reflection and the advancement forward of the laser light 5 which reaches the photo receiving element 6, and, the heat block surface is so made rough that the irregular reflection of the laser light 5 occurs. On the other hand, two leads 8 are fixed by penetration to the stem 1 via an insulator 9. Thus, the photo receiving element 6 is fixed to the stem 1 via the thick and strongly-built heat block 2, therefore the rigidity of supporting the photo receiving element is large, and the element is not damaged by the warpage of the stem 1 at the time of working.
JP21389682A 1982-12-08 1982-12-08 Semiconductor laser device Pending JPS59105392A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21389682A JPS59105392A (en) 1982-12-08 1982-12-08 Semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21389682A JPS59105392A (en) 1982-12-08 1982-12-08 Semiconductor laser device

Publications (1)

Publication Number Publication Date
JPS59105392A true true JPS59105392A (en) 1984-06-18

Family

ID=16646803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21389682A Pending JPS59105392A (en) 1982-12-08 1982-12-08 Semiconductor laser device

Country Status (1)

Country Link
JP (1) JPS59105392A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679979A (en) * 1996-05-21 1997-10-21 Weingand; Christopher Dirk Surface mount package with heat transfer feature
KR100994735B1 (en) 2008-07-02 2010-11-16 주식회사 코스텍시스 a semiconductor laser diode package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679979A (en) * 1996-05-21 1997-10-21 Weingand; Christopher Dirk Surface mount package with heat transfer feature
KR100994735B1 (en) 2008-07-02 2010-11-16 주식회사 코스텍시스 a semiconductor laser diode package

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