JPS58197732A - Resist coating apparatus with cup rotating mechanism - Google Patents

Abstract

PURPOSE:To obtain a high quality resist film by rejecting generation of reflection phenomenon of resist within a cup and preventing generation of a thin film in the space within a cup through introduction of a structure which allows rotation of a cup accommodating a vacuum chuck which rotates a material to be processed. CONSTITUTION:The bottom end of a cup body 30 accommodating semiconductor wafer 31 which is to be processed is coupled to the floor plate 32 having an exhaust tube 34 through a bearing 33 and the body 30 is rotatable around the fixed floor plate 32 by means of a gear 39 provided at the one side surface of said body 30. This rotation is caused by a rotating axis 40a extruded from a motor 40. A vacuum chuck 35 which rotates by means of the motor 36 is engagingly inserted to the center of floor plate 32, a resist nozzle 38 is placed thereon, the upper side of body 30 is bent horizontally in such a way as surrounding external circumference of wafer 31. Thereby, the resist dropped on the wafer 31 is sprashed up to the internal wall surface 30a of the body by a centrifugal force. But since the body itself 30 is also rotating, such resist is not reflected onto the resist film.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention provides a resist with a cup rotation mechanism in a fabric device 111-
Regarding [Technical background of the invention and one point therebetween] In the case of forming a resist film on the surface of an object to be processed such as a semiconductor wafer 1 For example, as shown in FIG.

Resist - heavy equipment @r, heating table 2. Storage room 4 for body gain 1
Processing carried out on a resist coating stand S equipped with a 4-, 4-, etc.
D Semiconductor Queue 8 - $2 Figure (A)
As shown in FIG. c is formed.

Therefore, a resist coating device that performs resist coating process is installed.
For example, as shown in Fig. 3, the exhaust mechanism (not shown) is connected to the exhaust pipe 10! - A connected cup 77 inside 52 and a vacuum chuck LLV rotatable 52 are provided,
The semiconductor wafer 6 is placed on the vacuum chuck 12 through the opening 14 at the top of the cup 12, and while being rotated by the motor 13, the semiconductor wafer 6 is placed on the semiconductor wafer 6 through the generally cut nozzle j4. ; It is curved to spray the resist. However, since the semiconductor wafer is rotating, the nozzle 14 to the semiconductor urchin - Top C -
A part of the sprayed resist is blown away by centrifugal force after colliding with the surface of the sprayed resist, and is reflected by the inner surface of the cup 11, as shown in FIG.
2 Formed registers) 11gc top 5; Locally - Form a raised part 14v of the register 111 To prevent reflection phenomenon V; A resist coating device J with a large number of blades installed on the inner wall thI4 and at a required opening angle α
In the resist coating device 11g, which has a blade 15, the inside of the cup 11 is flushed with the surface 111 from the semiconductor wafer 6.
The rebound V due to the rear blade 1j reflected by Jtta
The supercharged blade JjC is applied.As a result, it is possible to prevent the occurrence of glare from the resist.However, when a resist coating apparatus l- having one blade Jjv is used for a long period of time, as shown in FIG.

A thin resist film 1 is placed near the inner wall surface 11 of the cup Jj.
r is formed - so that the thin film 17 exhibits a similar effect to the inner wall -II- of the vane 7j.

There was a moment when the light was shining again and the current situation was rising again. On duty.

The formation of this thin @zW occurs when the semiconductor wafer 6 is rotating at high speed or when the exhaust wrinkles from the cup II increase ≦
2. Facilitated.

[Summary of the invention]

The present invention has a structure in which a cup containing a vacuum chuck that rotates the object to be processed can be rotated once.

I sympathize with the attempt to prevent the current $&J outbreak from occurring;
Prevents the formation of a six-layer membrane within the cup.

This is a resist coating device with a cup rotation mechanism that can form a resist film of extremely high quality on the object to be processed. ! A cup 1 transfer mechanism that prevents the formation of umbrellas, prevents the formation of the entire amount of film in the cup, and forms a resist film of extremely high quality on the object to be processed. [Embodiments of the Invention] An embodiment of the present invention will be described below with reference to the following.

In the figure, 10 is a cup main body forming a processing object accommodating section for semiconductor sea urchins/%&accommodating the processing object 11. Floor plate 12 is attached to the rotatable section
1; is formed with an exhaust pipe 14 that connects the inside of the cup body 11 to an exhaust mechanism port (not shown); still has an approximately central portion of the floor plate SX (2 is a tip portion); Vacuum chuck jj is inserted through. Back door s11
The upper part C of the opening 17 is the surface C of the object to be processed 31 on the vacuum chuck 1j; the nozzle 18 for spraying the resist is provided.The lower outer periphery 1i11 of the cup body 10 is .

Gear 1 # is formed along the circumference - this gear 1
For this purpose, the rotating wheel 40 of the motor 0 for rotating the cup body 1
The attached gear 41 meshes.

According to the resist coating with the cup rotation mechanism configured in this way, the vacuum chuck 3j
Tip 8B6 - object to be processed JJ'f A certain semiconductor wafer is fixed, and while rotating at a predetermined number of rotations by a rotary motor 16≦2, the cup body 10V gear 19.4 is rotated at the same time.
The cup body sO is rotated by the motor 40 for rotating the cup body through the nozzle 38, and the to-be-processed object MifJJ resist is sprayed from the nozzle 38. It doesn't matter if it is in the opposite direction or in the opposite direction - the heated resist is scattered in the direction of the inner wall of the cup body 10 due to the centrifugal force associated with the Koku chuck 1s (/J Pi, c). Then, the cup body 10
Since the rotation C of the cup body J0 also rotates once, the centrifugal force generated by the rotation C of the cup body J0 causes even if it is reflected from the inner wall surface 10, it bounces back along the inner surface 10≦2.As a result.

C on the resist film C formed on the object to be processed 11g.

The splashed resist can be prevented from occurring locally when the resist is applied.In addition, even if the resist coating process is used for a long period of time as described above, the cup body may be damaged during the process. Since it is rotating, it is possible to prevent a thin resist film from being formed on the inner wall 1ios o a of the cup body J0. As a result, an extremely high quality resist a can be easily formed on the surface of the object to be processed 31. be able to.

The rotation speed of the cup body 30 is 1 of the vacuum chuck 15.
It is desirable to set the settings appropriately according to the number of rotations, type of resist, properties, etc. - The bearing 31c/J portion C, which is the contact part between the floor handle 31 and the cup body 30, is still in a reduced pressure state inside the cup and the body 30. In order to maintain the temperature at certain points and to prevent impurities such as dust from entering the interior of the cup body 30, it is desirable to perform airtight treatment using a suitable sealing member. C. Effects of the invention] As explained above, 1. The present invention C. 2. Resist coating with a cup rotation mechanism according to It is possible to prevent the formation of the space 1;4 film Q) and to form an extremely high quality resist film -HIjAt- on the object to be processed.

[Brief explanation of drawings]

The reason for 114x is the resist coating equipment *v' The front view of the installed resist coating stand, @Figure 2 (2)) is the IlrEM1 diagram of the semiconductor wafer on which the resist film was formed, and the same figure (the pigeon is the front view of the resist coating stand installed) Figure 4 is a partially cutaway cross-sectional view of a conventional resist eyelid cloth mounting. Cross-sectional view, sliding door Figure 5 shows the main part of a conventional resist coating device with one blade. Figure 6 shows a partially broken l1rlth curve showing the state in which a # film of resist is formed within the cup. , FIG. 7 shows 1 an embodiment of the present invention, 1 hdD ugly, # j # cup body, 11... object to be processed, 3
2... Floor plate, 13... Bearing, 34... Exhaust pipe,
36...Vacuum chuck, J 6-...Rotary motor, J
2...Narrow mouth WAI, 19.41...Gear, 40...
・Motor for rotating the cup body, (0...Resist coating WIk with cup b rotation mechanism. Representative of patent attorney Takehiko Wae Figure 1 Figure 2

Claims (1)

[Scope of Claims] A floor plate to which a vacuum chuck to which an object to be processed is fixed is rotatably mounted; and a rotary position on the floor plate C to accommodate the vacuum chuck. And, the object to be treated I; a cup body having a counter-rotating opening; and the opening! A resist spraying nozzle provided to rotate the object to be treated 4 through the IBV, a rotating mechanism for the cup body attached to the cup body, and a rotation mechanism between the cup body and the floor plate. A resist coating IUI with a cup rotation mechanism is characterized in that the formed processing object accommodating part and an exhaust mechanism are communicated with each other.