JPS5856499A - 厚膜回路基板の製造方法 - Google Patents

厚膜回路基板の製造方法

Info

Publication number
JPS5856499A
JPS5856499A JP15517381A JP15517381A JPS5856499A JP S5856499 A JPS5856499 A JP S5856499A JP 15517381 A JP15517381 A JP 15517381A JP 15517381 A JP15517381 A JP 15517381A JP S5856499 A JPS5856499 A JP S5856499A
Authority
JP
Japan
Prior art keywords
conductor
thick film
hole
circuit board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15517381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6364918B2 (forum.php
Inventor
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP15517381A priority Critical patent/JPS5856499A/ja
Publication of JPS5856499A publication Critical patent/JPS5856499A/ja
Publication of JPS6364918B2 publication Critical patent/JPS6364918B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP15517381A 1981-09-30 1981-09-30 厚膜回路基板の製造方法 Granted JPS5856499A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15517381A JPS5856499A (ja) 1981-09-30 1981-09-30 厚膜回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15517381A JPS5856499A (ja) 1981-09-30 1981-09-30 厚膜回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5856499A true JPS5856499A (ja) 1983-04-04
JPS6364918B2 JPS6364918B2 (forum.php) 1988-12-14

Family

ID=15600087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15517381A Granted JPS5856499A (ja) 1981-09-30 1981-09-30 厚膜回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5856499A (forum.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61189696A (ja) * 1985-02-18 1986-08-23 新光電気工業株式会社 多層セラミツク配線基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467673A (en) * 1977-11-09 1979-05-31 Hitachi Ltd Connector for multilayer print board
JPS5585097A (en) * 1978-12-22 1980-06-26 Fujitsu Ltd Method of fabricating multilayer circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5467673A (en) * 1977-11-09 1979-05-31 Hitachi Ltd Connector for multilayer print board
JPS5585097A (en) * 1978-12-22 1980-06-26 Fujitsu Ltd Method of fabricating multilayer circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61189696A (ja) * 1985-02-18 1986-08-23 新光電気工業株式会社 多層セラミツク配線基板の製造方法

Also Published As

Publication number Publication date
JPS6364918B2 (forum.php) 1988-12-14

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