JPS5887353U - 半導体パツケ−ジ用蓋 - Google Patents

半導体パツケ−ジ用蓋

Info

Publication number
JPS5887353U
JPS5887353U JP1981183362U JP18336281U JPS5887353U JP S5887353 U JPS5887353 U JP S5887353U JP 1981183362 U JP1981183362 U JP 1981183362U JP 18336281 U JP18336281 U JP 18336281U JP S5887353 U JPS5887353 U JP S5887353U
Authority
JP
Japan
Prior art keywords
semiconductor package
package lid
lid
lid attachment
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981183362U
Other languages
English (en)
Inventor
大施戸　治郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1981183362U priority Critical patent/JPS5887353U/ja
Publication of JPS5887353U publication Critical patent/JPS5887353U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の蓋を示す斜視図、第２図はパッケージに
第１図の蓋を取り付けた状態の断面図、第３図はこの考
案の一実施例を示す斜視図、第４図は第３図の蓋を取り
付けた状態の断面図である。 ′　図中、２はパッケージ本体、３は半導体装置、４は
蓋付面、５は金属ろう材、６は蓋付部、１０は蓋である
。なお、図中の同一符号は同一または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体パッケージをシールする蓋において、非金属材料
    を使用し、蓋付部または蓋付面金面にメタライズを施し
    たことを特徴とする半導体パッケージ用蓋。
JP1981183362U 1981-12-08 1981-12-08 半導体パツケ−ジ用蓋 Pending JPS5887353U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981183362U JPS5887353U (ja) 1981-12-08 1981-12-08 半導体パツケ−ジ用蓋

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981183362U JPS5887353U (ja) 1981-12-08 1981-12-08 半導体パツケ−ジ用蓋

Publications (1)

Publication Number Publication Date
JPS5887353U true JPS5887353U (ja) 1983-06-14

Family

ID=29982553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981183362U Pending JPS5887353U (ja) 1981-12-08 1981-12-08 半導体パツケ−ジ用蓋

Country Status (1)

Country Link
JP (1) JPS5887353U (ja)

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