JPS5826535Y2 - 集積回路装置用多連リ−ドフレ−ム - Google Patents

集積回路装置用多連リ−ドフレ−ム

Info

Publication number
JPS5826535Y2
JPS5826535Y2 JP1977119951U JP11995177U JPS5826535Y2 JP S5826535 Y2 JPS5826535 Y2 JP S5826535Y2 JP 1977119951 U JP1977119951 U JP 1977119951U JP 11995177 U JP11995177 U JP 11995177U JP S5826535 Y2 JPS5826535 Y2 JP S5826535Y2
Authority
JP
Japan
Prior art keywords
frame
lead
integrated circuit
units
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977119951U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5447364U (enrdf_load_stackoverflow
Inventor
肇 城所
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1977119951U priority Critical patent/JPS5826535Y2/ja
Publication of JPS5447364U publication Critical patent/JPS5447364U/ja
Application granted granted Critical
Publication of JPS5826535Y2 publication Critical patent/JPS5826535Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1977119951U 1977-09-08 1977-09-08 集積回路装置用多連リ−ドフレ−ム Expired JPS5826535Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977119951U JPS5826535Y2 (ja) 1977-09-08 1977-09-08 集積回路装置用多連リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977119951U JPS5826535Y2 (ja) 1977-09-08 1977-09-08 集積回路装置用多連リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS5447364U JPS5447364U (enrdf_load_stackoverflow) 1979-04-02
JPS5826535Y2 true JPS5826535Y2 (ja) 1983-06-08

Family

ID=29075694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977119951U Expired JPS5826535Y2 (ja) 1977-09-08 1977-09-08 集積回路装置用多連リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5826535Y2 (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5116698Y2 (enrdf_load_stackoverflow) * 1972-05-29 1976-05-06
JPS5252370A (en) * 1976-08-27 1977-04-27 Hitachi Ltd Fabrication of glass-sealed semiconductor device

Also Published As

Publication number Publication date
JPS5447364U (enrdf_load_stackoverflow) 1979-04-02

Similar Documents

Publication Publication Date Title
US6319753B1 (en) Semiconductor device having lead terminals bent in J-shape
US4043027A (en) Process for encapsulating electronic components in plastic
US3665256A (en) Heat dissipation for power integrated circuits
US6242797B1 (en) Semiconductor device having pellet mounted on radiating plate thereof
US4987473A (en) Leadframe system with multi-tier leads
US5309018A (en) Lead frame having deformable supports
US6117709A (en) Resin sealing type semiconductor device and method of manufacturing the same
KR100264924B1 (ko) 소형반도체용패키지및반도체용패키지에사용되는리드프레임의제조방법
US7132314B2 (en) System and method for forming one or more integrated circuit packages using a flexible leadframe structure
US11569152B2 (en) Electronic device with lead pitch gap
US4912546A (en) Lead frame and method of fabricating a semiconductor device
JPS5826535Y2 (ja) 集積回路装置用多連リ−ドフレ−ム
KR19980087121A (ko) 단일 리드 프레임으로부터 형성된 한 쌍의 방열단자와 복수개의 리드단자를 갖는 반도체 장치의 제조방법 및 그 단일 리드 프레임
US20240105537A1 (en) Mold, lead frame, method, and electronic device with exposed die pad packaging
JPH05343610A (ja) 混成集積回路装置
KR0148078B1 (ko) 연장된 리드를 갖는 리드 온 칩용 리드프레임
JPH021862Y2 (enrdf_load_stackoverflow)
JP2874435B2 (ja) 樹脂封止型半導体装置の製造方法およびリードフレーム
JPH03190270A (ja) 半導体装置
JPH056666Y2 (enrdf_load_stackoverflow)
JP2772897B2 (ja) リ−ドフレ−ム、およびリ−ドフレ−ムを用いた接続端子の作製方法
US20220110213A1 (en) Mechanical support within moulded chip package
JP2536568B2 (ja) リ―ドフレ―ム
JPS6050347B2 (ja) シングルインライン半導体装置用リ−ドフレ−ム
JP2004235299A (ja) 樹脂封止型半導体装置