JPS58194396A - Method of producing circuit board with micropins - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention comprises a wiring board having a structure in which a wiring layer is formed on a board main body, each wiring layer is connected to a pad layer formed on a board main body, and The present invention relates to a method for producing a wiring board with microbins having a structure in which microbins for connecting the wiring layer of the wiring board to the outside are planted on a pad layer.

Conventionally, as a wiring board with a sterilization microbin, a plurality of windows 3 are formed on the main surface 2 of an insulating board body 1, as shown by U in FIG. 1, to expose the board to the outside. An insulating layer 4 is formed on the main surface 2.
A plurality of pad layers 5 are formed at positions within the plurality of windows 3, respectively, and a plurality of wiring layers 6 are formed on the insulating layer 4 (here, a plurality of wiring layers 6 are respectively connected and extended to the plurality of pad layers 5). The number of wiring lines @6 and the outer peripheral region of the plurality of pad layers 5 are the same as the outer peripheral region 1 of the insulating layer 1 and the plurality of pad layers 5.
- continuously extending a plurality of pad layers 5 to the outside;
1. A plurality of wiring layers 6 are formed on the substrate main body 11- by a mode in which a plurality of windows 7 are formed and embedded in an insulating layer 8. ! The wiring board 9 has a configuration in which two wiring layers 6 are respectively connected to the plurality of pad layers 5 formed on the board body 1, and the wiring board 9 has a structure in which two wiring layers 6 are respectively connected to the plurality of pad layers 5 formed on the substrate body 1. In this example, a plurality of microphones 10 having an inverted T shape when viewed in vertical section are used to connect a plurality of wiring layers 6 of a wiring board 9 to the outside, and are made of a plurality of microphones 10, which are planted using solder 11. Proposed.

The wiring board U with microbins having the configuration of refusing the wiring board U has a configuration in which the microbins 10 for connecting the wiring layer 6 of the wiring board 9 to the outside are planted on the pad layer 5 of the wiring board 9. A wiring board U with a 4-filter microbin having such a configuration
, as Ul and U2, and when it is necessary to connect the wiring layers 6 of the two wiring boards 1 and U2 with microbins to n, the connection can be easily made. There is a type C that has the characteristic of being able to do.

That is, as shown in FIG. 2, a plurality of holes 24 are formed in the insulating substrate 21 and extend between the opposing main surfaces 22 and 23 of the insulating substrate 21. In this manner, a plurality of sockets 2 are formed in the insulating substrate 21 by a plurality of holes 24 and fluid conductors 25 respectively accommodated and held in the holes 2/I.
6, if you prepare and place the connector board in advance, the wiring board U with microbin is attached to the connector board.
1 and U2 are inserted into the sockets 26 of the connector plate B from the main surfaces 22 and 23 sides of the connector plate B, respectively. The micro-bins 10 of the micro-bin-equipped wiring board 1 no. The special feature is that the wiring layers 6 of U1 and U2 can be connected to each other.

By the way, as a method for manufacturing a microphone having such characteristics [one bin and one wiring board U], the method described below with reference to FIG. 4 and FIG. 5 has been proposed.

That is, in advance, in Figure 1 as shown in Figure 4, 1
Similar to the wiring board 9 described above, a plurality of wiring layers 6 are formed on the base tree (A11-), and the plurality of wiring layers 6 are connected to a plurality of pads FJ5 formed on the board body 1-. A wiring board 9 having the following configuration is prepared.

-h, a conductor plate 31 as shown in FIG. 5A is prepared in advance, and the main surface 32 of the conductor plate 31 as shown in FIG.
On the top, a mask and an electrode 35 having a configuration in which a plurality of holes 34 are bored in a conductive plate 33 are placed close to each other in parallel with one surface 32, and a required power source 3 is connected between the mask electrode 35 and the conductive plate 31.
6 and hQ between the mask electrode 35 and the conductor plate 31.
As a result, ft1t+iJ of the conductor plate 31 facing the area other than the hole 34 of the Nosk electrode 35 is increased to 1. The mask electrode 35 is removed from the main surface 32 of the conductor plate 31 on the opposite main surface 3.
The main surface 32 of the conductor plate 31 is lowered toward the 2' side while maintaining a parallel relationship with the main surface 32' of the conductor plate 31.
Perform electrical discharge machining using a mask electrode 35 from the side,
Thus, as shown in FIG. 5C, a plurality of holes are formed on the conductor plate 31, with the - side opposite to the surface 32', and having a size corresponding to the hole 34 of the mask electrode 35 when viewed in cross section. A conductor column 37 is formed.

Next, as shown in the fifth diagram, holes 42 smaller than the holes 34 of the mask electrode 35 described above are formed in the conductor plate/11 on the upper end surfaces 38 of the plurality of conductor columns 37. The mask electrodes 13 of (A) are placed in parallel with one end surface 38 and closely opposed to each other in such a manner that the plurality of holes 42 are respectively opposed to the upper end surfaces 38 of the plurality of conductor columns 37. A required power source 44 is connected between the plates 31 to generate a discharge between the mask electrode 43 and the plurality of conductor columns 37, and thereby, for each of the plurality of conductor columns 37, the holes other than the holes 42 of the mask electrode 43 are 1 end face 38 covering the area facing the area
Accordingly, the mask electrode 43 is removed from the side.
A plurality of conductor pillars 3 are arranged on the main surface 32' side of the conductor plate 31 and descend while maintaining a relationship parallel to the "-plane 32'.
7, each of the 1-*:::bV electric current using the mass electrode 43 from the 38th surface], thus, the 5th
As shown in FIG. F, on the upper end surfaces 38 of the plurality of conductor columns 37, conductor column portions 45 each having a size corresponding to the hole 42 of the mask electrode 43 when viewed in cross section are formed.

Next, the plurality of conductor columns 37 are arranged along a plane 46 parallel to the principal surface 32' of the conductor plate 31 that passes from the hob conductor column section 45 to the principal surface 32' side of the conductor plate 31 in FIG. 5F. In this way, as shown in FIG. .

After that, as shown in FIG. 5F, a plurality of 10 microbins having an inverted T-shape when seen in the vertical cross section obtained as described above in FIG. 5F, as shown in FIG. The plurality of pad layers 5F of the wiring board 9 prepared in advance are positioned and planted using the solder 11, thus obtaining the intended microbin-1 wiring board U.

In the above-1, the manufacturing method of the wiring board U with microbins shown in FIG. A wiring board 9 on which a plurality of obtained microbins 10 can be prepared in advance.
It takes a lot of effort and time to plant the solder 11 on the plurality of pad layers 5, and this means that each microbin 10 must be accurately positioned at a predetermined position on the pad layer 51-. If the wiring board with microbins 10 is not planted in the connector plate B, each microbin 10 may not be connected smoothly to the connector board B as described above in FIG. It has a cylindrical shape because it must be accurately positioned and planted at a predetermined position on the pad layer 5.

In addition, in the case of the conventional manufacturing method described above, the microphone bottle 10 starts with 31 conductors, and the conductor pillars 37 are formed on the conductor plate 31 by electrical discharge machining, and then,
The conductor column portion 452 is formed on the conductor column 37 by the electric discharge machining process on the conductor column 37.
Since the steps of 71 cutting and 11 can be obtained using a shuttle, the microbin 10 can be obtained with the waste of material for the conductor plate 31, and therefore the microbin 10 can only be obtained at a high price. be. This means that if the fluid conductor 25 constituting the socket 26 of the connector plate B is made of mercury, the microbottle 10 must be made of platinum, which cannot be corroded by mercury. If it becomes necessary, it is cylindrical.

Therefore, the present invention aims to propose a novel method for manufacturing a wiring board with a microbin, which does not have the drawbacks of the conventional manufacturing method described above, and will become clear from the detailed description below.

FIG. 6 shows an embodiment of the method for manufacturing a wiring board with a microbin according to the present invention. A plurality of wiring layers 6 are formed, and a plurality of wiring layers 6, such as a plurality of wiring layers 6, are formed on the substrate main body 1.
An ammeter plate 9 configured to be connected to a plurality of pad layers 5 formed above is prepared. In addition, in FIG. 6 Δ, the same reference numerals are given to the parts corresponding to the wiring board 9 described above in FIG. Revision I8'l The explanation is omitted.

Thus, as shown in FIG. 6B, the pad layer 5 of the wiring board 9
A protective layer 51 made of, for example, chromium and having a thickness of, for example, 500 mm is formed on the main surface of the side provided with, for example, by vapor deposition.

Next, as shown in FIG. 6G, the unitary layer 51. On top of that, an organic polymer material layer 5 made of thermally crosslinkable organic polymer material, polyimide, etc.
Can withstand 2. In addition, in this case, the structure in which the organic polymer material layer 52 is arranged on the conductor @ 51F can be obtained by coating the organic polymer material, or by using the organic polymer material layer obtained in advance in the form of a sheet. By heating and pasting it, it is said that it is possible to become a priest.

Next, as shown in the sixth diagram, on the organic polymer material layer 52,
A circular mask H54 made of, for example, aluminum is formed by, for example, photolithography. in this case,
The mask layer 54 is the insulation Pf of the pad layer 5 when viewed from the F direction.
! It has a position and size that fits within the area facing the window No. 8.

Next, as shown in FIG. 6E, the organic polymer layer 52 is masked by etching, for example, reactive ion etching using oxygen gas, using the mask layer 54 for the organic polymer layer 52 as a mask. A region other than the region under the layer 54 is removed, and a continuous column 55 is formed from the organic polymer material in the region under the mask layer 54. In this case, a protective layer 51 is formed under the organic polymer material layer 52, and the pad layer 5 is protected from being etched by the protective layer 51 (a), so that the pad 5 is not etched. It's something that doesn't exist.

Next, as shown in FIG. 6F, the mask layer 54 and the protective layer 51 on the pillars 55 are removed using a common etching solution for them or by using a separate etching solution for each. hand,
On the pad layer 5, a pad 1 made of an organic polymer material and having a cross section smaller than the pad layer 5 is formed. In this case, the pillar 5 of the protective layer 51
The area under the pad layer 5 remains as a layer 56, and the utility pole 55 is formed on the pad layer 5 via the layer 56.

Next, as shown in FIG. 6G, an active layer 58 made of noble metal ions such as P(l ions) is formed on the surface of t155 using a catalyst for electroless plating to be described later. .

Next, as shown in FIG. 6H, the pillars 55 having the active layer 58 formed on their outer surfaces and the pad layer 5 are electrolessly plated with a conductive material such as copper or platinum, as described above. A continuous conductor layer 59 is formed on the outer surface of the pillar 55 and on the pad layer 5, thus forming a conductive layer 59 on the outer surface of the pillar 55 and /<
A structure in which a conductor layer 59 is continuously extended to the RAD layer 5 is formed as an inverted T-shaped microbin 10 when viewed in longitudinal section.

Next, if the conductive layer 59 formed on the outer surface of the pillar 55 constituting the microbin 10 and on the pad layer 5 is not made of a conductive material that easily oxidizes, such as copper, then FIG. As shown, the microbin 10 is plated using a conductive material that is difficult to oxidize, such as platinum, and a conductive layer 59 is formed.
A conductor layer 60 with II oxidation is formed on the surface of the substrate.

Thus, as shown in FIG. 6H or FIG. 61, a wiring layer 6 is formed on the substrate body 1, similar to that described above in FIG. 1, and the wiring layer 6 is formed on the substrate body 1F. The wiring board 9 has a structure connected to a pad layer 5 formed by the wiring board 9, and a microbin 10 for connecting the wiring layer 6 of the wiring board 9 to the outside is planted on the pad layer 5F. , obtain a wiring board with a microbin (J).

From this point forward, the first embodiment of the manufacturing method of the wiring board U with microbins according to the present invention has been revealed, but according to the manufacturing method that is refused, the wiring layer 6 is formed on the board body 1. , a step (sixth
Figure A), and the process of forming a round strip 155 on the pad layer 5 of the wiring board 9 (Figures 6 B to F) with a polymeric material that has a small cross section. ) A conductor layer 59 that extends continuously on the outer surface of the pillar 55 and the pad layer 5 is formed by plating treatment, and
A step of forming a microbin 10 with a structure in which five conductor layers are continuously extended on top (No. C"+l'i
4 G and H) to obtain the intended microphone 11/J wiring board U, and then as in the case of the conventional manufacturing method described above in FIGS. 4 and 5. Since there is no need to take a lot of time and effort to plant a plurality of separately prepared microbins 10 on a plurality of pad layers 5 of a wiring board 9 which can be prepared in advance, the desired wiring with microbins can be achieved. The substrate (J) can be easily obtained as having a structure in which the microbin 10 is accurately positioned and planted at a predetermined position on the pad layer 5 with respect to the substrate (J), and FIGS. Unlike the conventional manufacturing method described above in the figure, the microbin 10 is not 1q starting from the conductor plate, and moreover, the microbin 10 is
The microbin 10 is not composed of a C conductor throughout the entire cross section, but has a configuration in which five conductor layers are formed on the outer surface of the conductor 55 made of an organic polymer material and on the pad 15F. Therefore, less conductor material is required,
Therefore, the present invention has unique characteristics such as being able to provide a desired wiring board with a microbin at a low cost. still,
The above description has only described an example of the method for manufacturing a wiring board with a microphone [1 bottle] according to the present invention.
In the process of forming column 5, the column 5 made of the organic polymer material
5 can also be formed without using the protective layer 51.

Furthermore, a conductor layer 59 made of an organic polymer material that is continuously extended on the outer surface of the pillar 55 and on the pad layer 5 is formed by plating treatment, and the conductor layer 59 is continuously extended on the outer surface of the pillar 55 and on the pad layer 5. The structure in which the layer 59 is formed is the microbin 10.
In the forming process, the plating process can be replaced with electrolytic plating process instead of electroless plating process. Incidentally, the electrolytic plating treatment in this case may be performed by connecting one end of the pad layer 5 to a power source.

Various modifications and changes can be made within the scope of the URL and the spirit of the lot number invention.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing a conventional wiring board with micro-bins; FIG. 2 is a cross-sectional view showing a connector plate used to connect the wiring layers of two wiring boards with micro-bins; Figure 3 is shown in Figure 2] Use the connector board to connect the two -
, a line sectional view showing the state in which the IIA layers of the wiring board with a microbin are connected, and FIGS. It is a sectional view of the route. 6A to 6A to 6A are sequential cross-sectional views of the -L culm showing an embodiment of the method for manufacturing a wiring board with a microbin according to the present invention. 1......Body body 5...
・・・・・・・・・・・・Pad layer 6・・・・・・・・・
・・・・・・Wiring layer 9・・・・・・・・・・・・・・・
Wiring board 10...Micro pin 51...Protective layer 52.
・・・・・・・・・・・・・・・Right machine polymer material layer 5.4・
・・・・・・・・・・・・Mask layer 553...
・・・・・・・・・Column 59 made of organic polymer material...
......, conductor layer 60...
...... Oxidation-resistant conductor layer Applicant: Nippon Telegraph and Telephone Public Corporation l ψ (Oq);

Claims (1)

[Claims] A step of preparing a wiring board having a structure C in which a wiring layer is formed on a thick plate main body, and the wiring layer is connected to a pad layer formed on the main body; A step of forming a conductor layer made of an organic polymer material having a smaller cross section than the pad layer of the wiring board; , a step of forming a conductor layer formed by plating and continuously extending on the outer surface of the hand ↑ and on the pad layer to obtain a microbin structure. Substrate manufacturing method.