JPS5826281U

JPS5826281U - headphone

Info

Publication number: JPS5826281U
Application number: JP11908381U
Authority: JP
Inventors: 楠本　庄一; 亨吉川; 温稲葉; 健治山内; 稲垣　道雄
Original assignee: 松下電器産業株式会社
Priority date: 1981-08-11
Filing date: 1981-08-11
Publication date: 1983-02-19

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は°一般的なヘッドホンを示す斜視図、第２図、
第３図は従来のヘッドホンに用いたイヤーパッドの斜視
図、第４図は本考案のヘッドホンに用いるイヤーパッド
の斜視図、第５図は同断面図、第６図は他の実施例のイ
ヤーパッドの斜視図、第７図は同断面図、第８図はさら
に他の実施例のイヤーパッドの斜視図、第９図は同断面
図、第１０図は耳を示す説明図、第１１図は従来と本考
案の　−゛イヤーパッドを用いたヘッドホンの音圧周波
数特性図である。１・・・ヘッドバンド、２．３・・・ハウジンク、４゜
５・・・イヤーパッド、８・・・発泡樹脂、９・・・接
着剤、１０・・・繊維、１１・・・両面接着剤、１２・
・・切欠き。Figure 1 is a perspective view of a typical headphone; Figure 2 is a perspective view of a typical headphone;
Fig. 3 is a perspective view of an ear pad used in conventional headphones, Fig. 4 is a perspective view of an ear pad used in headphones of the present invention, Fig. 5 is a sectional view of the same, and Fig. 6 is a perspective view of an ear pad of another embodiment. 7 is a sectional view of the ear pad, FIG. 8 is a perspective view of an ear pad according to another embodiment, FIG. 9 is a sectional view of the ear pad, FIG. 10 is an explanatory view showing the ear, and FIG. It is a sound pressure frequency characteristic diagram of headphones using the invented ear pads. 1...Headband, 2.3...Housing, 4°5...Ear pad, 8...Foamed resin, 9...Adhesive, 10...Fiber, 11...Double-sided adhesive , 12・
...Notch.

Claims

[Scope of utility model registration request]

This headphone is made by combining a housing housing a speaker unit at both ends of a headband, applying adhesive to the circumferential surface of a flexible foamed resin on the front of the housing, and combining ear pads electrostatically flocked with fibers to this adhesive.