JPS58187260A - アルミニウム金属への半田被着法 - Google Patents

アルミニウム金属への半田被着法

Info

Publication number
JPS58187260A
JPS58187260A JP57072405A JP7240582A JPS58187260A JP S58187260 A JPS58187260 A JP S58187260A JP 57072405 A JP57072405 A JP 57072405A JP 7240582 A JP7240582 A JP 7240582A JP S58187260 A JPS58187260 A JP S58187260A
Authority
JP
Japan
Prior art keywords
zinc
aluminum metal
film
heat sink
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57072405A
Other languages
English (en)
Japanese (ja)
Inventor
Mitsuharu Morishita
森下　光晴
Shiro Iwatani
史朗 岩谷
Mitsuaki Nanba
難波　光明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57072405A priority Critical patent/JPS58187260A/ja
Priority to FR838306769A priority patent/FR2525509B1/fr
Priority to DE19833315062 priority patent/DE3315062A1/de
Publication of JPS58187260A publication Critical patent/JPS58187260A/ja
Priority to US07/246,929 priority patent/US4848646A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemically Coating (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP57072405A 1982-04-26 1982-04-26 アルミニウム金属への半田被着法 Pending JPS58187260A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57072405A JPS58187260A (ja) 1982-04-26 1982-04-26 アルミニウム金属への半田被着法
FR838306769A FR2525509B1 (fr) 1982-04-26 1983-04-25 Procede de depot de soudure sur un materiau en aluminium
DE19833315062 DE3315062A1 (de) 1982-04-26 1983-04-26 Verfahren zur abscheidung von lot auf aluminiummetallmaterial
US07/246,929 US4848646A (en) 1982-04-26 1988-09-19 Method for depositing solder onto aluminum metal material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57072405A JPS58187260A (ja) 1982-04-26 1982-04-26 アルミニウム金属への半田被着法

Publications (1)

Publication Number Publication Date
JPS58187260A true JPS58187260A (ja) 1983-11-01

Family

ID=13488336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57072405A Pending JPS58187260A (ja) 1982-04-26 1982-04-26 アルミニウム金属への半田被着法

Country Status (4)

Country Link
US (1) US4848646A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS58187260A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3315062A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2525509B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101464A (ja) * 1985-10-29 1987-05-11 Alps Electric Co Ltd サ−マルヘツドの製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3406542A1 (de) * 1984-02-23 1985-08-29 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum herstellen eines halbleiterbauelementes
GB2221415B (en) * 1988-08-04 1991-04-17 Ferranti Int Signal A method of brazing articles containing aluminium.
DE4316175A1 (de) * 1993-05-14 1994-11-17 Daimler Benz Ag Lötverbindung und Lötverfahren
DE19837946A1 (de) * 1998-08-21 2000-02-24 Asea Brown Boveri Verfahren zur Bestückung eines Substrates mit Halbleiterchips
TW574750B (en) * 2001-06-04 2004-02-01 Siliconware Precision Industries Co Ltd Semiconductor packaging member having heat dissipation plate
JP4160518B2 (ja) * 2004-02-06 2008-10-01 Ｄｏｗａホールディングス株式会社 金属−セラミックス接合部材およびその製造方法
CA2596018C (en) * 2005-02-08 2015-11-03 Dyno Nobel Inc. Delay units and methods of making the same
US8794152B2 (en) 2010-03-09 2014-08-05 Dyno Nobel Inc. Sealer elements, detonators containing the same, and methods of making
CN106271220B (zh) * 2016-08-30 2018-10-23 北京有色金属与稀土应用研究所 一种铝合金焊前表面预活化处理助剂及预活化处理方法
CN115011953A (zh) * 2022-06-21 2022-09-06 深圳芯源新材料有限公司 一种复杂结构自适应的可焊接柔性金属垫片及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830634A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1971-08-25 1973-04-23
JPS5484835A (en) * 1977-12-19 1979-07-06 Toshiba Corp Surface treatment of al and al alloy for soldering

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2995814A (en) * 1957-10-11 1961-08-15 Harold A Chamness Method for soldering aluminum
GB917296A (en) * 1960-06-21 1963-01-30 Serck Radiators Ltd A method of uniting aluminium parts
US3216835A (en) * 1960-10-06 1965-11-09 Enthone Synergistic chelate combinations in dilute immersion zincate solutions for treatment of aluminum and aluminum alloys
CH414317A (de) * 1962-05-25 1966-05-31 Budavox Budapesti Hiradastechn Verfahren zur Vorbereitung von Aluminium oder Aluminiumlegierungen für das Weichlöten
US3202529A (en) * 1962-08-08 1965-08-24 Sperry Rand Corp Disposition of nickel-cobalt alloy on aluminum substrates
JPS4841881B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1969-04-07 1973-12-10
BE756380A (fr) * 1969-10-22 1971-03-01 Chausson Usines Sa Procede de traitement pour le decapage et la protection de pieces en aluminium et alliages de ce metal devant etre
US3726771A (en) * 1970-11-23 1973-04-10 Stauffer Chemical Co Process for chemical nickel plating of aluminum and its alloys
US3672964A (en) * 1971-03-17 1972-06-27 Du Pont Plating on aluminum,magnesium or zinc
US3738818A (en) * 1971-06-03 1973-06-12 Control Data Corp High recording density magnetic media with square b-h loop
US4372996A (en) * 1972-05-09 1983-02-08 Massachusetts Institute Of Technology Method for metallizing aluminum pads of an integrated circuit chip
US3909209A (en) * 1973-11-05 1975-09-30 Gould Inc Method of treating aluminum and aluminum alloys and article produced thereby
US3932685A (en) * 1973-11-09 1976-01-13 Motorola, Inc. Aluminum stabilization process and stabilization solution therefor
SE380549B (sv) * 1974-03-22 1975-11-10 Nordstjernan Rederi Ab Forfarande for beleggning av foremal av aluminium, magnesium eller legeringar, som innehaller aluminium och/eller magnesium med en metall
US3982055A (en) * 1974-07-25 1976-09-21 Eltra Corporation Method for zincating aluminum articles
SE7601702L (sv) * 1975-04-18 1976-10-19 Stauffer Chemical Co Forfarande for pletering av metaller
GB1525864A (en) * 1975-09-16 1978-09-20 Stauffer Chemical Co Thermally agglomerated vinyl chloride resin
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US4150172A (en) * 1977-05-26 1979-04-17 Kolk Jr Anthony J Method for producing a square loop magnetic media for very high density recording
US4157154A (en) * 1977-11-21 1979-06-05 Hughes Aircraft Company Method for forming patterns of brazing alloy
US4246147A (en) * 1979-06-04 1981-01-20 International Business Machines Corporation Screenable and strippable solder mask and use thereof
US4346128A (en) * 1980-03-31 1982-08-24 The Boeing Company Tank process for plating aluminum substrates including porous aluminum castings
US4400415A (en) * 1981-08-13 1983-08-23 Lea Ronal, Inc. Process for nickel plating aluminum and aluminum alloys

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830634A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1971-08-25 1973-04-23
JPS5484835A (en) * 1977-12-19 1979-07-06 Toshiba Corp Surface treatment of al and al alloy for soldering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101464A (ja) * 1985-10-29 1987-05-11 Alps Electric Co Ltd サ−マルヘツドの製造方法

Also Published As

Publication number Publication date
FR2525509A1 (fr) 1983-10-28
DE3315062C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-03-31
DE3315062A1 (de) 1983-10-27
US4848646A (en) 1989-07-18
FR2525509B1 (fr) 1985-07-26

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