JPS58207348A - Electrical contact material for sealing - Google Patents

Electrical contact material for sealing

Info

Publication number
JPS58207348A
JPS58207348A JP9096882A JP9096882A JPS58207348A JP S58207348 A JPS58207348 A JP S58207348A JP 9096882 A JP9096882 A JP 9096882A JP 9096882 A JP9096882 A JP 9096882A JP S58207348 A JPS58207348 A JP S58207348A
Authority
JP
Japan
Prior art keywords
electrical contact
copper
contact material
nitride
composite electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9096882A
Other languages
Japanese (ja)
Inventor
Koichi Sakairi
弘一 坂入
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP9096882A priority Critical patent/JPS58207348A/en
Publication of JPS58207348A publication Critical patent/JPS58207348A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a composite electrical contact material for sealing consisting of a prescribed percentage of molybdenum nitride and the balance copper, superior to a conventional copper-nitride type composite electrical contact material in contact performance, and having especially stable low contact resistance. CONSTITUTION:This composite electrical contact material for sealing contains 1-20wt% molybdenum nitride in copper. Copper powder is mixed with molybdenum nitride powder in a V-type mixer for a prescribed time. The powdered mixture is filled into a crucible, and it is repeatedly sintered and compressed until a prescribed density is provided. The resulting material is hot extruded, formed into a wire rod with a drawer, and worked with a header to obtain a rivet type contact or the like. This composite electrical contact material is not at all inferior to a conventional copper-titanium nitride type electrical contact material or the like in welding and consumption resistances, and it has superior contact resistance characteristics.

Description

【発明の詳細な説明】 本発明は胴室化物系の封入用電気接点材料に係る。従来
、封入用電気接点材料としては、銀糸合金、金糸合金、
バラジュウム系合金などの貴金属系例えば銀酸化カドミ
ウム12重口%より成る複合電気接点材料が小電流乃至
中電流域で優れた接点特性を示すものとして各方向で広
く用いられてきた。然し乍ら、近時電気機器及び電子機
器の小型化により゛電気接点材料に要求される接点特性
か苛酷になってきており、従来の銀酸化力ドミウノ、糸
の複合電気接点材料では耐溶着性に劣り、使用に耐えな
くなってきた。この1更に耐溶着性に優れた封入用電気
接点材料が要望されている。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an encapsulated electrical contact material based on a shell compound. Conventionally, electrical contact materials for encapsulation include silver thread alloy, gold thread alloy,
Composite electrical contact materials made of noble metals such as baradium alloys, for example, 12% by weight of silver cadmium oxide, have been widely used in various directions as they exhibit excellent contact characteristics in the small to medium current range. However, with the recent miniaturization of electrical and electronic devices, the contact characteristics required of electrical contact materials have become more severe, and conventional composite electrical contact materials of silver oxidation strength and thread have poor welding resistance. , it has become unusable. There is a need for an electrical contact material for encapsulation that has even better welding resistance.

一方貴金属の使用をおさえ安価な接点材料を(ハ(1) 給する為に電気伝導度か銀についで大きく銀より融点の
高い銅に着目し、これを母合金と4°る接点材料を使用
とよ°)とする試みかなされは!めた。
On the other hand, in order to reduce the use of precious metals and provide an inexpensive contact material (c(1)), we focused on copper, which has a higher electrical conductivity than silver and has a higher melting point than silver, and used this as a contact material with a 4° angle with the mother alloy. It's an attempt to do that! I met.

銅を接点材料として使用する場合銅の耐蝕性か問題とな
るが、この問題は銅を真空中あるいは中性ガス中で使用
することにより解決され貴金属を母合金として用いた場
合に比較して何ら遜色の暦い特性を示すものである。特
に窒化物は融点のA&材料が多く窒化チタンあるいは窒
化ンルコニュウム等のA融点材料を銅の分散強化材とし
、て使用し7で場合消耗量が小さくまた、溶着力に7い
ても優れた特性を示すものである。しかし、このような
融点が商い為に溶融、蒸発等による組成変化か少ない材
料は接点の開閉を重ねるにつれて表向層に生成される分
散強化材の凝集層が、轟く不安定な接触抵抗をもたらす
傾向を有するものである。
When copper is used as a contact material, there is a problem with the corrosion resistance of copper, but this problem is solved by using copper in a vacuum or neutral gas, and there is no problem compared to using precious metals as the mother alloy. This shows that it has an inferior calendar characteristic. In particular, nitrides have a large melting point of A& materials, and when A melting point materials such as titanium nitride or ruconium nitride are used as a dispersion reinforcing material for copper, the wear amount is small and the welding force is 7. It shows. However, due to the melting point of the material, the composition changes little due to melting, evaporation, etc. As the contact is repeatedly opened and closed, an agglomerated layer of dispersion reinforcing material is generated on the surface layer, resulting in a roaring and unstable contact resistance. It has a tendency.

本発明は上記諸事情に鑑みなされたものであり従来の銅
−窒化物系の複合電気接点材料よりも優れた接点性能、
とりわけ安定した低接触抵抗を有する複合電気接点材料
を提供せんとするものであ(2) る。
The present invention was made in view of the above circumstances, and has superior contact performance than conventional copper-nitride composite electrical contact materials.
In particular, we aim to provide a composite electrical contact material that has stable and low contact resistance (2).

本発明の封入用電気接点材料は鋼中に窒化モリブデン1
〜20重量%を添加して成るものであるが鋼中に窒化モ
リブデンを添加した理由は窒化モリブデンが1168℃
で解離する不安定な性質を有し接点表面の窒化物凝集バ
ンドの生成を防ぎ接触抵抗を安定させる働きを有するか
らである。
The electrical contact material for encapsulation of the present invention contains molybdenum nitride 1 in steel.
The reason for adding molybdenum nitride to the steel is that molybdenum nitride has a temperature of 1168°C.
This is because it has an unstable property of being dissociated in the process, and has the function of preventing the formation of nitride agglomerated bands on the contact surface and stabilizing the contact resistance.

本発明の電気接点材料に於いて、鋼中に添加する窒化モ
リブデンを1〜20重量%としたのは、1重量%未満で
は銅の地が充分に強化されない為に耐消耗特性、あるい
は耐溶着特性に関しては良好な結果は得られない。また
20重量%を越えた組成では加工が困難となり、材料の
導電率も低くなるので良好な結果は得られない。以上の
理由により特許請求の範囲に記載した組成を限定したも
のである。
In the electrical contact material of the present invention, the molybdenum nitride added to the steel is set at 1 to 20% by weight because if it is less than 1% by weight, the copper base will not be sufficiently strengthened. Good results cannot be obtained regarding properties. Moreover, if the composition exceeds 20% by weight, processing becomes difficult and the electrical conductivity of the material becomes low, making it impossible to obtain good results. For the above reasons, the compositions described in the claims are limited.

なおこれらの銅−窒化物材料を窒素雰囲気中で使用した
一合さらにすぐれた耐溶着特性を示すものである。
Furthermore, when these copper-nitride materials are used in a nitrogen atmosphere, they exhibit even better welding resistance.

〔実施例〕〔Example〕

(3) 平均粒径4μの銅粉と窒化モリブデンをV型混合器によ
り3時間混合した後粉末をルツボに充てんし所定の密度
に達するまで焼結圧縮を繰り返した材料を熱間で押出し
た。これを伸線機により線材とした後、ヘッダー機によ
り加工し下表の組成を有す4頭部径4φ鶴、頭高1.1
 tm、脚部径2,8φ鶴、脚長1.6mのリベット型
接点を得た。
(3) After mixing copper powder with an average particle size of 4 μm and molybdenum nitride in a V-type mixer for 3 hours, the powder was filled into a crucible and sintered and compressed repeatedly until it reached a predetermined density, and the material was hot extruded. This was made into a wire rod using a wire drawing machine, and then processed using a header machine to produce 4 wire rods with a head diameter of 4φ and a head height of 1.1 having the composition shown in the table below.
A rivet type contact with a leg diameter of 2.8 φ and a leg length of 1.6 m was obtained.

〔従来例1〕 平均粒径4μの銅粉と窒化チタンを■型混合器により3
時間混合した後粉末をルツボに充てんし所定の密度に達
するまで焼結圧縮を繰り返した後ヘッダー機により加工
し下表の組成を有する頭部径4゛φ寵、頭高1.1鶴、
脚部径2.8φ鶴、脚長1.6 mmのリベット型接点
を得た。
[Conventional Example 1] Copper powder with an average particle size of 4μ and titanium nitride were mixed in a ■ type mixer.
After mixing for a period of time, the powder is filled into a crucible, sintered and compressed repeatedly until it reaches a predetermined density, and then processed using a header machine to produce a powder with a head diameter of 4゛φ and a head height of 1.1 mm, having the composition shown in the table below.
A rivet type contact with a leg diameter of 2.8φ and a leg length of 1.6 mm was obtained.

〔従来例2〕 銀カドミウム合金を鋳造抜用ぬき伸線加工を行ないこれ
をヘッダー機により頭部径4φ鶴、頭高1.1鶴、脚部
径2.8φ寵、脚長1.6fiのリベット形状に成形し
た後5気圧800°Cで内部酸化を行ない銀酸化カドミ
ウム12重量%とじた。
[Conventional example 2] A silver cadmium alloy is cast, drawn, drawn, and made into rivets using a header machine with a head diameter of 4φ, a head height of 1.1mm, a leg diameter of 2.8φ, and a leg length of 1.6fi. After molding into a shape, internal oxidation was performed at 5 atm and 800°C, and 12% by weight of silver cadmium oxide was added.

(4) 然して上記実施例、従来例1.2の電気接点を下記の試
験条件にて開閉試験を行い、溶着発生までの開閉回数を
測定し且つ接触抵抗、消耗を測定したところ、下記の表
の右欄に示すような結果を得た。
(4) However, the electrical contacts of Example 1 and Conventional Example 1.2 were subjected to opening and closing tests under the following test conditions, and the number of openings and closings until welding occurred was measured, as well as the contact resistance and wear. The results shown in the right column were obtained.

試験条件 電圧 ^、C,100V 50Hz 電流 投入電流 40A、定常電流 10A開閉頻度 
 20回/分 負荷 抵抗 開閉回数 溶着発生まで 雰囲気 窒素雰囲気 (5) 上記の表の右欄の数値で明らかなように実施例の電気接
点材料にて作った電気接点は、従来例1.2の電気接点
キイ料に比し耐消耗性、Ik4/8着性が優るとも劣ら
ずかつ安定した低接触抵抗を不すことがわかる。
Test conditions Voltage ^, C, 100V 50Hz Current Closing current 40A, steady current 10A Opening/closing frequency
20 times/min load Resistance switching times Atmosphere until welding occurs Nitrogen atmosphere (5) As is clear from the values in the right column of the table above, the electrical contacts made using the electrical contact material of the example were as follows: Conventional Example 1.2 It can be seen that the wear resistance and Ik4/8 adhesion are superior to, but not inferior to, electrical contact key materials, and the material exhibits stable low contact resistance.

以上詳記した通り本発明による複合電気接点材料は、従
来の銀−酸化カドミウムおよび鋼車化チタン系の電気接
点材料に較へ耐溶着性、銅消耗性が優るとも劣らずかつ
すぐれた接触抵抗特性を性夕ので最近の電気及び電子機
器の小型化に伴なう苛酷な使用条件にも対応できる接点
性能を備えた画期的な封入用電気接点材料と言える。
As detailed above, the composite electrical contact material according to the present invention has superior welding resistance and copper wear resistance as well as excellent contact resistance compared to conventional silver-cadmium oxide and titanium steel electrical contact materials. Because of its characteristics, it can be said to be an innovative electrical contact material for encapsulation that has contact performance that can withstand the harsh operating conditions associated with the recent miniaturization of electrical and electronic equipment.

出願人  田中貴金属工業株式会社 (6)Applicant: Tanaka Kikinzoku Kogyo Co., Ltd. (6)

Claims (1)

【特許請求の範囲】[Claims] 束量比で窒化モリブデンを1〜20%含み残部銅よりな
る封入用電気接点材料。
An electrical contact material for encapsulation that contains 1 to 20% molybdenum nitride in terms of bundle ratio and the balance is copper.
JP9096882A 1982-05-28 1982-05-28 Electrical contact material for sealing Pending JPS58207348A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9096882A JPS58207348A (en) 1982-05-28 1982-05-28 Electrical contact material for sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9096882A JPS58207348A (en) 1982-05-28 1982-05-28 Electrical contact material for sealing

Publications (1)

Publication Number Publication Date
JPS58207348A true JPS58207348A (en) 1983-12-02

Family

ID=14013292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9096882A Pending JPS58207348A (en) 1982-05-28 1982-05-28 Electrical contact material for sealing

Country Status (1)

Country Link
JP (1) JPS58207348A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110146784A1 (en) * 2009-12-18 2011-06-23 First Solar, Inc. Photovoltaic device back contact
JPWO2010147098A1 (en) * 2009-06-15 2012-12-06 東レ株式会社 Black composite fine particles, black resin composition, color filter substrate and liquid crystal display device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5069592A (en) * 1973-09-18 1975-06-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5069592A (en) * 1973-09-18 1975-06-10

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010147098A1 (en) * 2009-06-15 2012-12-06 東レ株式会社 Black composite fine particles, black resin composition, color filter substrate and liquid crystal display device
JP2015227282A (en) * 2009-06-15 2015-12-17 東レ株式会社 Black color composite fine particle, black color resin composition, color filter substrate and liquid crystal display device
JP5875179B2 (en) * 2009-06-15 2016-03-02 東レ株式会社 Black composite fine particles, black resin composition, color filter substrate and liquid crystal display device
US20110146784A1 (en) * 2009-12-18 2011-06-23 First Solar, Inc. Photovoltaic device back contact

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