JPS59101842A - Resin sealing metal mold - Google Patents

Resin sealing metal mold

Info

Publication number
JPS59101842A
JPS59101842A JP21194982A JP21194982A JPS59101842A JP S59101842 A JPS59101842 A JP S59101842A JP 21194982 A JP21194982 A JP 21194982A JP 21194982 A JP21194982 A JP 21194982A JP S59101842 A JPS59101842 A JP S59101842A
Authority
JP
Japan
Prior art keywords
lead
resin
resin sealing
projections
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21194982A
Other languages
Japanese (ja)
Inventor
Takashi Kawashima
河島　高志
Moriaki Hori
堀　盛明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP21194982A priority Critical patent/JPS59101842A/en
Publication of JPS59101842A publication Critical patent/JPS59101842A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0038—Moulds or cores; Details thereof or accessories therefor with sealing means or the like
    • B29C33/0044—Moulds or cores; Details thereof or accessories therefor with sealing means or the like for sealing off parts of inserts projecting into the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To prevent the generation of resin bur particularly at lead parts by forming the structure of the surface pressure part of a resin sealing metal mold into uneven form so that load is applied only on the leads. CONSTITUTION:The surface pressure part 18 has projections 181 and recesses 182 composed by alternate repetition. In a cross-section C of a resin sealed lead frame, the numeral 31 represents a lead frame, 32 a resin part, 33 leads, and regions 34 shown by oblique lines 34 regions pressed by the projections 181. By positioning the projections 181 with respect to each lead 33 in such a manner, the generation of bur from the oblique line part 34 is blocked by applying a pressure larger than conventional at the center of the lead 33. Further, in the Fig. A, the projections 181 of the resin sealing metal mold 15 of the upper mold are positioned on the leads 33, and thus the pressing on the leads 33 is increased. In the Fig. B, the projections 181 are positioned onto the midpoint in the longitudinal direction of the lead 33, and then the pressing at the center of the lead 33 is further increased.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は半導体製造工程の樹脂封止工程で用いられる
パリの発生を防止することができる樹脂封止用金型に関
する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a mold for resin encapsulation which is used in a resin encapsulation process of a semiconductor manufacturing process and is capable of preventing the occurrence of paris.

〔発明の技術的背景〕[Technical background of the invention]

第１図に従来の樹脂封止用金型の斜視図を示している。 FIG. 1 shows a perspective view of a conventional resin sealing mold.

第１図（Ａ）は下型の樹脂封止用金型、第１図（Ｂ）は
上型の樹脂封止用金型の斜視図である。第１図（Ａ）に
おいて、１１は下型の樹脂封止用金型本体、１２は溶融
された樹脂が流入して蓄められるキャピテイである。こ
こで、溶融された樹脂はランナＩ３、ゲート１４を介し
て上記キャビティ１２に流入する。FIG. 1(A) is a perspective view of the lower mold for resin sealing, and FIG. 1(B) is a perspective view of the upper mold for resin sealing. In FIG. 1(A), 11 is a lower mold body for resin sealing, and 12 is a cavity into which molten resin flows and is stored. Here, the molten resin flows into the cavity 12 via the runner I3 and the gate 14.

また、第１図（Ｂ）は上型の樹脂封止用金型の斜視図で
ある。第１図０）において、１５は上屋の樹脂封止用金
型本体、１６はエアーベント、１７は面圧逃げ用溝、１
８は面圧部である。Moreover, FIG. 1(B) is a perspective view of the upper mold for resin sealing. In Fig. 10), 15 is the mold body for resin sealing of the shed, 16 is an air vent, 17 is a surface pressure relief groove, 1
8 is a surface pressure part.

そして、実際に樹脂封止を行なう場合には第２図に示す
ように樹脂封止用金型１１上に上型の樹脂封止用金型１
５を載置し、キャビティ１２の位置にリードフレーム１
９を位置させて上型の樹脂封止用金型１５を加圧する。When resin sealing is actually performed, the upper resin sealing die 1 is placed on the resin sealing die 11 as shown in FIG.
5 and place the lead frame 1 at the position of the cavity 12.
9 and pressurizes the upper resin sealing mold 15.

この加圧した状態で′は上型の樹脂封止用金型１５と下
型の樹脂封止用金型１１間のすき間ａはリードフレーム
１９の厚さよシも小さくしている。このようにして、キ
ャビティ１２内に流入された樹脂が外部にもれて、パリ
となることを防いでいる。In this pressurized state, the gap a between the upper resin sealing mold 15 and the lower resin sealing mold 11 is made smaller than the thickness of the lead frame 19. In this way, the resin that has flowed into the cavity 12 is prevented from leaking to the outside and becoming stale.

そして、第３図は樹脂封止が終了したリードフレームを
示す図である。同図において、１９はリードフレームで
、２０はキャビティ１２に流入した樹脂である。FIG. 3 is a diagram showing the lead frame after resin sealing. In the figure, 19 is a lead frame, and 20 is resin that has flowed into the cavity 12.

〔背景技術の問題点〕[Problems with background technology]

従来の樹脂封止においては、面圧部１８によシ、キャビ
ティ１２から出ているリードフレーム１９を押えつけて
、樹脂の流出を防止していた。ここで、面圧部１８は第
１図（Ｂ）に示したように樹脂２０の長手方向に対して
リードの有る無しにかかわらず、面圧をかけていた。こ
のように、均一に面圧をかけている場合、金型の精度に
バラツキがあった場合には樹脂パリが出てはいけないリ
ード２１面の圧力が小さくなシ、最も樹脂パリが発生し
てはいけないリード２１のところに、樹脂注入圧によシ
樹脂パリが発生してしまうという事態が発生していた。In conventional resin sealing, the lead frame 19 protruding from the cavity 12 is pressed by the contact pressure portion 18 to prevent the resin from flowing out. Here, as shown in FIG. 1(B), the surface pressure section 18 applied surface pressure to the resin 20 in the longitudinal direction regardless of whether there were leads or not. In this way, when surface pressure is applied uniformly, resin flash should not occur if there are variations in the precision of the mold.Resin flash is most likely to occur when the pressure on the lead 21 surface is small. A situation has occurred where resin injection pressure causes resin cracks to occur at the lead 21, which should not be used.

〔発明の目的〕[Purpose of the invention]

この発明は上記の点に鑑みてなされたもので、その目的
は樹脂封止用金型の形状を変更して加圧をリード面の特
定部にかけるようにして特にリード部における樹脂パリ
の発生を防止するようにした樹脂封止用金型を提供する
ことにある。This invention has been made in view of the above points, and its purpose is to change the shape of the mold for resin sealing so as to apply pressure to specific parts of the lead surface, thereby preventing the occurrence of resin flakes, especially in the lead parts. An object of the present invention is to provide a mold for resin sealing that prevents this.

〔発明の概要〕[Summary of the invention]

樹脂封止用金型の面圧部の構造をリードのところのみ加
重がか＼るように凹凸状にしている。The surface pressure part of the resin sealing mold has an uneven structure so that the load is applied only to the leads.

〔発明の実施例〕[Embodiments of the invention]

以下、図面を参照してこの発明の一実施例を説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

第４図は樹脂封止用金型の斜視図である。第４図は上型
の樹脂封止用金型で、第１図伯）に示した従来のものと
は面圧部１８が凹凸に形成されているところが本願発明
の特徴となっている。第４図において第１図（Ｂ）と同
一名称には同一番号を付することにする。FIG. 4 is a perspective view of the resin sealing mold. FIG. 4 shows an upper mold for resin sealing, and the present invention is different from the conventional mold shown in FIG. In FIG. 4, the same names as in FIG. 1(B) are given the same numbers.

次に、第５図に第４図の面圧部１８の凹凸状態を拡大し
た図を示しておく。つまシ、第５図に示すように面圧部
１８は凸部１８１及び凹部１８２を交互に〈シ返し構成
されている。このような凸部１８１にリードフレームの
リード部が位置するようにして加圧を増している。Next, FIG. 5 shows an enlarged view of the uneven state of the surface pressure portion 18 shown in FIG. 4. As shown in FIG. 5, the surface pressure portion 18 is configured such that convex portions 181 and concave portions 182 are alternately turned. Pressure is increased by positioning the lead portion of the lead frame on such a convex portion 181.

次に、第６図を用いてこの発明に係る樹脂封止用金型を
用いて樹脂封止する場合について説明する。第６図（勾
は同図（Ｃ）のＡ−Ａ′断面図、第６図ω）は同図（Ｃ
）のＢ　−Ｂ’断面図を示す図、第６図（Ｃ）は樹脂封
止されたリードフレームの断面図を示している。第６図
（Ｃ）において３１はリードフレーム、３２は樹脂部、
３３はリードである。Next, the case of resin sealing using the resin sealing mold according to the present invention will be described using FIG. 6. Figure 6 (gradient is A-A' cross-sectional view of Figure (C), Figure 6 ω) is
), and FIG. 6(C) shows a cross-sectional view of a resin-sealed lead frame. In FIG. 6(C), 31 is a lead frame, 32 is a resin part,
33 is the lead.

また、斜線３４で示した領域は第５図に示した凸部１８
１によシ抑圧されてい名領域を示している。このように
して各リード３３に対して第５図に示した凸部１８１を
位置づけることによシ、リード３３の中心部に従来より
も大きい圧力を加えて斜線３４からのパリの発生を阻止
している。さらに詳細に説明すると、第６図（４）にお
いて、上型の樹脂封止用金型１５の凸部１８１はリード
３３上に位置されるようになる。これによシ、リード３
３への加圧を高めている。また、第６図の）において、
上記凸部１８１はリード３３の長手方向の迩中まで位置
している。このことによシ、一層リード３３の中心部の
加圧を高めている。Furthermore, the area indicated by diagonal lines 34 is the convex portion 18 shown in FIG.
1 shows the suppressed area. By positioning the convex portion 181 shown in FIG. 5 with respect to each lead 33 in this manner, a greater pressure than before is applied to the center of the lead 33, thereby preventing the generation of paris from the diagonal line 34. ing. More specifically, in FIG. 6(4), the convex portion 181 of the upper resin sealing mold 15 is positioned on the lead 33. Good luck with this, lead 3
The pressure on 3 is increasing. In addition, in ) of Fig. 6,
The convex portion 181 is located up to the middle of the lead 33 in the longitudinal direction. This further increases the pressure at the center of the lead 33.

〔発明の効果〕〔Effect of the invention〕

以上詳述したようにこの発明によれば、樹脂封止用金型
の面圧部を凹凸状にしたので樹脂封止時リードフレーム
のリード部に加わる圧力を従来よシも増加させることが
できるので、リード面へのパリの発生をなくすことがで
きる。一方、リード面の第６図（Ｃ）に示した斜線３４
部周辺にパリが発生したとしても中心部まで出て来なけ
れば後の工程にて除去が容易である。As detailed above, according to the present invention, since the surface pressure portion of the mold for resin sealing is made uneven, the pressure applied to the lead portion of the lead frame during resin sealing can be increased compared to the conventional method. Therefore, generation of paris on the lead surface can be eliminated. On the other hand, the diagonal line 34 shown in FIG. 6(C) on the lead surface
Even if pari occurs around the part, it can be easily removed in a later process if it does not extend to the center.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（４）は従来の下型の樹脂封止用金型の斜視図、
第１図（Ｂ）は従来の上型の樹脂封止用金型の斜視図、
第２図は樹脂封止の様子を示す図、第３図は樹脂封止が
終了した様子を示す図、第４図はこの発明の一実施例を
示す樹脂封止用金型の斜視図、第５図は第４図における
面圧部の詳細な斜視図、第６図（４）は同図（Ｃ）のＡ
−Ａ’断面図、第６図（Ｂ）は同図（Ｃ）のＢ　−Ｂ’
断面図、第６図（Ｃ）は樹脂封止されたリードフレーム
の断面図である。 １１・・・下型の樹脂封止用金型本体、１２・・・キャ
ビティ、１６・・・エアーベント、１７−・・面圧逃げ
用溝、１８・・・面圧部。 出願人代理人　　弁理士　鈴　江　武　彦第１図 第２図 ９ 第３図 第４図FIG. 1 (4) is a perspective view of a conventional lower mold for resin sealing;
FIG. 1(B) is a perspective view of a conventional upper mold for resin sealing;
FIG. 2 is a diagram showing a state of resin sealing, FIG. 3 is a diagram showing a state of completed resin sealing, and FIG. 4 is a perspective view of a mold for resin sealing showing an embodiment of the present invention. Fig. 5 is a detailed perspective view of the contact pressure part in Fig. 4, and Fig. 6 (4) is A of the same figure (C).
-A' sectional view, Figure 6 (B) is B -B' of the same figure (C)
6C is a cross-sectional view of a resin-sealed lead frame. DESCRIPTION OF SYMBOLS 11-- Lower mold body for resin sealing, 12-- Cavity, 16-- Air vent, 17-- Surface pressure escape groove, 18-- Surface pressure portion. Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 2 Figure 9 Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims] 上下の樹脂封止用金型からなる樹脂封止用金型において
、上下の樹脂封止用金型の少なくともいずれか一方の面
圧部を凹凸状にしたことを特徴とする樹脂封止用金型。A resin encapsulation mold consisting of an upper and a lower resin encapsulation mold, characterized in that a surface pressure portion of at least one of the upper and lower resin encapsulation molds has an uneven shape. Type.
JP21194982A 1982-12-02 1982-12-02 Resin sealing metal mold Pending JPS59101842A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21194982A JPS59101842A (en) 1982-12-02 1982-12-02 Resin sealing metal mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21194982A JPS59101842A (en) 1982-12-02 1982-12-02 Resin sealing metal mold

Publications (1)

Publication Number Publication Date
JPS59101842A true JPS59101842A (en) 1984-06-12

Family

ID=16614360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21194982A Pending JPS59101842A (en) 1982-12-02 1982-12-02 Resin sealing metal mold

Country Status (1)

Country Link
JP (1) JPS59101842A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5898216A (en) * 1995-11-14 1999-04-27 Sgs-Thomson Microelectronics S.A. Micromodule with protection barriers and a method for manufacturing the same
JP2007296954A (en) * 2006-04-28 2007-11-15 Toyota Motor Corp Support portion variable structure of vehicular seat
US9555724B2 (en) 2011-10-05 2017-01-31 Nhk Spring Co., Ltd. Vehicle seat

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5898216A (en) * 1995-11-14 1999-04-27 Sgs-Thomson Microelectronics S.A. Micromodule with protection barriers and a method for manufacturing the same
US6071758A (en) * 1995-11-14 2000-06-06 Sgs-Thomson Microelectronics S.A. Process for manufacturing a chip card micromodule with protection barriers
JP2007296954A (en) * 2006-04-28 2007-11-15 Toyota Motor Corp Support portion variable structure of vehicular seat
US9555724B2 (en) 2011-10-05 2017-01-31 Nhk Spring Co., Ltd. Vehicle seat

Similar Documents

Publication Publication Date Title
JPS59101842A (en) Resin sealing metal mold
JP3727446B2 (en) Resin sealing mold for semiconductor devices
JP4106844B2 (en) Gate break method for lead portion of resin-encapsulated semiconductor device
JP3159808B2 (en) Method for manufacturing semiconductor device
JP2572841Y2 (en) Mold for resin sealing used in the manufacture of semiconductor devices
JP2984082B2 (en) Resin sealing method
JP2648353B2 (en) Lead frame manufacturing method
JP3207552B2 (en) Resin mold and method of manufacturing the same
JPH06216178A (en) Molding die for resin-sealed semiconductor device
JPS5923554A (en) Lead frame for semiconductor device
JPS5932139A (en) Mold for sealing semiconductor with resin
JP2716252B2 (en) Method for manufacturing semiconductor device
JPH0358452A (en) Resin-sealed semiconductor device
JPS5921050A (en) Manufacture of semiconductor device
JPS6237119A (en) Molding mold and molding method
JPS6232622A (en) Resin-sealed metal mold for semiconductor device
JPS61144033A (en) Method of molding resin for sealing semiconductor device
JPS5932138Y2 (en) Resin molding equipment for semiconductor devices
JPH05335442A (en) Resin molding method for semiconductor
JPH0319229Y2 (en)
JPH058106Y2 (en)
JP2930769B2 (en) Mold and lead frame
JPH02148744A (en) Mold die for resin-sealed semiconductor
JPS6298733A (en) Resin sealing metallic mold for semiconductor device
JPH0864751A (en) Manufacture of lead frame