JPS58160925A - Production of electrode plate - Google Patents

Abstract

PURPOSE:To obtain electrodes of metallic films free from short circuiting, etc. by forming a metallic film over the entire surface of a panel substrate for liquid crystal elements, covering the film surface with an Au film, etching the Au film to required patterns, and etching the underlying metallic film then further etching the Au film again. CONSTITUTION:A transparent electrode 1 is provided on the surface of a panel substrate 2 for liquid crystal TVs, etc., whereafter a metallic film 5 of the 1st layer consisting of Cr, a Cr alloy or Ti, a metallic film 6 of the 2nd layer consisting of Ni or a Cu film, and an Au film 7 are formed successively over the entire surface. Photoresist patterns 8 are formed on the film 7. The Au film 7 is first etched, then the film 6 and the film 5 are etched successively with respective etching solns. The etching of the film 6 in this stage progresses abnormally at the interface with the film 7 and the film 7 overhangs. Thereupon, the film 7 is etched again, and after the overhangs are removed, the resist film 8 is removed. Then, the contact and short circuiting of the overhang parts of the film 7 with the adjacent electrodes 1 and consequent generation of defectives are prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electrode plate, and more particularly to a method of manufacturing an electrode plate used in display panels, transparent panel heaters, and the like.

Conventional electrode structures for liquid crystal display panels include Cr--Ni films, Cr--Cu, NiCr--Cu, and Ti--Ni.

Although Ti-cu and the like have been proposed, the Ni and Cu film surfaces are easily oxidized, resulting in poor solder wettability and a failure to occur during soldering.

An object of the present invention is to provide a method for manufacturing an electrode plate that can form a fine electrode pattern and has good solder wettability.

The method for manufacturing an electrode plate of the present invention that achieves the above object is characterized by a first step of covering one main surface of the substrate on which a transparent electrode is formed with a metal film, and a step of covering the metal film with an Au film. a second step; a third step of etching the Au film with a mask having a predetermined pattern; a step @4 of etching the metal film with a mask having a predetermined pattern; and a fifth step of etching the Au film again using the mask having the predetermined pattern shape.

In recent years, the images of liquid crystal display elements used in liquid crystal televisions and graph ink displays need to be made finer, and a method for forming transparent 'TIIIL poles and gold retinal electrodes on the display panels has become necessary. It's here. As mentioned above, an example of using a 2# metal film such as Cr-Ni as a metal film electrode has been proposed;
The surface of u was oxidized, and the solder wettability of the connection terminal portion with the external circuit deteriorated, resulting in poor connection. Therefore, we decided to form Au to prevent oxidation on the surfaces of Ni and Cu, but when etching the Au metal film, the ends of the Au film peeled off and came into contact with the adjacent terminals. As a result, a short circuit occurred inside the liquid crystal panel, resulting in a defect. So, what about Au metal film and etching? Proceed, then again, Au
By etching Au in the etching solution of
Prevents peeling of edges, has good solder wettability, and
Form a fine pattern of metal film electrodes.

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an example of a matrix type liquid crystal display element to which the present invention is fully applied. In-snow OB provided on a substrate 2 made of glass, plastic, etc.

A transparent electrode made of SnO, a mixture thereof, etc., 3 is provided on the transparent electrode 1 or the substrate 2, C1-N
The metal film electrode of i-A u, 4 is a connection terminal with an external circuit. The pixel portion is formed of a transparent electrode, and the portion 4, which applies an electric signal thereto and serves as a connection terminal with an external circuit, uses a metal film electrode formed at the same time.

Figure 2 shows a cross-sectional view of the glass substrate 2 on which a transparent electrode pattern is formed. As shown in FIG. 3, C? 5. Ni6,
- A u 7 film is laminated during assembly. Also, following @4
As shown in the figure, 8 photoresist patterns for forming metal patterns are formed. Next, the substrate is immersed in an etching solution for the Au film 7, and the Au film 7') is etched into the shape shown in FIG. Next, in order to etch the Ni film 6, it is immersed in an etching solution for the Ni film 6, but at this time,
The Ni film 6 is abnormally etched at the interface between the N1 film 6 and the Au film 7, and as shown in FIG.
The etching shape is such that the etching solution of the N1 film 6 at the interface of the mask 7 has penetrated. Next, the substrate is immersed in an etching solution for the Cr film 5, and the Cr film 5 is etched into the shape shown in FIG. The etching process is thus completed, and the photoresist frFi residue becomes as shown in FIG. 8. here,
The thickness of the transparent electrode 1 is 150 nm%, and the thickness of the Cr film 5 is 110 nm%.
When the thickness of 0n%Ni 6 is 1l100n%Au1l (7) and the thickness is 1000m, the eave-shaped part shown in Figure 8 is cut off because the Au film is thin, and as shown in Figure 9. A contact short circuit occurred with the adjacent electrode, resulting in a defective tube.Here, the width of the eaves part of this Au film 7 is
It was about 3 to 5 μm. Note that the Au7.
Ni6. The composition of the Cr5 etching solution is shown below.

Etching solution for Au7 (aqueous solution) Etching solution for Ni6 Etching solution for Cr5 (aqueous solution) These etching solution companies may use other composition ratios or other etching solution compositions, but here we will discuss the results with this composition. ing.

Therefore, we will show an example of how this method was applied to the process with Jioki Mingkai.

First, a pattern having the shape shown in FIG. 7 was formed using a conventional process. Next, by immersing the substrate tube in an Au7 etching solution again, the eaves-shaped portion of the Au film is partially etched and removed. The shape at this time is shown in FIG. Next, the photoresist pattern is removed to form the shape shown in FIG. Therefore, since the shape is shown in Figure @12, the phenomenon in which the edge part of the Au film 7 is peeled off and comes in contact with the # contact and the defective part is caused as shown in Figure 9 can be avoided. It can be prevented.

In another embodiment, in a conventional process, as shown in FIG.
In other words, proceed to etching of Ni6, then proceed to etching of Au.
The eaves part 1 of Au7 was immersed in the etching solution of step 7.
Even if the photoresist is removed by etching Cr5 and the photoresist is removed, a defect-free electrode plate can be produced in the same way.

There is no need to limit the metal film to a Cr-Ni film; it has low electrical resistance, is easy to photo-etch, can be patterned with high precision, has good adhesion to the substrate and transparent conductive film, and has good solderability. Metals that satisfy chemically high properties, Cr-Cu, NiCr-Cu,
The present invention can also be applied to Ti-Ni, Ti-Cu, etc.

According to the present invention, a fine electrode pattern can be formed on the electrode plate iK, and an electrode pattern for an electrode connection terminal portion with good solder wettability and an electrode pattern for applying an electric signal to one pixel can be simultaneously formed. effective.

[Brief explanation of drawings]

FIG. 1 is a pattern diagram of an embodiment of an electrode plate to which the present invention can be applied, FIGS. 2, 3, 4, 5, 6, and 7.
8, 10, and 11 are cross-sectional views of an embodiment of an electrode plate to which the present invention can be applied, and FIGS. 9 and 12 are perspective views of an embodiment of an electrode plate to which the present invention can be applied. It is a diagram. DESCRIPTION OF SYMBOLS 1... Transparent electrode, 2... Glass substrate, 3... Metal film electrode, 4... Connection terminal part, 5... Cr film, 6...
・Ni film, 7...Dream l Eye bud 2 eyes/ //2 5th Lu δ 8th eye 1o Mouth δ 120th

Claims (1)

[Claims] 1. One main surface of the substrate on which the transparent electrode is formed is made of gold J4.
a first step of covering the metal film with a film, a second step of covering the metal film with the frAu film, a third step of etching the Au film with a mask having a predetermined pattern shape, and a step of etching the metal film with the predetermined pattern. A method for manufacturing an electrode plate, comprising: a fourth step of etching the A13 film using a mask having a predetermined pattern; and a fifth step of etching the A13 film again using a mask having a predetermined pattern. 2.Specific #'Fllll In the first item, the metal film is made of Cr, Cr alloy, or Ti.
A method for manufacturing a monopolar plate, characterized in that it is formed from M and a second layer consisting of the @1 layer hg layer T4, Ni, or Cu.