JPS5866333A - Washing tank - Google Patents

Washing tank

Info

Publication number
JPS5866333A
JPS5866333A JP16480381A JP16480381A JPS5866333A JP S5866333 A JPS5866333 A JP S5866333A JP 16480381 A JP16480381 A JP 16480381A JP 16480381 A JP16480381 A JP 16480381A JP S5866333 A JPS5866333 A JP S5866333A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
holes
phi
z1
provided
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16480381A
Other versions
JPS6242374B2 (en )
Inventor
Itaru Yamanaka
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Abstract

PURPOSE:To efficiently wash by a method wherein opening areas are changed in accordance with the surface length in the flowing direction of a washing solution for a washed substance and holes are provided on a plate controlling the flow of washing solution. CONSTITUTION:For example, 3mm.phi holes 61 and 4mm.phi holes 62 are provided on the area xXy of a baseplate 41 conforming to the region existing a discoid Si substrate 1. The distance of the surface in parallel with the flowing direction of wash water is long at the center Z1 and short at the periphery Z2. The maximum holes 62 are provided just under Z1. Holes 63 are 2.5mm.phi holes for introducing solution. This constitution increases flowing amount at the central section of the substrate 1 and permits efficient and rational washing. When a water current is sufficiently strong, the appreciable volume of water is obtained by providing a small hole meeting a feedwater port 5 at the center 64 of the baseplate 41. The same effect is obtained by providing holes having the same opening area with high density at the vicinity of the region 65 just under the Z1.
JP16480381A 1981-10-14 1981-10-14 Expired JPS6242374B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16480381A JPS6242374B2 (en) 1981-10-14 1981-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16480381A JPS6242374B2 (en) 1981-10-14 1981-10-14

Publications (2)

Publication Number Publication Date
JPS5866333A true true JPS5866333A (en) 1983-04-20
JPS6242374B2 JPS6242374B2 (en) 1987-09-08

Family

ID=15800215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16480381A Expired JPS6242374B2 (en) 1981-10-14 1981-10-14

Country Status (1)

Country Link
JP (1) JPS6242374B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5503171A (en) * 1992-12-26 1996-04-02 Tokyo Electron Limited Substrates-washing apparatus
US5590672A (en) * 1992-09-25 1997-01-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor cleaning apparatus and wafer cassette
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6431184B1 (en) 1997-08-05 2002-08-13 Tokyo Electron Limited Apparatus and method for washing substrate
US6539963B1 (en) * 1999-07-14 2003-04-01 Micron Technology, Inc. Pressurized liquid diffuser

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5590672A (en) * 1992-09-25 1997-01-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor cleaning apparatus and wafer cassette
US5503171A (en) * 1992-12-26 1996-04-02 Tokyo Electron Limited Substrates-washing apparatus
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6431184B1 (en) 1997-08-05 2002-08-13 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6276378B1 (en) 1997-08-18 2001-08-21 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6539963B1 (en) * 1999-07-14 2003-04-01 Micron Technology, Inc. Pressurized liquid diffuser
US6647996B2 (en) 1999-07-14 2003-11-18 Micron Technology, Inc. Method of diffusing pressurized liquid
US6672319B2 (en) 1999-07-14 2004-01-06 Micron Technology, Inc. Pressurized liquid diffuser
US6860279B2 (en) 1999-07-14 2005-03-01 Micron Technology, Inc. Pressurized liquid diffuser

Also Published As

Publication number Publication date Type
JPS6242374B2 (en) 1987-09-08 grant

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