JPS58157135U - 指圧板 - Google Patents
指圧板Info
- Publication number
- JPS58157135U JPS58157135U JP5576082U JP5576082U JPS58157135U JP S58157135 U JPS58157135 U JP S58157135U JP 5576082 U JP5576082 U JP 5576082U JP 5576082 U JP5576082 U JP 5576082U JP S58157135 U JPS58157135 U JP S58157135U
- Authority
- JP
- Japan
- Prior art keywords
- board
- shiatsu
- acupressure
- protrusions
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finger-Pressure Massage (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は本考案の実施例の平面図、第2図は第1図にお
けるI−I線の拡大断面図である。 1・・・板状体、2・・・突起、3・・・指圧体、4・
・・連結指圧体。
けるI−I線の拡大断面図である。 1・・・板状体、2・・・突起、3・・・指圧体、4・
・・連結指圧体。
Claims (1)
- 表面に多数の突起を配設した板状体、および所要の突起
に着脱自在に装着した指圧体からなる指圧板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5576082U JPS58157135U (ja) | 1982-04-17 | 1982-04-17 | 指圧板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5576082U JPS58157135U (ja) | 1982-04-17 | 1982-04-17 | 指圧板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58157135U true JPS58157135U (ja) | 1983-10-20 |
Family
ID=30066319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5576082U Pending JPS58157135U (ja) | 1982-04-17 | 1982-04-17 | 指圧板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58157135U (ja) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8846517B2 (en) | 2012-07-06 | 2014-09-30 | Micron Technology, Inc. | Methods of forming a pattern on a substrate |
| US8852851B2 (en) | 2006-07-10 | 2014-10-07 | Micron Technology, Inc. | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same |
| US8901700B2 (en) | 2008-05-05 | 2014-12-02 | Micron Technology, Inc. | Semiconductor structures |
| US9153458B2 (en) | 2011-05-05 | 2015-10-06 | Micron Technology, Inc. | Methods of forming a pattern on a substrate |
| US9177794B2 (en) | 2012-01-13 | 2015-11-03 | Micron Technology, Inc. | Methods of patterning substrates |
| US9330934B2 (en) | 2009-05-18 | 2016-05-03 | Micron Technology, Inc. | Methods of forming patterns on substrates |
-
1982
- 1982-04-17 JP JP5576082U patent/JPS58157135U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8852851B2 (en) | 2006-07-10 | 2014-10-07 | Micron Technology, Inc. | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same |
| US9305782B2 (en) | 2006-07-10 | 2016-04-05 | Micron Technology, Inc. | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same |
| US8901700B2 (en) | 2008-05-05 | 2014-12-02 | Micron Technology, Inc. | Semiconductor structures |
| US9330934B2 (en) | 2009-05-18 | 2016-05-03 | Micron Technology, Inc. | Methods of forming patterns on substrates |
| US9153458B2 (en) | 2011-05-05 | 2015-10-06 | Micron Technology, Inc. | Methods of forming a pattern on a substrate |
| US9177794B2 (en) | 2012-01-13 | 2015-11-03 | Micron Technology, Inc. | Methods of patterning substrates |
| US8846517B2 (en) | 2012-07-06 | 2014-09-30 | Micron Technology, Inc. | Methods of forming a pattern on a substrate |
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