JPS5833836A - Plasma asher and apparatus - Google Patents

Plasma asher and apparatus

Info

Publication number
JPS5833836A
JPS5833836A JP13153981A JP13153981A JPS5833836A JP S5833836 A JPS5833836 A JP S5833836A JP 13153981 A JP13153981 A JP 13153981A JP 13153981 A JP13153981 A JP 13153981A JP S5833836 A JPS5833836 A JP S5833836A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
plasma
chamber
spectrum
via
reaction gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13153981A
Inventor
Toru Koizumi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Abstract

PURPOSE:To keep constant in the plasma energy within the asher apparatus by detecting intensity of plasma spectrum and by controlling flow rate or pressure of reaction gas and power supply. CONSTITUTION:A sample 5 is placed within the cylindrical chamber 3 and the reaction gas is supplied into the chamber 3 via the piping 10 and supply port 6 by the operation of the controller 13. A high frequency coil 8 is given the power source and generates plasma within the chamber. The plasma thus generated is analyzed by the spectroscope 14 via the window 3a and intensity of each spectrum is detected by the photomultiplier 15. The detected value is compared with the reference value 17 by the comparator and the plasma energy is controlled in accordance with difference between them. Accordingly, the plasma energy generated within the cylindrical chamber 3 can be kept at a constant value.
JP13153981A 1981-08-24 1981-08-24 Plasma asher and apparatus Pending JPS5833836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13153981A JPS5833836A (en) 1981-08-24 1981-08-24 Plasma asher and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13153981A JPS5833836A (en) 1981-08-24 1981-08-24 Plasma asher and apparatus

Publications (1)

Publication Number Publication Date
JPS5833836A true true JPS5833836A (en) 1983-02-28

Family

ID=15060438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13153981A Pending JPS5833836A (en) 1981-08-24 1981-08-24 Plasma asher and apparatus

Country Status (1)

Country Link
JP (1) JPS5833836A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7632419B1 (en) * 1997-10-06 2009-12-15 Applied Materials, Inc. Apparatus and method for monitoring processing of a substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7632419B1 (en) * 1997-10-06 2009-12-15 Applied Materials, Inc. Apparatus and method for monitoring processing of a substrate

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