JPS5851458U - Cooling system - Google Patents

Cooling system

Info

Publication number
JPS5851458U
JPS5851458U JP1981146070U JP14607081U JPS5851458U JP S5851458 U JPS5851458 U JP S5851458U JP 1981146070 U JP1981146070 U JP 1981146070U JP 14607081 U JP14607081 U JP 14607081U JP S5851458 U JPS5851458 U JP S5851458U
Authority
JP
Japan
Prior art keywords
heat exchanger
cooling device
compressor
fluid tank
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981146070U
Other languages
Japanese (ja)
Inventor
良裕 和智
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1981146070U priority Critical patent/JPS5851458U/en
Publication of JPS5851458U publication Critical patent/JPS5851458U/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Conductors (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、従来の冷却装置の流れ系統図、第2図は、本
考案による冷却装置の一実施例を示す、流れ系統図であ
る。 4・・・圧縮機、5・・・熱交換器、6・・・超電導機
器、7・・・低温流体槽、14・・・弁。
FIG. 1 is a flow diagram of a conventional cooling device, and FIG. 2 is a flow diagram of an embodiment of the cooling device according to the present invention. 4...Compressor, 5...Heat exchanger, 6...Superconducting equipment, 7...Low temperature fluid tank, 14...Valve.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)圧縮機より熱交換器を介して冷却媒体を超電導機
器へ供給するものにおい正、超電神器を冷却し昇温した
冷却媒体を冷却する低温流体槽を前記熱交換器及び圧縮
機を連通ずる流路の一部に介在させるとともに、低温流
体槽より生ずる蒸発低温気体を前記熱交換器内へ貫流さ
せたことを特徴とする冷却装置。
(1) Cooling medium is supplied from the compressor to the superconducting equipment via the heat exchanger. 1. A cooling device, characterized in that the cooling device is interposed in a part of the communicating flow path, and the evaporated low-temperature gas generated from the low-temperature fluid tank is made to flow through into the heat exchanger.
(2)低温流体槽と圧縮機間に熱交換器を通さないバイ
パスを設けたことを特徴とする実用新案登録請求の範囲
第1項記載の冷却装置。
(2) The cooling device according to claim 1, which is a registered utility model, characterized in that a bypass that does not pass a heat exchanger is provided between the cryogenic fluid tank and the compressor.
JP1981146070U 1981-10-02 1981-10-02 Cooling system Pending JPS5851458U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981146070U JPS5851458U (en) 1981-10-02 1981-10-02 Cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981146070U JPS5851458U (en) 1981-10-02 1981-10-02 Cooling system

Publications (1)

Publication Number Publication Date
JPS5851458U true JPS5851458U (en) 1983-04-07

Family

ID=29938983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981146070U Pending JPS5851458U (en) 1981-10-02 1981-10-02 Cooling system

Country Status (1)

Country Link
JP (1) JPS5851458U (en)

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