JPS5897843U - Cooling structure for flat semiconductor devices - Google Patents
Cooling structure for flat semiconductor devicesInfo
- Publication number
- JPS5897843U JPS5897843U JP19350581U JP19350581U JPS5897843U JP S5897843 U JPS5897843 U JP S5897843U JP 19350581 U JP19350581 U JP 19350581U JP 19350581 U JP19350581 U JP 19350581U JP S5897843 U JPS5897843 U JP S5897843U
- Authority
- JP
- Japan
- Prior art keywords
- flat semiconductor
- cooling structure
- semiconductor devices
- cooling
- cooling body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の冷却構造を有する平形半導体素子の正面
図、第２図はその側面図、第３［ｆｆｌは本考案の実施
例による冷却構造を有する平形半導体素 チの正面図
、゛第４図はその側面図、第５図は平形半導体素子スタ
ックの斜視図である。
１・・・平形半導体素子、２・・・冷却体、３・・・ク
ランプ装置、４・・・クランプ装置、５・・・絶縁枠。FIG. 1 is a front view of a flat semiconductor device having a conventional cooling structure, FIG. 2 is a side view thereof, and FIG. 3 is a front view of a flat semiconductor device having a cooling structure according to an embodiment of the present invention. 4 is a side view thereof, and FIG. 5 is a perspective view of the flat semiconductor element stack. DESCRIPTION OF SYMBOLS 1... Flat semiconductor element, 2... Cooling body, 3... Clamp device, 4... Clamp device, 5... Insulating frame.
Claims (1)
にねじ込むクランプ装置にて素子の他端を押え込み、素
子と冷却体とを一体に組合わせたことを特徴とする平形
半導体素子の冷却構造。Cooling of a flat semiconductor element, characterized in that a cooling body is brought into contact with one end of the flat semiconductor element, and the other end of the element is held down by a clamp device that is screwed into the cooling body, so that the element and the cooling body are combined into one body. structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19350581U JPS5897843U (en) | 1981-12-25 | 1981-12-25 | Cooling structure for flat semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19350581U JPS5897843U (en) | 1981-12-25 | 1981-12-25 | Cooling structure for flat semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5897843U true JPS5897843U (en) | 1983-07-02 |
Family
ID=30106857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19350581U Pending JPS5897843U (en) | 1981-12-25 | 1981-12-25 | Cooling structure for flat semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5897843U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5446480A (en) * | 1977-08-24 | 1979-04-12 | Siemens Ag | Semiconductor |
-
1981
- 1981-12-25 JP JP19350581U patent/JPS5897843U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5446480A (en) * | 1977-08-24 | 1979-04-12 | Siemens Ag | Semiconductor |
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