JPS5884951A - Electrical contact material - Google Patents

Electrical contact material

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Publication number
JPS5884951A
JPS5884951A JP56184626A JP18462681A JPS5884951A JP S5884951 A JPS5884951 A JP S5884951A JP 56184626 A JP56184626 A JP 56184626A JP 18462681 A JP18462681 A JP 18462681A JP S5884951 A JPS5884951 A JP S5884951A
Authority
JP
Japan
Prior art keywords
alloy
matrix
electrical contact
weight
contact material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56184626A
Other languages
Japanese (ja)
Inventor
Sankichi Shinoda
信太 三「よし」
Yasuhiro Ogawa
泰弘 小川
Akiyoshi Takeshima
竹島 明美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56184626A priority Critical patent/JPS5884951A/en
Publication of JPS5884951A publication Critical patent/JPS5884951A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To obtain an electrical contact material having superior characteristics by dispersing specified amounts of Bi2O3 and ZnO in an Ag-Cu alloy matrix or by further dispersing an oxide such as In2O3. CONSTITUTION:Bi and Zn are added to Ag so that 0.5-3wt% Bi and 0.5-5wt% Zn are contained finally, or 0.5-2wt% In is further added. They are melted and sprayed with compressed gaseous nitrogen to form alloy powder. By heating the powder in an oxidizing atmosphere. Bi, Zn and In in the alloy are oxidized selectively and preferentially to Bi2O3, ZnO and In2O3. Ag-Cu alloy powder contg. Cu in Ag so that 1-10wt% Cu is contained finally is prepared and mixed with said Ag powder contg. the dispersed oxides, and the mixture is molded and sintered to manufacture an electrical contact material contg. Bi2O3, ZnO and In2O3 dispersed in the Ag-Cu matrix contg. Cu dispersed in the Ag matrix.

Description

【発明の詳細な説明】 本発明はムq合金マトリクスに金属酸化物を分散した複
合接点材料に関するもので、突入電流が〜3oム、定常
電流が〜3ム程度までの交流(ムC)負荷を開閉するス
ライドスイッチに用いて好適な電気接点材料を提供する
ものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite contact material in which metal oxides are dispersed in a MQ alloy matrix, and the present invention relates to a composite contact material having a metal oxide dispersed in a MQ alloy matrix. The present invention provides an electrical contact material suitable for use in slide switches that open and close.

金属酸化物を利用した複合接点材料としては、ムq−O
clO接点材料が広く利用され、近時においては、五g
  8n02系材料なども利用されるようになって来た
Muq-O is a composite contact material using metal oxides.
ClO contact materials are widely used, and recently 5g
8n02-based materials have also come into use.

しかるに、近年、電子機器用の各種スイッチにおいては
、安全上の規制に伴なう接触信頼性の改善あるいは使い
易さの面から、軽操作性、小型化などが要求され、スラ
イドスイッチ形式によシ数ム程度までの負荷を開閉する
傾向が見られるようになって来た。その結果、スライド
スイッチ用接点材料として多用されて来たばね材1例え
ばυん育銅(Sn7〜9重量%、Po、03〜0.35
重量%、残部Cu )にAgを2〜10μの厚さで張り
合わせた材料においては、アークによる消耗により十分
な寿命特性が得られない状況を呈している。
However, in recent years, various switches for electronic devices have been required to be easier to operate and more compact in order to improve contact reliability in accordance with safety regulations and to improve ease of use. A trend has been seen in which the load is switched on and off to the extent of several centimeters. As a result, spring materials 1, which have been widely used as contact materials for slide switches, such as υn grown copper (Sn7-9% by weight, Po, 03-0.35
In the case of a material in which Ag is laminated to a thickness of 2 to 10 μm to (% by weight, balance Cu), sufficient life characteristics cannot be obtained due to wear due to arcing.

一方、アーク消耗に対しては、前述のムq −CdO。On the other hand, for arc consumption, the above-mentioned Muq-CdO.

ムg −5n02系の材料が望ましいのであるが、機械
的な摺動特性に問題があり、かつまた、スライドスイッ
チ用材料として用いる場合、ばね材に張如合わせ、これ
を圧延加工等により所望の厚さに加工するが、この点に
難点が認められた。
Mug-5n02 type material is desirable, but it has problems with mechanical sliding properties, and when used as a material for slide switches, it is stretched to a spring material and rolled to the desired shape. Although it was processed to a certain thickness, this point was found to be difficult.

本発明は上記した点に鑑みて成されたものであり、基本
的には、五g−Cu合金より成るマトリクスにBi2O
,を主要成分とする酸化物を分散した材料を提供し、ス
ライドスイッチの特性を改良しようとするものである0 すでに本願出願人は、ムクマトリクス中にBi2O5の
他にznO2In2OSなどの酸化物を分散した材料を
提案して来た。これらの材料は、ムg−ccto  な
どと同様に耐溶着性およびアーク消耗に対しては優れた
特性を示すが、摺動特性には必ずしも満足の得られる傾
向を示すものではない。さらにまた、ばね材に容易に張
シ合わせることが可能な材料でもない。しかし他面にお
いては、CdOに比較して蒸気圧の低い酸化物から構成
されていることから張シ合わせ時の接合層の欠陥発生が
少ないこと、あるいは酸化物としては硬度が低いBi2
O,5、ZnOを含むものであるととるから、比較的良
好な加工性が得られ、延展がある程度可能である等の長
所がある◇ 本発明者らは、かかる特質を有する材料について、摺動
特性の改良方策、ばね材に対する張シ合わせ方策および
スライドスイッチ用材料として必要十分なアーク特性の
保持について検討した結果ムクマトリクスにOu を添
加し、ムg−Cu合金マトリクスとし、これにBi2O
5およびZnOを分散するか、あるいはさらにIn2O
5を加えて分散した材料によって所期の目的を達成し得
ることを見い出した0 次に、本発明に係る上記材料について詳述する。
The present invention has been made in view of the above points, and basically, Bi2O is added to a matrix made of a 5g-Cu alloy.
The present applicant has already dispersed oxides such as znO2In2OS in addition to Bi2O5 in a mucous matrix to improve the characteristics of slide switches by providing a material in which oxides having , as the main components, are dispersed. He suggested the material. Although these materials exhibit excellent properties in terms of welding resistance and arc wear similar to MuG-CCTO, they do not necessarily exhibit satisfactory sliding properties. Furthermore, it is not a material that can be easily stretched to a spring material. However, on the other hand, since it is composed of an oxide with a lower vapor pressure than CdO, there are fewer defects in the bonding layer during bonding, or Bi2 has a low hardness as an oxide.
Since it contains O, 5, and ZnO, it has advantages such as relatively good workability and a certain degree of spreadability. As a result of the study on improvement measures for spring materials, tension adjustment measures for spring materials, and maintenance of arc characteristics necessary and sufficient as a material for slide switches, O was added to the Mug-Cu alloy matrix, and Bi2O was added to the Mug-Cu alloy matrix.
5 and ZnO or further In2O
It has been found that the desired object can be achieved by a material dispersed with the addition of 0.Next, the above-mentioned material according to the present invention will be described in detail.

本発明の電気接点材料はムg −Cu合金マトリクス中
にBiとZnの酸化物を含有する0これらの酸化物は複
合化しBi!Znア0(但し、” p Vは整数)の形
となっている。そして、旧とznの組成比率によってB
iの酸化物Bi2O3あるいはZnの酸化物ZnOを含
有する。さらに、特にアークによる消耗を少なくするた
めには、上記酸化物の他にIn の酸化物In2O5が
添加される。
The electrical contact material of the present invention contains oxides of Bi and Zn in a Mug-Cu alloy matrix.These oxides are composited into Bi! ZnA0 (however, "pV" is an integer).Then, depending on the composition ratio of old and Zn, B
It contains an oxide Bi2O3 of i or an oxide ZnO of Zn. Furthermore, in order to particularly reduce wear due to arcing, In2O5, an oxide of In, is added in addition to the above-mentioned oxides.

本発明の電気接点材料は上述の如き構成のものであるが
、これら構成素材の含有量は材料の金属元素全体の重量
比で、五g −Cu合金マトリクスのOuが1〜10重
量%、各酸化物が金属換算値でBio、5〜3重量%、
Zn o、s 〜5重量%、そしてムqが残部であるO
Inの酸化物を加える場合は上記に金属換算値で0.5
〜2重量%の量が添加される〇 本発明の電気接点材料において、ムq合金マトリクスを
構成するムg−Ou合金は、先にも記したように、スラ
イドスイッチ用として摺動特性、を向上させ、機械的摩
耗の減少、凝着の防止、摩擦力の低減などに効果を示す
。加えてばね材に張り合わせる場合、通常熱圧着法が取
られるが、酸化物含有材料は圧着力が弱く、その後の圧
延工程などにおいて接着層が剥離することが見られる。
The electrical contact material of the present invention has the above-mentioned structure, and the content of these constituent materials is 1 to 10% by weight of O in the 5g-Cu alloy matrix, based on the weight ratio of all metal elements in the material. The oxide is Bio in metal equivalent value, 5 to 3% by weight,
Zn o,s ~ 5% by weight, and the balance is O
When adding In oxide, add 0.5 to the above value in terms of metal.
In the electrical contact material of the present invention, the Mg-Ou alloy constituting the Mq alloy matrix has good sliding properties for use in slide switches, as described above. It is effective in reducing mechanical wear, preventing adhesion, and reducing frictional force. In addition, when bonding to a spring material, a thermocompression bonding method is usually used, but oxide-containing materials have a weak bonding force, and the adhesive layer often peels off during the subsequent rolling process.

ここでは、接合金属層としてIn層あるいはIn層とC
u層を本発明の接点材料とばね材間に挿入し本発明のマ
) IJクス合金との間に生ずるムg −Cu−Inの
共晶溶融によって接合金属層を液相拡散させ、欠陥の少
ない接着層を得ている。ムq合金マ) IJクス中のC
u添加量の下限は上述の効果を引き出すための最少量に
よって決められる。他方、その上限は機械的加工能によ
って、あるいは接触抵抗特性によって制限を受ける。
Here, the bonding metal layer is an In layer or an In layer and C
The U layer is inserted between the contact material of the present invention and the spring material, and the bonding metal layer is liquid-phase diffused by the eutectic melting of Mug-Cu-In that occurs between the IJ alloy and the IJ alloy of the present invention, thereby eliminating defects. Obtaining less adhesive layer. Muq alloy ma) C in IJ
The lower limit of the amount of u added is determined by the minimum amount to bring out the above effects. On the other hand, its upper limit is limited by mechanical processability or contact resistance characteristics.

次に、本発明材の電気接点材料に含まれる酸化物につい
て説明する。主たる酸化物として含まれ本のはBiとZ
nの酸化物である。これらの酸化物は、例えばB14B
Zn+Oys などのように複合化した酸化物を一部形
成するが、大部分は単独の形において存在、している。
Next, the oxide contained in the electrical contact material of the present invention will be explained. The main oxides contained are Bi and Z.
It is an oxide of n. These oxides are, for example, B14B
Although it forms some complex oxides such as Zn+Oys, most of it exists in a single form.

複合化した酸化物は、融点が760℃内外まで低下して
来る。そして、後述するごとく本材料は焼結法によって
一部作製するが、この時粉体粒子間の焼結性を高める働
きを示す。
The melting point of the composite oxide decreases to around 760°C. As will be described later, this material is partially produced by a sintering method, and at this time it exhibits a function of increasing the sinterability between powder particles.

一方、単独で存在しているBi2O5の酸化物は微量の
他の酸化物を含むことによりて、γ−Bi2O3となっ
て融点が上昇し1ooo℃内外に昇華点を持つ材料とな
り、接点の溶着に対し改善効果を示す。
On the other hand, the Bi2O5 oxide that exists alone becomes γ-Bi2O3 when it contains a small amount of other oxides, and its melting point rises, making it a material with a sublimation point around 100°C, which is suitable for welding of contacts. It shows the improvement effect.

しかしながら、B i 203 単独においては十分な
アーク消耗に対する耐力が得られないので、ZnOの添
加が必要とされる。そして、よシアーク消耗を少なくす
るとすれば、ZnOよシさらに温度に対して安定なI 
n 205の酸化物の添加が望まれる。
However, B i 203 alone does not provide sufficient resistance to arc wear, so ZnO is required to be added. If the shear arc consumption is to be reduced, I
Addition of n 205 oxide is desired.

ムg−Ou合金マトリクス中に、上記Bi 、 Zn 
In the Mug-Ou alloy matrix, the above Bi, Zn
.

Inの酸化物を分散させる手法としては、ムqにBi 
、 Zn、さらにはInを添加した合金粉を作り、これ
を酸化雰囲気中にて加熱してBi 、 Zn 、 In
を選択的に酸化させる、いわゆる内部酸化法を取シ、内
部酸化合金粉とし、これに別途作製したムq−Ou粉を
加えて均質に混合し、さらに成形、焼結しマトリクス中
にOuを拡散させてムg−Cu合金マトリクスを得、こ
れに酸化物を分散した構成とする。
As a method of dispersing In oxide, Bi is added to the muq.
, Zn, and In are added, and this is heated in an oxidizing atmosphere to form Bi, Zn, and In.
We use the so-called internal oxidation method, which selectively oxidizes O, to form an internal oxidation alloy powder, add separately prepared Muq-Ou powder, mix homogeneously, and then shape and sinter to form Ou in the matrix. A Mug-Cu alloy matrix is obtained by diffusion, and an oxide is dispersed therein.

このような手法、構成によって作製する材料において、
酸化物に転化させる金属元素の組成比は上述の如き条件
下で求めら゛れたもので、Bi、Zn。
In materials produced by such methods and configurations,
The composition ratios of the metal elements to be converted into oxides were determined under the conditions described above, and were Bi and Zn.

Inの各最少量は、本発明にかかる材料の目的とした用
途に対して、添加効果の認められる下限であシ、各最多
量は、ばね材に対する張シ合わせの可能性ある込は圧延
やスライドスイッチ接点としての曲げ打抜きなどの加工
性の面よシ制限を受ける量である。
Each minimum amount of In is the lower limit at which the addition effect is recognized for the intended use of the material according to the present invention, and each maximum amount is a rolling or This is an amount that is subject to limitations in terms of workability such as bending and punching for slide switch contacts.

以上説明した本発明の電気接点材料について、よシ具体
的に実施例にもとづいて説明する。
The electrical contact material of the present invention described above will be explained in more detail based on Examples.

本発明の組成にしたがってムg、Cu、Bi、Zn。Mug, Cu, Bi, Zn according to the composition of the invention.

Inを合量500g秤量する。Agは酸化物として転化
されるBL、ZnおよびIn のいずれもが同容し得る
量と残部マトリクス用Cuとの合金用に分ける。例えば
、表に示す試料屋6の可動接点用材料の場合、マトリク
スは5重量%のCuを含むムg−Ou合金でこの中に金
属換算として、0.5重量%のBi、1.5重量%のZ
n、2重量%のrnを含むものであるから、夫々の秤量
値はBi 2.5 (J、Zn 7.5 g、酸化物用
としてIn10g、マトリクス用トしてCu26q、ム
g456gの計5009とする。ここで、ムg465g
のうち260qを分離して、これにB12.s g 、
 Zn 7.5 g 、 In10qを加えて溶解し、
内部酸化合金用粉体を作製するために、加圧窒素ガスに
よる溶湯噴霧装置にて粉化し、6o〜326メツシユ程
度の合金粉体゛とする。この粉体は700’Cの温度で
60時間大気中にて加熱処理されて、ムqマトリクス中
にBi 、 Zn 、 Inなどが選択的に酸化された
内部酸化合金粉となる。他方、ムqの残部205qとマ
トリクス用Cu 25 <iは、同様に溶解後、溶湯噴
霧装置によってムg−Ou合金粉とされる。以上は屋6
の試料を例として述べたが他の試料についても大略同様
に行われる。これらの粉体は均質に混合されたのち、3
 Q rn7’m径の円筒型に装填され、4トン/cd
の加圧力で成型される。成型されたビレットは、窒素ガ
ス雰囲気にて650℃〜800℃で焼結される。なお、
この場合マトリクス部分の流出が生ずるので温度上昇勾
配に配慮し、内部酸化粉マトリクス中にOuの拡散が行
なわれるようにする。このように焼結されたビレットは
、次に、450℃8)ン/ tJの条件にて再度成型さ
れたのち、前回と同様の条件にて焼結熱処理される。
A total of 500 g of In is weighed. Ag is divided into an amount that can contain the same amounts of BL, Zn, and In, which are converted as oxides, and an alloy with Cu for the remaining matrix. For example, in the case of the material for the movable contact of sample shop 6 shown in the table, the matrix is a Mug-Ou alloy containing 5% by weight of Cu, which contains 0.5% by weight of Bi and 1.5% by weight in terms of metal. %Z
n and 2% by weight of rn, the respective weighing values are Bi 2.5 (J, Zn 7.5 g, In for oxide 10 g, Cu for matrix 26 q, Mug 456 g, totaling 5009. .Here, 465g of mug
Of this, 260q was separated and B12. s g,
Add and dissolve 7.5 g of Zn and 10q of In,
In order to produce a powder for an internally oxidized alloy, the powder is pulverized using a molten metal spraying device using pressurized nitrogen gas to obtain an alloy powder of approximately 60 to 326 mesh. This powder is heat-treated in the air at a temperature of 700'C for 60 hours to form an internally oxidized alloy powder in which Bi, Zn, In, etc. are selectively oxidized in the muq matrix. On the other hand, the remaining portion 205q of Muq and Cu 25 <i for matrix are similarly melted and then turned into Mug-Ou alloy powder by a molten metal spraying device. The above is 6
Although the above sample was described as an example, the process is roughly the same for other samples as well. After these powders were mixed homogeneously, 3
Q rn Loaded into a cylinder with a diameter of 7'm, 4 tons/cd
It is molded with a pressure of The molded billet is sintered at 650°C to 800°C in a nitrogen gas atmosphere. In addition,
In this case, the matrix portion will flow out, so consideration should be given to the temperature increase gradient so that O diffuses into the internal oxidized powder matrix. The billet sintered in this way is then molded again at 450°C and 8) m/tJ, and then subjected to sintering heat treatment under the same conditions as before.

そしてこの焼結体は、550〜eoo℃の温間押出しに
よって、30 m/m径から、幅20 m/m 。
This sintered body is produced by warm extrusion at 550 to eoo°C to have a diameter of 30 m/m and a width of 20 m/m.

厚さ3m/m の板状に加工される。さらに、冷間圧延
によって1m/mの厚さまで圧延したのち、表面をスコ
ッチブライトによシ研摩清浄にする。
It is processed into a plate shape with a thickness of 3m/m2. Further, after cold rolling to a thickness of 1 m/m, the surface is polished and cleaned using Scotchbrite.

他方、ばね材の素材として厚さ9 m/m 、幅30m
/m  の8重量%Snりん青銅板を準備し、その表面
を同じくスコッチブライトで研摩し、電解脱脂洗浄した
のち片面にCuめりきを10〜20μの厚さで施す。さ
らにCjuめっき上にInめっきを10〜20μ施す。
On the other hand, the spring material is 9 m/m thick and 30 m wide.
An 8 wt. % Sn phosphor bronze plate of 8 wt. Further, 10 to 20 μm of In plating is applied on the Cju plating.

なお、CuめっきはマトリクスのCu組成が8%以上の
場合省略できる。そして、先に加工した1 m/r!L
厚の酸化物−19合金板をInめっき面に重ね合わせ、
耐熱治具により密着させたのち、窒素ガス雰囲気中65
0℃〜760℃にて1時間熱処理し圧着する。この時C
u 、 Inの各めっき層は液相拡散するがムg−Cu
マトリクス中のCUと相乗作用を示し、欠陥の少ない接
合状態が得られる。最後に、この接合材を焼鈍と圧延を
繰返すことにより厚さ70μまで加工する。
Note that Cu plating can be omitted if the Cu composition of the matrix is 8% or more. And the 1 m/r that was processed earlier! L
Layer a thick oxide-19 alloy plate on the In plated surface,
After adhering with a heat-resistant jig, 65°C in a nitrogen gas atmosphere.
Heat treatment is performed at 0°C to 760°C for 1 hour and pressure bonding is performed. At this time C
Each of the plating layers of u and In undergoes liquid phase diffusion, but the plating layers of Mug-Cu
It exhibits a synergistic effect with CU in the matrix, resulting in a bonded state with fewer defects. Finally, this bonding material is processed to a thickness of 70 μm by repeating annealing and rolling.

上述の如くにして得られた素材はスライドスイッチの可
動側接点として成形加工され、特性評価と供された。な
お、試験用スライドスイッチの固”定側接点としては、
厚さ0.6m、4の黄銅板に2μ厚さのムqめつきを施
した材料を用い、また、通常スライドスイッチに使用さ
れる合成油による接点潤滑剤をムqめつき面に塗布した
。特性の比較試料として、可動接点に厚さTμのムqを
張り合わせた総厚70μによるりん青銅接点、固定側接
点に上述と同一の材料、潤滑剤を用いたスライドスイッ
チを準備した。
The material obtained as described above was molded into a movable contact of a slide switch, and its characteristics were evaluated. In addition, the fixed side contact of the test slide switch is as follows:
A 0.6m thick, 4mm brass plate with 2μ thick matting was used, and contact lubricant made from synthetic oil, which is normally used for slide switches, was applied to the mating surface. . As samples for comparison of characteristics, we prepared a phosphor bronze contact with a total thickness of 70μ, in which the movable contact was laminated with muq of thickness Tμ, and a slide switch using the same material and lubricant as above for the fixed contact.

スイッチの評価はコンデンサ負荷とし、ムC30V、定
常3ム、インラッシュ30ムの負荷回路を2万回開閉し
、その後の接触抵抗、接点の消耗状態を観察することに
より行った。その結果を茨表に示すO (以下余白) 表の結果から明らかなように、本発明に係る電気接点材
料は、動作試験後においても実用上十分な特性を示して
いる。また、材料の消耗、摩耗が少ないことはスイッチ
接点間の絶縁性の向上に結びつき、安全上においても好
ましい傾向を示す。
The switch was evaluated by opening and closing a load circuit with a capacitor load of 30V, steady state of 3V, and inrush of 30V 20,000 times, and then observing the contact resistance and the state of contact wear. The results are shown in the thorn table (blank below). As is clear from the results in the table, the electrical contact material according to the present invention exhibits practically sufficient characteristics even after the operation test. In addition, less consumption and wear of materials leads to improved insulation between switch contacts, which is favorable from a safety standpoint.

他方、現在広く利用されているムq単独材の場合は、試
料&8に示すようにアーク消耗により、ばね材であるり
ん青銅面が露出し、一部のものについてはりん青銅面に
孔が発生したものもある。
On the other hand, in the case of MQ single material, which is currently widely used, the phosphor bronze surface of the spring material is exposed due to arc consumption, as shown in sample &8, and in some cases, holes are formed on the phosphor bronze surface. Some did.

以上説明したように、本発明の電気接点材料はスライド
スイッチの開閉負荷をアーク発生領域まで拡大すること
を可能とする趣のであり、その実用的価値は極めて高い
ものである。
As explained above, the electrical contact material of the present invention is intended to make it possible to extend the switching load of a slide switch to the arc generation region, and its practical value is extremely high.

Claims (1)

【特許請求の範囲】[Claims] (1)  Ouを1〜10重量%含み、残部がムqより
なるムq合金マトリクスに、金属酸化物を金属換算値に
して、Biを0.5〜3重量%、Znを0.5〜6重量
%含んでなることを特徴とする電気接点材料。 @)  Ouを1〜10重量%含み、残部がムqよりな
るムq合金マ) IJクスに、金属酸化物を金属換算値
にして、Biを0.6〜3重量%、Znを3.5〜6重
量%、Inを0.6〜2重量%含んでなることを特徴と
する電気接点材料。
(1) In a MQ alloy matrix containing 1 to 10% by weight of O and the remainder being MQ, 0.5 to 3% by weight of Bi and 0.5 to 3% of Zn are added in terms of metal oxides. An electrical contact material comprising 6% by weight. @) Muq alloy containing 1 to 10% by weight of Ou and the remainder being Muq) In an IJ box, the metal oxide is converted to a metal equivalent value, Bi is 0.6 to 3% by weight, and Zn is added to 3.0% by weight. An electrical contact material comprising 5 to 6% by weight of In and 0.6 to 2% by weight of In.
JP56184626A 1981-11-17 1981-11-17 Electrical contact material Pending JPS5884951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56184626A JPS5884951A (en) 1981-11-17 1981-11-17 Electrical contact material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56184626A JPS5884951A (en) 1981-11-17 1981-11-17 Electrical contact material

Publications (1)

Publication Number Publication Date
JPS5884951A true JPS5884951A (en) 1983-05-21

Family

ID=16156521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56184626A Pending JPS5884951A (en) 1981-11-17 1981-11-17 Electrical contact material

Country Status (1)

Country Link
JP (1) JPS5884951A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7876017B2 (en) * 2005-05-12 2011-01-25 Mabuchi Motor Co., Ltd. Commutator and brush materials for small electric motor, clad composite material, and small electric DC motor using the same
WO2019181649A1 (en) * 2018-03-19 2019-09-26 日本電産株式会社 Electrical contact powder, electrical contact material, electrical contact, and method for producing electrical contact powder
WO2019181650A1 (en) * 2018-03-19 2019-09-26 日本電産株式会社 Electrical contact powder, electrical contact material, electrical contact, and method for producing electrical contact powder

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7876017B2 (en) * 2005-05-12 2011-01-25 Mabuchi Motor Co., Ltd. Commutator and brush materials for small electric motor, clad composite material, and small electric DC motor using the same
WO2019181649A1 (en) * 2018-03-19 2019-09-26 日本電産株式会社 Electrical contact powder, electrical contact material, electrical contact, and method for producing electrical contact powder
WO2019181650A1 (en) * 2018-03-19 2019-09-26 日本電産株式会社 Electrical contact powder, electrical contact material, electrical contact, and method for producing electrical contact powder

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