JPS5826174B2 - ハンドウタイソウチ - Google Patents

ハンドウタイソウチ

Info

Publication number
JPS5826174B2
JPS5826174B2 JP50027525A JP2752575A JPS5826174B2 JP S5826174 B2 JPS5826174 B2 JP S5826174B2 JP 50027525 A JP50027525 A JP 50027525A JP 2752575 A JP2752575 A JP 2752575A JP S5826174 B2 JPS5826174 B2 JP S5826174B2
Authority
JP
Japan
Prior art keywords
external connection
film
bump
connection terminal
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50027525A
Other languages
English (en)
Japanese (ja)
Other versions
JPS51102463A (enrdf_load_stackoverflow
Inventor
優 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP50027525A priority Critical patent/JPS5826174B2/ja
Publication of JPS51102463A publication Critical patent/JPS51102463A/ja
Publication of JPS5826174B2 publication Critical patent/JPS5826174B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP50027525A 1975-03-05 1975-03-05 ハンドウタイソウチ Expired JPS5826174B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50027525A JPS5826174B2 (ja) 1975-03-05 1975-03-05 ハンドウタイソウチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50027525A JPS5826174B2 (ja) 1975-03-05 1975-03-05 ハンドウタイソウチ

Publications (2)

Publication Number Publication Date
JPS51102463A JPS51102463A (enrdf_load_stackoverflow) 1976-09-09
JPS5826174B2 true JPS5826174B2 (ja) 1983-06-01

Family

ID=12223524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50027525A Expired JPS5826174B2 (ja) 1975-03-05 1975-03-05 ハンドウタイソウチ

Country Status (1)

Country Link
JP (1) JPS5826174B2 (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1614928A1 (de) * 1966-07-19 1970-12-23 Solitron Devices Verfahren zur Kontaktierung von Halbleiter-Bauelementen
US3436615A (en) * 1967-08-09 1969-04-01 Fairchild Camera Instr Co Contact metal system of an allayer adjacent to semi-conductor and a layer of au-al intermetallics adjacent to the conductive metal
JPS5078Y2 (enrdf_load_stackoverflow) * 1971-04-30 1975-01-06
US3760238A (en) * 1972-02-28 1973-09-18 Microsystems Int Ltd Fabrication of beam leads
JPS5517445B2 (enrdf_load_stackoverflow) * 1973-07-09 1980-05-12

Also Published As

Publication number Publication date
JPS51102463A (enrdf_load_stackoverflow) 1976-09-09

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