JPS5847267B2 - electron tube vacuum container - Google Patents
electron tube vacuum containerInfo
- Publication number
- JPS5847267B2 JPS5847267B2 JP16235080A JP16235080A JPS5847267B2 JP S5847267 B2 JPS5847267 B2 JP S5847267B2 JP 16235080 A JP16235080 A JP 16235080A JP 16235080 A JP16235080 A JP 16235080A JP S5847267 B2 JPS5847267 B2 JP S5847267B2
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- electron tube
- metal
- vacuum container
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Butt Welding And Welding Of Specific Article (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
Description
【発明の詳細な説明】 本発明は電子管の真空容器の改良に関する。[Detailed description of the invention] The present invention relates to improvements in vacuum vessels for electron tubes.
一般に電子管の真空容器として、金属容器がしばしば使
われ、またその一部に鑞接や溶接による真空気密接合部
を設けることが多い。Generally, a metal container is often used as a vacuum container for an electron tube, and a part of the container is often provided with a vacuum-tight joint by soldering or welding.
そして、軟鑞材、硬鑞材を用いて気密鑞接をしたところ
を横切るようにしてアーク溶接を行なう場合を考えると
、すでに鑞接した部分の鑞材が不必要に急激な加熱をさ
れる結果、鑞材の沸とうや飛散、あるいは母材への拡散
がすすんでしまう不都合が起りやすい。If we consider the case where arc welding is performed across the area where soft and hard solder metals have been airtightly soldered, the solder metal in the areas that have already been soldered will be heated up unnecessarily and rapidly. As a result, problems such as boiling, scattering, or diffusion of the brazing material into the base material are likely to occur.
これは鑞接部の間隙が大きくて鑞材を多量に使用してい
る場合すなわち鑞接部の鑞材厚が厚い場合に著しい。This is noticeable when the gap between the soldered joints is large and a large amount of solder material is used, that is, when the thickness of the solder material at the soldered joints is thick.
本発明はこのような鑞接部を通過するようにＴＩＧ（テ
グ）溶接して気密接合し良好な気密封着状態をもつ電子
管の真空容器を提供するものである。The present invention provides a vacuum container for an electron tube that is hermetically sealed by TIG welding through such a soldered portion and has a good hermetic seal.
以下、図面を参照してその実施例を説明する。Examples thereof will be described below with reference to the drawings.
まず第１図に示すように銅（Ｃｕ ）、ニッケル（Ｎｉ
）、鉄（Ｆｅ）、あるいはステンレスのうちから選ばれ
た金属もしくはこれらの１つを主成分とする金属からな
る母材１１を、所望に応じて例えば丸め成形する。First, as shown in Figure 1, copper (Cu), nickel (Ni)
), iron (Fe), or stainless steel, or a metal whose main component is one of these metals, is formed into a round shape, for example, as desired.
さて、鑞接すべき合わせ目１２０間隙はＱ、２７１Ｊｆ
ｆ以下とし、ここに鑞材１３を配置する。Now, the joint 120 gap to be soldered is Q, 271Jf
f or less, and the solder material 13 is placed here.
したがってこの鑞接部の鑞材厚ｇは０．２ｍｍ以下とな
っている。Therefore, the thickness g of the solder material in this soldered portion is 0.2 mm or less.
このように気密鑞接した金属円筒を第２図に示すように
２個突き合わせて、突き合わせ部１４の全周をトーチ１
５の電極１６によりＴＩＧ（テグ）溶接する。Two metal cylinders that have been hermetically soldered together are butted together as shown in FIG.
TIG welding is performed using the electrode 16 of No. 5.
すなわち各円筒の鑞接部１７ａ、１７ｂをそれぞれ通過
するようにして気密溶接する。That is, airtight welding is performed by passing through the soldered portions 17a and 17b of each cylinder.
そこで、上記の鑞材１３として、本発明においては５０
重量多以下の銀（Ａｇ）鑞、例えばＡｇ（５０％）−Ｃ
ｕ（５０％）合金鑞、Ａｇ（３４％ ）−Ｃｕ（５１％
） Ｐｄ （１５％）系合金鑞、あるいは４０重重量
取板下金（Ａｕ）鑞、例えばＡｕ（３７％）−Ｃｕ（６
３’％ ）合金鑞、Ａｕ （３０Ｎｉ（７０％）系合金
鑞なとの匣鑞を使用している。Therefore, in the present invention, as the above-mentioned brazing material 13, 50
Silver (Ag) solder of less than weight, e.g. Ag (50%)-C
u (50%) alloy braze, Ag (34%)-Cu (51%
) Pd (15%) based alloy solder, or 40-weight plate bottom metal (Au) solder, such as Au (37%)-Cu(6
3'%) alloy solder, Au (30Ni (70%) type alloy solder) is used.
このような鑞接部を横切るようにへりアーク溶接（ＴＩ
Ｇ溶接）により気密溶接した本発明の電子管の真空容器
は、銀あるいは金の含有量の比較的少ない硬鑞材により
鑞接し且つこの鑞接部の鑞材厚ｇを０．２朋以下としで
あるため、ＴＩＧ溶接に際しての鑞材の沸とうや吸い上
げ、過度の母材への拡散、ブローの発生が抑制されて再
現性のよい接合状態を得ることができることが確かめら
れた。Edge arc welding (TI) is applied across such soldered parts.
The vacuum vessel of the electron tube of the present invention, which is hermetically welded by G welding), is soldered with a hard solder material containing a relatively low content of silver or gold, and the thickness of the solder material at the soldered portion is 0.2 mm or less. Therefore, it was confirmed that boiling and suction of the brazing material, excessive diffusion into the base metal, and occurrence of blowing during TIG welding were suppressed, and a welding state with good reproducibility could be obtained.
これはとくに鑞接部の鑞材厚ｇがＱ、２／ＦＪｆｆ以下
の場合にもつともよい結果が得られた。Good results were obtained especially when the thickness g of the solder material at the soldered joint was less than Q,2/FJff.
すなわちこれに対して鑞材厚ｇが０，２ 朋以上である
とＴＩＧ溶接の際、鑞材が飛散したりして一部に鑞材の
ない欠陥部が生じたり、あるいは沸とう現象が起きて良
好な気密接合が得られない。In other words, if the thickness of the solder material g is 0.2 mm or more, the solder material may scatter during TIG welding, resulting in defective areas where there is no solder material, or a boiling phenomenon may occur. A good airtight seal cannot be obtained.
鑞接部の構造は第３図に示すように開先２１をもつもの
、あるいは第４図のように断面クランク状部２２をもつ
ものなどに好適する。The structure of the soldered joint is preferably one having a groove 21 as shown in FIG. 3, or one having a crank-shaped section 22 as shown in FIG.
また第５図に示すように、互いに異なる材質の母材１１
ａ、１１ｂで、異なる形状を気密接合する場合にも好適
する。Further, as shown in FIG. 5, base materials 11 made of different materials.
a and 11b are also suitable for airtightly joining different shapes.
符号２３は溶接部を示す。このような本発明は、あらか
じめ硬鑞付げされたところを通過するようにＴＩＧ溶接
して気密封着し、すぐれた気密接合状態をもつ電子管の
金属製真空容器を得ることができる。Reference numeral 23 indicates a welded portion. According to the present invention, a metal vacuum container for an electron tube having an excellent airtight seal can be obtained by performing TIG welding to pass through a previously hard-soldered part.
第１図は本発明実施例の前段工程の斜視図、第２図は溶
接状態を示す斜視図、第３図、第４図は各々他の実施例
の要部断面図、第５図はさらに他の実施例の斜視図であ
る。
１１、１１ａ、 １１ｂ”・母材、１３・・・鑞材、
１７ａ、１７ｂ・・・鑞接部、１４・・・溶接する突合
せ部、２３・・・溶接部、ｇ・・・鑞材厚。Fig. 1 is a perspective view of the first step of an embodiment of the present invention, Fig. 2 is a perspective view showing a welding state, Figs. 3 and 4 are sectional views of main parts of other embodiments, and Fig. 5 is a further FIG. 7 is a perspective view of another embodiment. 11, 11a, 11b"・base material, 13... brazing material,
17a, 17b... Brazed joint portion, 14... Butt portion to be welded, 23... Welded portion, g... Brazing material thickness.
Claims (1)
合わせ目が５０重量φ以下の銀（Ａｇ）または４０重重
量取板下金を含む合金鑞からなる鑞材で鑞接部の鑞材厚
ｇＩＪ″−０，２ｙｔｔｍ以下となる如く気密鑞接され
て金属円筒が形成され、且つこの金属円筒と他の金属部
材とが上記鑞接部を通過して円周方向に気密にＴＩＧ（
テグ）溶接されてなることを特徴とする電子管の真空容
器。1 A base material made of a metal member is formed into a round shape, and the joint parallel to the axis is made of silver (Ag) of 50 weight φ or less or an alloy solder containing a 40 weight plate bottom plate. A metal cylinder is formed by hermetically soldering so that the material thickness is less than gIJ''-0.2yttm, and this metal cylinder and other metal members pass through the soldered part and are airtightly TIG (
A vacuum vessel for an electron tube characterized by being welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16235080A JPS5847267B2 (en) | 1980-11-18 | 1980-11-18 | electron tube vacuum container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16235080A JPS5847267B2 (en) | 1980-11-18 | 1980-11-18 | electron tube vacuum container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5785670A JPS5785670A (en) | 1982-05-28 |
| JPS5847267B2 true JPS5847267B2 (en) | 1983-10-21 |
Family
ID=15752885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16235080A Expired JPS5847267B2 (en) | 1980-11-18 | 1980-11-18 | electron tube vacuum container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847267B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4726508A (en) * | 1986-07-21 | 1988-02-23 | Micro Motion, Inc. | Method of brazing corrosion resistant nickel-based thin-walled tubing to stainless steel base members |
| CN103203562B (en) * | 2013-04-11 | 2015-04-15 | 金华市欧瑞焊材制造有限公司 | Brazing filler metal for brazing stainless steel metallic mirrors and process for manufacturing brazing filler metal |
-
1980
- 1980-11-18 JP JP16235080A patent/JPS5847267B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5785670A (en) | 1982-05-28 |
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