JPS58175847A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58175847A
JPS58175847A JP57057241A JP5724182A JPS58175847A JP S58175847 A JPS58175847 A JP S58175847A JP 57057241 A JP57057241 A JP 57057241A JP 5724182 A JP5724182 A JP 5724182A JP S58175847 A JPS58175847 A JP S58175847A
Authority
JP
Japan
Prior art keywords
wiring
polysilicon
film
gate electrode
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57057241A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0554263B2 (cs
Inventor
Sunao Shibata
直 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP57057241A priority Critical patent/JPS58175847A/ja
Publication of JPS58175847A publication Critical patent/JPS58175847A/ja
Publication of JPH0554263B2 publication Critical patent/JPH0554263B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
JP57057241A 1982-04-08 1982-04-08 半導体装置の製造方法 Granted JPS58175847A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57057241A JPS58175847A (ja) 1982-04-08 1982-04-08 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57057241A JPS58175847A (ja) 1982-04-08 1982-04-08 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58175847A true JPS58175847A (ja) 1983-10-15
JPH0554263B2 JPH0554263B2 (cs) 1993-08-12

Family

ID=13050031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57057241A Granted JPS58175847A (ja) 1982-04-08 1982-04-08 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58175847A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6258663A (ja) * 1985-09-09 1987-03-14 Nippon Telegr & Teleph Corp <Ntt> 半導体装置の製造方法
US4717689A (en) * 1984-09-18 1988-01-05 U.S. Philips Corporation Method of forming semimicron grooves in semiconductor material
JPS6419722A (en) * 1987-06-26 1989-01-23 Hewlett Packard Yokogawa Integrated circuit and manufacture thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717689A (en) * 1984-09-18 1988-01-05 U.S. Philips Corporation Method of forming semimicron grooves in semiconductor material
JPS6258663A (ja) * 1985-09-09 1987-03-14 Nippon Telegr & Teleph Corp <Ntt> 半導体装置の製造方法
JPS6419722A (en) * 1987-06-26 1989-01-23 Hewlett Packard Yokogawa Integrated circuit and manufacture thereof

Also Published As

Publication number Publication date
JPH0554263B2 (cs) 1993-08-12

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