JPS58192757A - ポリビニルアセタ−ル系樹脂砥石の製造方法 - Google Patents

ポリビニルアセタ−ル系樹脂砥石の製造方法

Info

Publication number
JPS58192757A
JPS58192757A JP7615682A JP7615682A JPS58192757A JP S58192757 A JPS58192757 A JP S58192757A JP 7615682 A JP7615682 A JP 7615682A JP 7615682 A JP7615682 A JP 7615682A JP S58192757 A JPS58192757 A JP S58192757A
Authority
JP
Japan
Prior art keywords
grinding
resin
pvat
suspension
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7615682A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6339384B2 (enrdf_load_stackoverflow
Inventor
Toshikazu Senda
千田 俊和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Tokushu Kento Co Ltd
Original Assignee
Nippon Tokushu Kento Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Tokushu Kento Co Ltd filed Critical Nippon Tokushu Kento Co Ltd
Priority to JP7615682A priority Critical patent/JPS58192757A/ja
Publication of JPS58192757A publication Critical patent/JPS58192757A/ja
Publication of JPS6339384B2 publication Critical patent/JPS6339384B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • B24D3/30Resins or natural or synthetic macromolecular compounds for close-grained structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP7615682A 1982-05-06 1982-05-06 ポリビニルアセタ−ル系樹脂砥石の製造方法 Granted JPS58192757A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7615682A JPS58192757A (ja) 1982-05-06 1982-05-06 ポリビニルアセタ−ル系樹脂砥石の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7615682A JPS58192757A (ja) 1982-05-06 1982-05-06 ポリビニルアセタ−ル系樹脂砥石の製造方法

Publications (2)

Publication Number Publication Date
JPS58192757A true JPS58192757A (ja) 1983-11-10
JPS6339384B2 JPS6339384B2 (enrdf_load_stackoverflow) 1988-08-04

Family

ID=13597175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7615682A Granted JPS58192757A (ja) 1982-05-06 1982-05-06 ポリビニルアセタ−ル系樹脂砥石の製造方法

Country Status (1)

Country Link
JP (1) JPS58192757A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150162A (ja) * 1986-12-15 1988-06-22 Kanebo Ltd 半導体ウエハ−研磨用砥石
JPH02269569A (ja) * 1989-04-07 1990-11-02 Shinano Denki Seiren Kk 磁気ディスク基盤用多孔質砥石
EP0656031A4 (en) * 1992-08-19 1995-07-26 Rodel Inc POLYMER SUBSTRATES WITH POLYMERIC MICRO ELEMENTS.

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04116965U (ja) * 1991-04-01 1992-10-20 上田繊維興業株式会社 針体と糸体の結合構造
CN108081159B (zh) * 2017-12-13 2019-12-06 衢州学院 一种聚乙烯醇缩醛树脂磨具有机凝胶成型方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115904A (ja) * 1974-07-31 1976-02-07 Mitsubishi Electric Corp Dotaisochi

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115904A (ja) * 1974-07-31 1976-02-07 Mitsubishi Electric Corp Dotaisochi

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150162A (ja) * 1986-12-15 1988-06-22 Kanebo Ltd 半導体ウエハ−研磨用砥石
JPH02269569A (ja) * 1989-04-07 1990-11-02 Shinano Denki Seiren Kk 磁気ディスク基盤用多孔質砥石
EP0656031A4 (en) * 1992-08-19 1995-07-26 Rodel Inc POLYMER SUBSTRATES WITH POLYMERIC MICRO ELEMENTS.
US5578362A (en) * 1992-08-19 1996-11-26 Rodel, Inc. Polymeric polishing pad containing hollow polymeric microelements
US5900164A (en) * 1992-08-19 1999-05-04 Rodel, Inc. Method for planarizing a semiconductor device surface with polymeric pad containing hollow polymeric microelements
US6439989B1 (en) 1992-08-19 2002-08-27 Rodel Holdings Inc. Polymeric polishing pad having continuously regenerated work surface

Also Published As

Publication number Publication date
JPS6339384B2 (enrdf_load_stackoverflow) 1988-08-04

Similar Documents

Publication Publication Date Title
JP6324958B2 (ja) 研磨パッド及びその製造方法
CN110774153B (zh) 一种大尺寸单晶金刚石的抛光方法
KR20020019583A (ko) 미세연마기의 제조방법
JP2004528184A (ja) 研磨工具およびその製造用組成物
EP0438671B1 (en) Abrasive film and method for production thereof
WO2016045536A2 (zh) 一种金刚石抛光膜制备方法
KR100615691B1 (ko) 연마용 부재, 그것을 이용한 연마용 정반 및 연마방법
JPS58192757A (ja) ポリビニルアセタ−ル系樹脂砥石の製造方法
KR100248573B1 (ko) 친수성의 다이아몬드입자 및 그 제조방법
JPH0891957A (ja) 多孔質セラミックの加工法および製品
WO2022011234A1 (en) Bonded abrasive article and method of making the same
JP6626694B2 (ja) 研磨パッド及びその製造方法
JP2006315110A (ja) 研磨剤、その製造方法及び研磨方法
JPS63150162A (ja) 半導体ウエハ−研磨用砥石
JPH10146749A (ja) 乾式バレル研磨用無機質メディア
JP2023148106A (ja) 研磨パッド及びその製造方法
EP0061605B1 (en) Randomly-oriented polycrystalline silicon carbide coatings for abrasive grains
JP2813241B2 (ja) 研磨材及びその製造方法
JP4167441B2 (ja) 研磨剤及びキャリア粒子
Ives et al. Noncontact laminar‐flow polishing for GaAs
JP4688397B2 (ja) キャリア粒子の取扱い方法および研磨剤
JPH09254041A (ja) 合成砥石及びその製造法
JP2001035819A (ja) 研磨スラリー及びこれを用いた研磨方法
JPS63185580A (ja) バフ材
JPH061967A (ja) 研削用砥石及び製造方法