JPS58165335A - テ−プキヤリア方式による半導体装置の製造方法及びその製造装置 - Google Patents

テ−プキヤリア方式による半導体装置の製造方法及びその製造装置

Info

Publication number
JPS58165335A
JPS58165335A JP57048674A JP4867482A JPS58165335A JP S58165335 A JPS58165335 A JP S58165335A JP 57048674 A JP57048674 A JP 57048674A JP 4867482 A JP4867482 A JP 4867482A JP S58165335 A JPS58165335 A JP S58165335A
Authority
JP
Japan
Prior art keywords
chip
tape carrier
bonding
stage
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57048674A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131694B2 (ko
Inventor
Hiroshi Aoyama
弘 青山
Minoru Okamura
岡村　實
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57048674A priority Critical patent/JPS58165335A/ja
Publication of JPS58165335A publication Critical patent/JPS58165335A/ja
Publication of JPH0131694B2 publication Critical patent/JPH0131694B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57048674A 1982-03-26 1982-03-26 テ−プキヤリア方式による半導体装置の製造方法及びその製造装置 Granted JPS58165335A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57048674A JPS58165335A (ja) 1982-03-26 1982-03-26 テ−プキヤリア方式による半導体装置の製造方法及びその製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57048674A JPS58165335A (ja) 1982-03-26 1982-03-26 テ−プキヤリア方式による半導体装置の製造方法及びその製造装置

Publications (2)

Publication Number Publication Date
JPS58165335A true JPS58165335A (ja) 1983-09-30
JPH0131694B2 JPH0131694B2 (ko) 1989-06-27

Family

ID=12809865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57048674A Granted JPS58165335A (ja) 1982-03-26 1982-03-26 テ−プキヤリア方式による半導体装置の製造方法及びその製造装置

Country Status (1)

Country Link
JP (1) JPS58165335A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02109346A (ja) * 1988-10-19 1990-04-23 Marine Instr Co Ltd テープボンディング装置
JPH02131340U (ko) * 1989-04-06 1990-10-31
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141960A (en) * 1974-10-07 1976-04-08 Shinkawa Seisakusho Kk Handotaino waiyabondeinguhoho
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5312790A (en) * 1976-07-23 1978-02-04 Ube Ind Ltd Vapor phase monoalkyl etherification catalyst for divalent phenols
JPS5417627A (en) * 1977-07-11 1979-02-09 Dainippon Printing Co Ltd Method of producing color stripe filter
JPS5442580A (en) * 1977-09-09 1979-04-04 Hitachi Ltd Positioning system of machine
JPS5443678A (en) * 1977-09-13 1979-04-06 Matsushita Electric Ind Co Ltd Semiconductor element bonding method and its bonding unit
JPS54134974A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Method and device for bonding on tape carrier system
JPS5520378A (en) * 1978-08-01 1980-02-13 Ebara Mfg Differential pressure drafting apparatus
JPS5641172A (en) * 1979-08-31 1981-04-17 Kawasaki Steel Co Multiple water sealing sideewall type liquid storage tank
JPS56158435A (en) * 1980-05-12 1981-12-07 Hitachi Ltd Pellet bonding
JPS56162846A (en) * 1980-05-20 1981-12-15 Citizen Watch Co Ltd Ic gang bonding device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5141960A (en) * 1974-10-07 1976-04-08 Shinkawa Seisakusho Kk Handotaino waiyabondeinguhoho
JPS52149070A (en) * 1976-06-07 1977-12-10 Toshiba Corp Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS5312790A (en) * 1976-07-23 1978-02-04 Ube Ind Ltd Vapor phase monoalkyl etherification catalyst for divalent phenols
JPS5417627A (en) * 1977-07-11 1979-02-09 Dainippon Printing Co Ltd Method of producing color stripe filter
JPS5442580A (en) * 1977-09-09 1979-04-04 Hitachi Ltd Positioning system of machine
JPS5443678A (en) * 1977-09-13 1979-04-06 Matsushita Electric Ind Co Ltd Semiconductor element bonding method and its bonding unit
JPS54134974A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Method and device for bonding on tape carrier system
JPS5520378A (en) * 1978-08-01 1980-02-13 Ebara Mfg Differential pressure drafting apparatus
JPS5641172A (en) * 1979-08-31 1981-04-17 Kawasaki Steel Co Multiple water sealing sideewall type liquid storage tank
JPS56158435A (en) * 1980-05-12 1981-12-07 Hitachi Ltd Pellet bonding
JPS56162846A (en) * 1980-05-20 1981-12-15 Citizen Watch Co Ltd Ic gang bonding device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02109346A (ja) * 1988-10-19 1990-04-23 Marine Instr Co Ltd テープボンディング装置
JPH02131340U (ko) * 1989-04-06 1990-10-31
JPH0711467Y2 (ja) * 1989-04-06 1995-03-15 株式会社リコー インナリードボンディング装置
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法
JPH0574223B2 (ko) * 1989-08-31 1993-10-18 Seiko Epson Corp

Also Published As

Publication number Publication date
JPH0131694B2 (ko) 1989-06-27

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