JPS58154658A - Method for detecting pin-hole of gold-plated film - Google Patents

Method for detecting pin-hole of gold-plated film

Info

Publication number
JPS58154658A
JPS58154658A JP57037060A JP3706082A JPS58154658A JP S58154658 A JPS58154658 A JP S58154658A JP 57037060 A JP57037060 A JP 57037060A JP 3706082 A JP3706082 A JP 3706082A JP S58154658 A JPS58154658 A JP S58154658A
Authority
JP
Japan
Prior art keywords
case
prescribed
plating
nitric acid
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57037060A
Other languages
Japanese (ja)
Inventor
Yoshinori Takakura
高倉 義憲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57037060A priority Critical patent/JPS58154658A/en
Publication of JPS58154658A publication Critical patent/JPS58154658A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/91Investigating the presence of flaws or contamination using penetration of dyes, e.g. fluorescent ink

Abstract

PURPOSE:To detect the existing number of pin-holes on a prescribed surface area at a glance, by plating Au in prescribed thickness on the surface of Cu, Ni or Ag plating, reacting the Au plating with nitric acid gas and then reaciting the exposed Cu, Ni or Ag with ammonium polysulfide solution to generate a color. CONSTITUTION:When nitric acid 2 is put on the bottom of a case (desiccator) 3 and the case 3 is left as it is for a prescribed period, the inside of the case 3 is filled with nitric acid gas. Subsequently, substances 1 each of which is obtained by plating Au with prescribed thickness on the surface of the Cu, Ni, or Ag plating with prescribed thickness are quickly inserted into the case filled with nitric acid gas, a cover 4 is put on the case and then the case is left as it is under said condition for a prescribed period. After the prescribed period, these substances 1 are taken out from the case 3 and left in the furnace at 120 deg.C for a prescribed time. Filter paper dipped in the ammonium polysulfide solution is attached to the substances 1 to color the substances. Thus the existence of pin-holes on the Au plated film is precisely detected and the existing number of pin-holes on a prescribed surface area can be observed through eyes.

Description

【発明の詳細な説明】 この発明は金めっき膜のピン・ホール検出方法に係り、
さらに詳しくは、所要厚さの銅又はニッケル又は銀めっ
き上に所要厚さの金めつきを施こし、上記めっき物を硝
酸ガスと反応させ。
[Detailed Description of the Invention] The present invention relates to a method for detecting pin holes in a gold plating film,
More specifically, a required thickness of gold plating is applied to a required thickness of copper, nickel, or silver plating, and the plated material is reacted with nitric acid gas.

ピンホール部から露出した下地めっきの銅、又はニッケ
ル、又は銀と多硫化アンモニウム溶液と反応させ呈色さ
せることを特徴とするピン・ホール検出方法を提案しよ
うとするものである。
This paper attempts to propose a pinhole detection method characterized by reacting base plating copper, nickel, or silver exposed from the pinhole area with an ammonium polysulfide solution to develop a color.

従来において、ピン・ホールを検出する方法として ■呈色液をろ紙に浸し、めっき品に当てる方法。Conventionally, as a method for detecting pin holes, ■Method of soaking filter paper in coloring liquid and applying it to the plated item.

■電子顕微鏡により拡大して観察する方法、が中心であ
った。
■The method of magnifying observation using an electron microscope was the main method.

しかしながら、■の方法は呈色が明確でなく。However, in method (■), the coloration is not clear.

ピン・ホールの存在がはっきりしない。The existence of pin holes is not clear.

−万〇の方法は直径1m以下のスポットが拡大されてい
るだけで所定の表面積に何個のピン・ホールがあるかを
確認するには長時間を要する。
- The 10,000 method only magnifies a spot with a diameter of 1 m or less, and it takes a long time to confirm how many pin holes are on a given surface area.

この発明は、このような従来のピン・ホール検出方法の
改善を図るもので、所要厚さの銅又は、ニッケル又は、
銀めりき上に所要厚さの金めつきを施こし、所定時間硝
酸ガスが充満した容器に暴露させた後、温度120“O
K加温した炉に所要時間入れ、その後上記めっき物の表
面に多硫化アンモニウム溶液を浸したろ紙を当て呈色さ
せることによってピンホールを検出する方法を提案する
ものである。
The present invention aims to improve the conventional pin hole detection method, and aims to improve the conventional pin hole detection method.
After applying gold plating to the required thickness on the silver plating and exposing it to a container filled with nitric acid gas for a predetermined period of time, the temperature was 120°C.
The present invention proposes a method for detecting pinholes by placing the plated material in a furnace heated to K for a required period of time, and then applying a filter paper soaked in an ammonium polysulfide solution to the surface of the plated material to color it.

以下図によってこの発明による方法を説明する。The method according to the invention will be explained below with reference to the figures.

図は、この発明による工程を示したものである。The figure shows the process according to the invention.

容器(3)には密閉できるようなデシケータを用い、容
器(3)の底に硝酸(2)を入れ、所要時間放置する。
A desiccator that can be sealed tightly is used for the container (3), and nitric acid (2) is poured into the bottom of the container (3) and left for a required period of time.

その後、容器(3)には硝酸ガスが充満するので、すげ
やく、所要厚さの銅、又はニッケル。
After that, the container (3) is filled with nitric acid gas, and the required thickness of copper or nickel is quickly deposited.

又は銀めっき上に所要厚さの金めつきを施こした物品1
11を入れふた(4)をかぶせ、上記の状態で所定時間
放置する。
Or an article 1 with gold plating of the required thickness on silver plating
11, cover with the lid (4), and leave in the above condition for a predetermined period of time.

その後、物品+11を容器(3)から取り出し、温度1
20 ’0の炉に所要時間入れ放置する。
After that, the article +11 was taken out from the container (3) and the temperature was 1.
Place in a furnace at 20'0 and leave for the required time.

次に多硫化アンモニウム溶液を浸したろ紙を上記の物品
(1)に当て呈色させる。
Next, filter paper soaked in ammonium polysulfide solution is applied to the above article (1) to develop color.

この発明は以上のようになっているから、金めつき膜の
ピン・ホールの存在が明確になシ。
Since this invention is as described above, the presence of pin holes in the gold-plated film is clearly visible.

所定の表面積に何個存在するか祈認できる。You can check how many are present on a given surface area.

次にこの発明の方法をより詳しく説明するた〔実施例〕 (イ)硝酸ガス暴露 常温、60分 (ロ)炉中でベーキング 温度120±5゛c。Next, in order to explain the method of this invention in more detail, [Example] (a) Nitric acid gas exposure: room temperature, 60 minutes (b) Baking in an oven at a temperature of 120±5°C.

30分 (ハ)ろ紙を硫化アンモニウム に)溶液中に浸漬 常温、5〜15秒 (ホ)(ハ)項のろ紙を(ロ)項でベーキングしためっ
き物の表面に当てる。
30 minutes (c) Immerse the filter paper in the ammonium sulfide solution at room temperature for 5 to 15 seconds (e) Apply the filter paper from item (c) to the surface of the plated product baked in item (b).

(へ) ピン中ホール部黒色に変化 (ト)観察(ピン−ホール数/(d) 以上のように、この発明の方法を用いればピン・ホール
部が黒く呈色するので容易に観察され、所定の表面積に
何個ピン・ホールが存在するかが一目でわかるので、ピ
ン・ポール検出方法として広く推奨できるものである。
(f) The center hole of the pin changes to black (g) Observation (Number of pin-holes/(d)) As described above, if the method of this invention is used, the pin-hole becomes black and can be easily observed. Since it is possible to see at a glance how many pin holes are present in a given surface area, this method is widely recommended as a pin/pole detection method.

【図面の簡単な説明】[Brief explanation of drawings]

図はこの発明の特徴であるピンホール検出方法を示す図
で、(1)は銅又はニッケル又は欽めっき上に金めつき
を陥こした物品、(2)は硝酸、(4)けふたである。 代理人 葛 野 信 −
The figure shows the pinhole detection method that is a feature of this invention, in which (1) is an article with gold plating on copper, nickel, or aluminum plating, (2) is with nitric acid, and (4) is with keratin. be. Agent Shin Kuzuno −

Claims (1)

【特許請求の範囲】[Claims] 所要厚さの銅又は、ニッケル、あるいは銀めっき上に、
所要厚さの金めつきを施こし、上記めっき物を所要時間
硝酸ガスが充満した容器に暴露させた後、温度120°
C[7J]温した炉に所要時間入れ、その後、上記めっ
き物の表面に多硫化アン−モニウム溶液を浸したろ紙を
当て呈色させることによってピンホールの検出を行うよ
うにした金めつき膜のピンホール検出方法。
On copper, nickel, or silver plating of the required thickness,
After applying gold plating to the required thickness and exposing the plated product to a container filled with nitric acid gas for the required time, the plated product was heated to a temperature of 120°.
C [7J] A gold-plated film in which pinholes are detected by placing it in a heated furnace for the required time, and then applying a filter paper soaked in ammonium polysulfide solution to the surface of the plated material to color it. pinhole detection method.
JP57037060A 1982-03-09 1982-03-09 Method for detecting pin-hole of gold-plated film Pending JPS58154658A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57037060A JPS58154658A (en) 1982-03-09 1982-03-09 Method for detecting pin-hole of gold-plated film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57037060A JPS58154658A (en) 1982-03-09 1982-03-09 Method for detecting pin-hole of gold-plated film

Publications (1)

Publication Number Publication Date
JPS58154658A true JPS58154658A (en) 1983-09-14

Family

ID=12487012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57037060A Pending JPS58154658A (en) 1982-03-09 1982-03-09 Method for detecting pin-hole of gold-plated film

Country Status (1)

Country Link
JP (1) JPS58154658A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276064A (en) * 1988-04-27 1989-11-06 Eagle Ind Co Ltd Detecting device for pin hole of plating
JP2007080924A (en) * 2005-09-12 2007-03-29 Showa Denko Kk Manufacturing method of semiconductor light emitting element
JP2009168691A (en) * 2008-01-17 2009-07-30 Sumitomo Electric Ind Ltd Evaluation method of pinhole
JP2009168692A (en) * 2008-01-17 2009-07-30 Sumitomo Electric Ind Ltd Evaluation method of pinhole
CN103575736A (en) * 2012-07-30 2014-02-12 现代自动车株式会社 Pinhole inspection system and apparatus for membrane electrode assembly of fuel cell

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01276064A (en) * 1988-04-27 1989-11-06 Eagle Ind Co Ltd Detecting device for pin hole of plating
JP2007080924A (en) * 2005-09-12 2007-03-29 Showa Denko Kk Manufacturing method of semiconductor light emitting element
JP2009168691A (en) * 2008-01-17 2009-07-30 Sumitomo Electric Ind Ltd Evaluation method of pinhole
JP2009168692A (en) * 2008-01-17 2009-07-30 Sumitomo Electric Ind Ltd Evaluation method of pinhole
CN103575736A (en) * 2012-07-30 2014-02-12 现代自动车株式会社 Pinhole inspection system and apparatus for membrane electrode assembly of fuel cell

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