JPS58199547A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS58199547A
JPS58199547A JP57081440A JP8144082A JPS58199547A JP S58199547 A JPS58199547 A JP S58199547A JP 57081440 A JP57081440 A JP 57081440A JP 8144082 A JP8144082 A JP 8144082A JP S58199547 A JPS58199547 A JP S58199547A
Authority
JP
Japan
Prior art keywords
lead frame
tab
resin
pellet
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57081440A
Other languages
Japanese (ja)
Inventor
Toshio Kanno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57081440A priority Critical patent/JPS58199547A/en
Publication of JPS58199547A publication Critical patent/JPS58199547A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To prevent the production of resin crack in a semiconductor device which has a resin-molded package by forming the side face of a tab of the lead frame in rugged shape, thereby increasing the bonding strength of the tab to the resin. CONSTITUTION:In order to mount a semiconductor pellet, a rectangular rugged part 10A is formed by punching on the side face of a tab 2 which is formed substantially at the center of a lead frame. The pellet is mounted on the tab 2, and the bonding pad of the pellet is sealed with resin-molded package after the inner lead of the lead frame and the wirings are connected by bonding.
JP57081440A 1982-05-17 1982-05-17 Lead frame Pending JPS58199547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57081440A JPS58199547A (en) 1982-05-17 1982-05-17 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57081440A JPS58199547A (en) 1982-05-17 1982-05-17 Lead frame

Publications (1)

Publication Number Publication Date
JPS58199547A true JPS58199547A (en) 1983-11-19

Family

ID=13746449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57081440A Pending JPS58199547A (en) 1982-05-17 1982-05-17 Lead frame

Country Status (1)

Country Link
JP (1) JPS58199547A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252159A (en) * 1986-04-25 1987-11-02 Hitachi Ltd Lead frame for semiconductor device
US5021864A (en) * 1989-09-05 1991-06-04 Micron Technology, Inc. Die-mounting paddle for mechanical stress reduction in plastic IC packages
JP2012064880A (en) * 2010-09-17 2012-03-29 Onuki Kogyosho:Kk Resin seal metal component, lead frame used for it, and metal component manufacturing method
JP2015170787A (en) * 2014-03-10 2015-09-28 新電元工業株式会社 Resin-sealed semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252159A (en) * 1986-04-25 1987-11-02 Hitachi Ltd Lead frame for semiconductor device
US5021864A (en) * 1989-09-05 1991-06-04 Micron Technology, Inc. Die-mounting paddle for mechanical stress reduction in plastic IC packages
JP2012064880A (en) * 2010-09-17 2012-03-29 Onuki Kogyosho:Kk Resin seal metal component, lead frame used for it, and metal component manufacturing method
JP2015170787A (en) * 2014-03-10 2015-09-28 新電元工業株式会社 Resin-sealed semiconductor device

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