JPS58218711A - 熱伝導性電気絶縁シ−ト - Google Patents
熱伝導性電気絶縁シ−トInfo
- Publication number
- JPS58218711A JPS58218711A JP10167182A JP10167182A JPS58218711A JP S58218711 A JPS58218711 A JP S58218711A JP 10167182 A JP10167182 A JP 10167182A JP 10167182 A JP10167182 A JP 10167182A JP S58218711 A JPS58218711 A JP S58218711A
- Authority
- JP
- Japan
- Prior art keywords
- composition
- electrically insulating
- thermally conductive
- sheet
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 36
- 239000011521 glass Substances 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims description 2
- 238000012644 addition polymerization Methods 0.000 claims description 2
- 238000007259 addition reaction Methods 0.000 claims description 2
- 125000003342 alkenyl group Chemical group 0.000 claims description 2
- 239000004945 silicone rubber Substances 0.000 claims description 2
- LOUPRKONTZGTKE-WZBLMQSHSA-N Quinine Chemical group C([C@H]([C@H](C1)C=C)C2)C[N@@]1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OC)C=C21 LOUPRKONTZGTKE-WZBLMQSHSA-N 0.000 claims 2
- 235000001258 Cinchona calisaya Nutrition 0.000 claims 1
- LOUPRKONTZGTKE-UHFFFAOYSA-N cinchonine Natural products C1C(C(C2)C=C)CCN2C1C(O)C1=CC=NC2=CC=C(OC)C=C21 LOUPRKONTZGTKE-UHFFFAOYSA-N 0.000 claims 1
- 229960000948 quinine Drugs 0.000 claims 1
- 125000003410 quininyl group Chemical group 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 101100313164 Caenorhabditis elegans sea-1 gene Proteins 0.000 description 2
- 241000219112 Cucumis Species 0.000 description 2
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 2
- 125000005605 benzo group Chemical group 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- -1 goalumina Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- 101100505161 Caenorhabditis elegans mel-32 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000010058 rubber compounding Methods 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulating Bodies (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10167182A JPS58218711A (ja) | 1982-06-14 | 1982-06-14 | 熱伝導性電気絶縁シ−ト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10167182A JPS58218711A (ja) | 1982-06-14 | 1982-06-14 | 熱伝導性電気絶縁シ−ト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58218711A true JPS58218711A (ja) | 1983-12-20 |
| JPS6145325B2 JPS6145325B2 (enrdf_load_stackoverflow) | 1986-10-07 |
Family
ID=14306826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10167182A Granted JPS58218711A (ja) | 1982-06-14 | 1982-06-14 | 熱伝導性電気絶縁シ−ト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58218711A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997024231A1 (fr) * | 1995-12-28 | 1997-07-10 | Dupont Teijin Advanced Papers Ltd. | Feuille composite et son procede de fabrication |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040661A (enrdf_load_stackoverflow) * | 1973-04-13 | 1975-04-14 | ||
| JPS5222965A (en) * | 1975-08-14 | 1977-02-21 | Matsushita Electric Ind Co Ltd | Frequency voltage converting device |
| JPS5313505A (en) * | 1976-07-21 | 1978-02-07 | Takeshige Shimonohara | Retaining wall by assemblage |
| JPS5565533A (en) * | 1978-11-10 | 1980-05-17 | Denki Kagaku Kogyo Kk | Production of insulating radiator sheet |
| JPS5580461A (en) * | 1978-12-13 | 1980-06-17 | Shin Etsu Chem Co Ltd | Thermal conductive silicone rubber composition |
| JPS562349A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Silicone Co Ltd | Molded rubber article for heat dissipation |
| JPS56161140A (en) * | 1980-05-16 | 1981-12-11 | Denki Kagaku Kogyo Kk | Manufacture of insulating heat radiating sheet |
| JPS56167444A (en) * | 1980-05-30 | 1981-12-23 | Shinetsu Chem Ind Co | Thermal conductive electric insulating sheet |
| JPS5763246A (en) * | 1980-10-06 | 1982-04-16 | Denki Kagaku Kogyo Kk | Heat radiating sheet |
| JPS61857A (ja) * | 1984-06-14 | 1986-01-06 | Meidensha Electric Mfg Co Ltd | 平面及び立体的に環状なシステム結合方式 |
-
1982
- 1982-06-14 JP JP10167182A patent/JPS58218711A/ja active Granted
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5040661A (enrdf_load_stackoverflow) * | 1973-04-13 | 1975-04-14 | ||
| JPS5222965A (en) * | 1975-08-14 | 1977-02-21 | Matsushita Electric Ind Co Ltd | Frequency voltage converting device |
| JPS5313505A (en) * | 1976-07-21 | 1978-02-07 | Takeshige Shimonohara | Retaining wall by assemblage |
| JPS5565533A (en) * | 1978-11-10 | 1980-05-17 | Denki Kagaku Kogyo Kk | Production of insulating radiator sheet |
| JPS5580461A (en) * | 1978-12-13 | 1980-06-17 | Shin Etsu Chem Co Ltd | Thermal conductive silicone rubber composition |
| JPS562349A (en) * | 1979-06-21 | 1981-01-12 | Toshiba Silicone Co Ltd | Molded rubber article for heat dissipation |
| JPS56161140A (en) * | 1980-05-16 | 1981-12-11 | Denki Kagaku Kogyo Kk | Manufacture of insulating heat radiating sheet |
| JPS56167444A (en) * | 1980-05-30 | 1981-12-23 | Shinetsu Chem Ind Co | Thermal conductive electric insulating sheet |
| JPS5763246A (en) * | 1980-10-06 | 1982-04-16 | Denki Kagaku Kogyo Kk | Heat radiating sheet |
| JPS61857A (ja) * | 1984-06-14 | 1986-01-06 | Meidensha Electric Mfg Co Ltd | 平面及び立体的に環状なシステム結合方式 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997024231A1 (fr) * | 1995-12-28 | 1997-07-10 | Dupont Teijin Advanced Papers Ltd. | Feuille composite et son procede de fabrication |
| US6143819A (en) * | 1995-12-28 | 2000-11-07 | Dupont Teijin Advanced Papers, Ltd. | Composite sheet and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6145325B2 (enrdf_load_stackoverflow) | 1986-10-07 |
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