JPS58222550A - Lead forming apparatus - Google Patents

Lead forming apparatus

Info

Publication number
JPS58222550A
JPS58222550A JP10512582A JP10512582A JPS58222550A JP S58222550 A JPS58222550 A JP S58222550A JP 10512582 A JP10512582 A JP 10512582A JP 10512582 A JP10512582 A JP 10512582A JP S58222550 A JPS58222550 A JP S58222550A
Authority
JP
Japan
Prior art keywords
remains
negative pressure
path
die
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10512582A
Other languages
Japanese (ja)
Inventor
Takanobu Toriyama
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP10512582A priority Critical patent/JPS58222550A/en
Publication of JPS58222550A publication Critical patent/JPS58222550A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material

Abstract

PURPOSE:To select and remove the remains of lead frame and products and simultaneously remove such frame remaining to the outside by forming vacuum path and air blow path opened to the lower surface of stripper in the conventional lead forming apparatus. CONSTITUTION:A negative pressure is supplied to a vacuum path 21 through a negative pressure hose 23 simultaneously with cutting of lead frame by a punch 17. Thereafter, when a die set 11' is lifted, the remains 3 are absorbed to the lower surface of stripper 18 and is lifted due to a negative pressure of vacuum path 21. On the other hand, isolated individual semiconductor devices are left on the die 14. Next, individual semiconductor devices are removed from the die 14 using vacuum jig. Thereby, it is prevented that the remains 3 are removed together and selection loss can be eliminated. Supply of negative pressure is interrupted and simultaneously the compressed air is blown from the compressed air supply tube 24 through the air blow path 22. The remains 3 are removed to the outside of the apparatus with such air blowing.
JP10512582A 1982-06-18 1982-06-18 Lead forming apparatus Pending JPS58222550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10512582A JPS58222550A (en) 1982-06-18 1982-06-18 Lead forming apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10512582A JPS58222550A (en) 1982-06-18 1982-06-18 Lead forming apparatus

Publications (1)

Publication Number Publication Date
JPS58222550A true JPS58222550A (en) 1983-12-24

Family

ID=14399061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10512582A Pending JPS58222550A (en) 1982-06-18 1982-06-18 Lead forming apparatus

Country Status (1)

Country Link
JP (1) JPS58222550A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166551A (en) * 1986-01-20 1987-07-23 Fujitsu Ltd Ic lead bending press
US5271146A (en) * 1990-07-06 1993-12-21 Matsushita Electric Industrial Co., Ltd. Electronic component supplying apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62166551A (en) * 1986-01-20 1987-07-23 Fujitsu Ltd Ic lead bending press
US5271146A (en) * 1990-07-06 1993-12-21 Matsushita Electric Industrial Co., Ltd. Electronic component supplying apparatus

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