JPS58166750A - 集積回路の冷却装置 - Google Patents

集積回路の冷却装置

Info

Publication number
JPS58166750A
JPS58166750A JP4907982A JP4907982A JPS58166750A JP S58166750 A JPS58166750 A JP S58166750A JP 4907982 A JP4907982 A JP 4907982A JP 4907982 A JP4907982 A JP 4907982A JP S58166750 A JPS58166750 A JP S58166750A
Authority
JP
Japan
Prior art keywords
semiconductor chip
melting point
low melting
point metal
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4907982A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340952B2 (cs
Inventor
Noriyuki Ashiwake
芦分　範行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4907982A priority Critical patent/JPS58166750A/ja
Publication of JPS58166750A publication Critical patent/JPS58166750A/ja
Publication of JPH0340952B2 publication Critical patent/JPH0340952B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP4907982A 1982-03-29 1982-03-29 集積回路の冷却装置 Granted JPS58166750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4907982A JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4907982A JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Publications (2)

Publication Number Publication Date
JPS58166750A true JPS58166750A (ja) 1983-10-01
JPH0340952B2 JPH0340952B2 (cs) 1991-06-20

Family

ID=12821080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4907982A Granted JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Country Status (1)

Country Link
JP (1) JPS58166750A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
US5132776A (en) * 1988-10-28 1992-07-21 Sumitomo Electric Industries, Ltd. Member for carrying a semiconductor device
US6243944B1 (en) * 1997-12-08 2001-06-12 Unisys Corporation Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
US6867976B2 (en) * 2002-02-12 2005-03-15 Hewlett-Packard Development Company, L.P. Pin retention for thermal transfer interfaces, and associated methods
FR3138563A1 (fr) * 2022-07-27 2024-02-02 Safran Electronics & Defense Drain thermique pour une carte électronique

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
US5132776A (en) * 1988-10-28 1992-07-21 Sumitomo Electric Industries, Ltd. Member for carrying a semiconductor device
US6243944B1 (en) * 1997-12-08 2001-06-12 Unisys Corporation Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
US6867976B2 (en) * 2002-02-12 2005-03-15 Hewlett-Packard Development Company, L.P. Pin retention for thermal transfer interfaces, and associated methods
FR3138563A1 (fr) * 2022-07-27 2024-02-02 Safran Electronics & Defense Drain thermique pour une carte électronique

Also Published As

Publication number Publication date
JPH0340952B2 (cs) 1991-06-20

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