JPS58204576A - 半導体発光素子または受光素子 - Google Patents

半導体発光素子または受光素子

Info

Publication number
JPS58204576A
JPS58204576A JP57087796A JP8779682A JPS58204576A JP S58204576 A JPS58204576 A JP S58204576A JP 57087796 A JP57087796 A JP 57087796A JP 8779682 A JP8779682 A JP 8779682A JP S58204576 A JPS58204576 A JP S58204576A
Authority
JP
Japan
Prior art keywords
light emitting
chip
optical fiber
emitting element
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57087796A
Other languages
English (en)
Inventor
Masataka Imoto
井元　昌隆
Hideaki Ito
英昭 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Rayon Co Ltd
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP57087796A priority Critical patent/JPS58204576A/ja
Publication of JPS58204576A publication Critical patent/JPS58204576A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は半導体発光素子Ｒよび受光素子の構造に関する
ものである。
従来光ファイバーと半導体発光素子あるいは受光素子と
の結合は、光ファイバーの端部にとつつけるフェルール
と発光素子あるいは受光素子を挿入固定するレセプタク
ルと称する治具を用いて行うのが一般的であった。
ニア）様な治具ン用いる方法では、光ファイバーと発光
素子あるいは受光素子の元軸を正確に合わせることが難
しく、またその結合による光損失も大さかった。
本発明はこの様な半導体発光素子あるいは受光素子と光
ファイバーの結合を簡便かつ正確に行い、結合による光
損失を最小限にしようとするものである。
以下本発明馨図面に従って説明する。
図面は本発明による半導体発光素子の断面図であり、（
１）は発光チップ、（２）は反射凹面鏡、　＋３１゜（
４）は電極、（５）は導線であり、これらは透明な有脂
（６）ニ封じ込まれている。この樹脂層（６）の発光チ
ップ上方には光フアイバー挿入孔（７）がある。
また受光素子も発光素子と司様、受光チップの上方の樹
脂１智ｌこ光フアイバー挿入用の孔？有する構造とする
。
ここで反射凹面鏡は本発明の必須要件で１・まないので
１反射凹面纜を有しない構造とする二ともでき、また受
光素子は発光素子と一一原理ｌこつご図面ケ省略する。
光ファイバーと工発明による半導体発光素子？よび受光
素子との績合は孔（７）ニ光ファイバーを挿入し、孔と
光ファイバーの間７啜看゛痢で固、のれば光ファイバー
への光入射効率あるいは光ファイバーからの光の受光効
率が優れ、しかも光軸を簡便Ｖこ合わせることが可能に
なる。
【図面の簡単な説明】
図面は本発明による半導体発光素子の断面図であり９図
譚甲の符号（１）は発光チップ、（６）は樹脂層、（７
）は光フアイバー装着用の孔である。

Claims (1)

    【特許請求の範囲】
  1. 樹脂により発光チップあるいは受光チップ及び電標が封
    入された半導体発光素子及び受光素子において、樹脂層
    の半導体チップ真上の部分に光ファイバーを装着するた
    めの挿入孔乞有すること乞特徴とする半導体発光素子及
    び受光素子。
JP57087796A 1982-05-24 1982-05-24 半導体発光素子または受光素子 Pending JPS58204576A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57087796A JPS58204576A (ja) 1982-05-24 1982-05-24 半導体発光素子または受光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57087796A JPS58204576A (ja) 1982-05-24 1982-05-24 半導体発光素子または受光素子

Publications (1)

Publication Number Publication Date
JPS58204576A true JPS58204576A (ja) 1983-11-29

Family

ID=13924937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57087796A Pending JPS58204576A (ja) 1982-05-24 1982-05-24 半導体発光素子または受光素子

Country Status (1)

Country Link
JP (1) JPS58204576A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0392741A2 (en) * 1989-04-08 1990-10-17 Oxley Developments Company Limited Fibre optic/LED coupling
US5825051A (en) * 1996-10-12 1998-10-20 Preh-Werke Gmbh & Co. Kg Optoelectronic component with central hollow
EP0893861A3 (en) * 1997-07-25 2000-01-12 Oki Electric Industry Co., Ltd. Optical module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524404A (en) * 1978-08-09 1980-02-21 Toshiba Corp Semiconductor light emitting device
JPS55138891A (en) * 1979-04-18 1980-10-30 Fujitsu Ltd Light semiconductor device
JPS562263B2 (ja) * 1977-10-13 1981-01-19

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562263B2 (ja) * 1977-10-13 1981-01-19
JPS5524404A (en) * 1978-08-09 1980-02-21 Toshiba Corp Semiconductor light emitting device
JPS55138891A (en) * 1979-04-18 1980-10-30 Fujitsu Ltd Light semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0392741A2 (en) * 1989-04-08 1990-10-17 Oxley Developments Company Limited Fibre optic/LED coupling
EP0392741A3 (en) * 1989-04-08 1990-11-28 Oxley Developments Company Limited Fibre optic/led coupling
US5825051A (en) * 1996-10-12 1998-10-20 Preh-Werke Gmbh & Co. Kg Optoelectronic component with central hollow
EP0893861A3 (en) * 1997-07-25 2000-01-12 Oki Electric Industry Co., Ltd. Optical module

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