JPS58131732A - Mask alignment device - Google Patents

Mask alignment device

Info

Publication number
JPS58131732A
JPS58131732A JP57013851A JP1385182A JPS58131732A JP S58131732 A JPS58131732 A JP S58131732A JP 57013851 A JP57013851 A JP 57013851A JP 1385182 A JP1385182 A JP 1385182A JP S58131732 A JPS58131732 A JP S58131732A
Authority
JP
Japan
Prior art keywords
mask
glass
substrate
mask alignment
masks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57013851A
Other languages
Japanese (ja)
Inventor
Toshiro Sakane
坂根 敏朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57013851A priority Critical patent/JPS58131732A/en
Publication of JPS58131732A publication Critical patent/JPS58131732A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Abstract

PURPOSE:To perform mask alignment of both faces, i.e. the surface and the back of a substrate efficiently and moreover with high precision without using a peculiar microscope by a method wherein the device is constructed as to make a glass mask for the back to be interposed between a supporting desk and the substrate, while as to make a beam of light irradiate the glass mask for the back passing through the supporting desk. CONSTITUTION:For performance of mask alignment, a glass mask 4 for the surface is made to descend at first, the distance between the glass mask 5 for the back is regulated to the necessary value according to thickness of the substrate 2 to perform mask alignment thereafter, and mask alignment of both the glass masks 4, 5 for the surface and the back is performed using a microscope 8 by transferring and rotating the supporting desk 1 in the X, Y axial directions. After both the glass masks 4, 5 for the surface and the back are positioned, the glass mask 4 for the surface is transferred upwardly in the direction shown with an arrow mark. The substrate 2 is put on the glass mask 5 for the back through the extended interval between the glass masks 4, 5 for the surface and the back. After then the glass mask 4 for the surface is transferred to be fixed in the opposite direction from the arrow mark to the position where mask alignment of both glass masks 4, 5 for the surface and the back mentioned above has been performed. Sources of light 6, 7 are lighted in this condition, and exposure of the substrate 1 is conducted.

Description

【発明の詳細な説明】 (a)  発明の技術分野 本発明は半導体装置等を製造するのに用いられるマスク
アライメント装置、特に基板の表裏両面にパターンを作
成するマスク合わせ用のマスクアライメント装置に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a mask alignment device used for manufacturing semiconductor devices, etc., and particularly to a mask alignment device for mask alignment that creates patterns on both the front and back surfaces of a substrate. It is.

(6)技術の背景 近年通信装置尋は高密度化された印刷配線板をますます
使用する傾向にあり、さらに又使用される周波数にして
も益々高い周波数帯へ移行するようになっている。この
要求(対処するために印刷配線板に使用される半導体装
置も高周波化小型化が要望され、この要求に答える手段
として半導体装置の基板の表裏両面を使用することが行
われている。従って基板の表裏両面のマスク合わせが能
率よく高精度に行えるマスクアライメント装置が要望さ
れている。
(6) Background of the Technology In recent years, there has been a tendency for communication devices to increasingly use high-density printed wiring boards, and the frequencies used are also moving toward higher and higher frequency bands. In order to meet this demand, semiconductor devices used in printed wiring boards are also required to have high frequencies and be miniaturized, and as a means to meet this demand, the use of both the front and back sides of the substrate of semiconductor devices is being carried out. There is a need for a mask alignment device that can efficiently and accurately align both the front and back sides of a mask.

(C)従来技術と問題点 第1図は従来のマスクアライメント装置を用いて表裏両
面のマスク合わせを行う状態を示す模式的側面図であり
、同図において、1は支持台、2は基板、8はガラスマ
スクである、従来基板lの表裏両面にパターンニングに
より両面エツチングする基板lを作製するのには、先ず
基板の片面(表面)K一般に行うパターンニングした後
にy対面(裏面)K感光材(しシス))を塗布し、この
基板1を焼付けしたるのち第1図に示すように表面を下
側にして支持台1に載置するうこのようになした後支持
台1t−X、Y軸方向に移動或いは回動させて裏面用の
ガラスマスク3とマスク合わせを行うのである。このマ
スク合わせは一般に特殊顕微鏡を用いて行う、この特殊
顕微鏡は視野の半分に基板1の裏面の状態が見え、残り
半分の視野に裏面用のガラスマスク8が見えるものであ
り、この両視野の一致を支持台IKより行いパターン合
わせが完了し念とするのである。この両視野の一致後感
光材を塗布した裏面に露光を行いパターン合わせ行程を
完了する。しかしこの従来の方法は先ず片面(表面)を
マスク合わせし九る後に所要の裏面用のガラスマスク8
を取付け、更に基板の表面を下側として再載置し、マス
ク合わせをするので、一枚の基板を二回支持台IK載置
することから能率が悪いばかりでなく、特殊顕微鏡を使
用して位置合わせを行うのでこの使用する特殊顕Wk鏡
の精度に左右されてしまうといっ念欠点があった、 働 発明の目的 本発明は上記従来の欠点に鑑み、特殊顕微鏡を用いずに
能率よく更に高精度のマスク合わせが行えるマスクアラ
イメント装置を提供することを目的とするものである。
(C) Prior art and problems FIG. 1 is a schematic side view showing a state in which masks are aligned on both the front and back sides using a conventional mask alignment device. In the figure, 1 is a support, 2 is a substrate, 8 is a glass mask. Conventionally, in order to fabricate a substrate 1 which is subjected to double-sided etching by patterning on both the front and back sides of the substrate 1, one side (front side) of the substrate is patterned, which is generally done, and then the y side (back side) is exposed to light. After coating the substrate 1 and baking it, as shown in Fig. 1, it is placed on the support stand 1 with its surface facing down. , and is moved or rotated in the Y-axis direction to align the mask with the glass mask 3 for the back surface. This mask alignment is generally carried out using a special microscope. This special microscope allows the state of the back surface of the substrate 1 to be seen in half of the field of view, and the glass mask 8 for the back surface to be seen in the other half of the field of view. Matching is performed from the support stand IK to ensure that pattern matching is completed. After the two fields of view match, the back surface coated with the photosensitive material is exposed to light to complete the pattern matching process. However, this conventional method first aligns one side (front side) with the mask, and then attaches the required glass mask 8 for the back side.
, and then remount the board with the surface facing down and align the masks. This not only inefficiently requires the use of a special microscope because one board is placed twice on the support stand IK. In view of the above-mentioned drawbacks of the prior art, the present invention has the disadvantage that the positioning is dependent on the accuracy of the special microscope used. It is an object of the present invention to provide a mask alignment device that can perform highly accurate mask alignment.

(e)  発明の構成 そしてこの目的は本発明によれば支持台と基板との間に
裏面用のガラスマスクを介在せしめるとともに支持台を
光線が通過し裏面用のガラスマスクを照射するように構
成し前記基板の表裏両面のマスク合わせを行うことを特
徴とするマスクアライメント装置を提供することによっ
て達成される、(f)  発明の実施例 以下本発明の好ましい実施例を図面によって詳述する。
(e) Structure and object of the invention According to the present invention, a glass mask for the back side is interposed between the support stand and the substrate, and a light beam is configured to pass through the support stand and illuminate the glass mask for the back side. (f) Embodiments of the Invention Preferred embodiments of the present invention will be described in detail below with reference to the drawings.

第2図は本発明によるマスクアライメント装置の構造を
示す一例の模式的側面図である。
FIG. 2 is a schematic side view of an example of the structure of the mask alignment apparatus according to the present invention.

同図において、4は表面用のガラスマスク、5は裏面用
のガラスマスク、6と7#′i光源、8は顕微鏡をそれ
ぞれ示す。表面用のガラスマスク4は装置一端に支持さ
れる。この支持位置は図示しない機構により微細に上下
方向に移動可能であり。
In the figure, 4 indicates a glass mask for the front surface, 5 indicates a glass mask for the back surface, 6 and 7#'i light sources, and 8 indicates a microscope. A glass mask 4 for the front surface is supported at one end of the device. This support position can be finely moved up and down by a mechanism not shown.

マスク合わせを行うのには先ず表面用のガラスマスク4
を下降せしめ裏面用ガラスマスク6との距離をこれから
マスク合わせを行う基板2の厚みに応じて所要のものと
し顕微鏡8にて表裏用両ガラスマスク4と5とを支持台
1をXY軸方向に移動及び回動させながらマスク合わせ
を行う。この顕微鏡8は一般に用いられる顕微鏡であり
特殊顕微鏡の光学系を含むものより容易に精度の高いも
のが得られるとともに視差も少ないものである。
To perform mask alignment, first prepare the front glass mask 4.
Lower the glass mask 6 for the back side and adjust the distance to the required distance according to the thickness of the substrate 2 to which the masks will be aligned. Using the microscope 8, place both the front and back glass masks 4 and 5 on the support stand 1 in the XY axis directions. Perform mask alignment while moving and rotating. This microscope 8 is a commonly used microscope, and can easily obtain higher precision than a special microscope including an optical system, and has less parallax.

以上のように表裏両ガラスマスク4と6を合わせ念後に
1表面用ガラスマスク4を上方矢印方向く移動する。な
おそれぞれの表面ガラスマスクの位置は図示しない昇降
機構の目盛にて記憶しておく、間隔の広げられた表裏ガ
ラスマスク会と6との間を通して基板2を裏面用のガラ
スマスク5上に載置する。しかるのちに前記した表裏両
ガラスマスク4と5のマスク合わせを行った位置に表面
用のガラスマスク4を矢印反対方向に移動し固定する。
As described above, after aligning both the front and back glass masks 4 and 6, the first surface glass mask 4 is moved in the upward direction of the arrow. Note that the position of each front glass mask is memorized by a scale of a lifting mechanism (not shown).The substrate 2 is placed on the back glass mask 5 through the gap between the front and back glass masks 6 and 6. do. Thereafter, the front glass mask 4 is moved in the opposite direction of the arrow and fixed at the position where the front and back glass masks 4 and 5 are aligned.

この状態にて光源6と7を点灯し基板1の露光を行うの
である。以上説明の露光は表裏同時に行ったが、勿論別
個に行っても何部支障のないことは言うまでもない。尚
上記説明は基板を水平に載置するとしたが垂直に支持し
ても勿論同一効果を得る。
In this state, the light sources 6 and 7 are turned on to expose the substrate 1. Although the above-described exposure was carried out simultaneously on both sides, it goes without saying that exposure may be carried out separately without any problem. Although the above description assumes that the substrate is placed horizontally, the same effect can of course be obtained even if it is supported vertically.

(2)発明の効果 以上、詳細に説明したように1本発明のマスクアライメ
ント装置は一般顕微鏡を用いて一行程にて表裏両面のア
ブイメシトが行え能率がよく且つ高精度のマスク合わせ
がなされ、半導体装置を製作する上で効果大なるものと
なる。
(2) Effects of the Invention As explained in detail above, 1. The mask alignment device of the present invention can perform ab-imposition of both the front and back surfaces in one step using a general microscope, and can perform highly efficient and highly accurate mask alignment for semiconductors. This will be very effective when manufacturing devices.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のマスクアライメント装置を用いて表裏両
面のマスク合わせを行う状態を示す模式的側面図、第2
図は本発明によるマスクアライメント装置の構造を示す
一例の模式的側面図である。 図面に於いて、1は支持台、2は基板、3と4と5はガ
ラスマスクをそれぞれ示す、
Fig. 1 is a schematic side view showing the state in which both the front and back sides of the mask are aligned using a conventional mask alignment device;
The figure is a schematic side view of an example of the structure of a mask alignment device according to the present invention. In the drawings, 1 is a support, 2 is a substrate, and 3, 4, and 5 are glass masks, respectively.

Claims (1)

【特許請求の範囲】[Claims] XとY軸方向の移動及び回動可能な支持台上に基板を載
置し該基板のパターンとガラスマスクとのマスク合わせ
を行うマスクアライメント装置において、前記支持台と
基板との間に該基板の裏面用ガラスマスクを介在せしめ
るとともに、該支持台を光線が通過し前記裏面用ガラス
マスクを照射するように構成し、前記基板の表裏両面の
マスク合わせを行うことを特徴とするマスクアライメン
ト装置。
In a mask alignment device that places a substrate on a support stand that is movable and rotatable in the X and Y axis directions and performs mask alignment between the pattern of the substrate and a glass mask, the substrate is placed between the support stand and the substrate. A mask alignment apparatus characterized in that a glass mask for the back side is interposed therebetween, and a light beam is passed through the support base to irradiate the glass mask for the back side, and the masks are aligned on both the front and back sides of the substrate.
JP57013851A 1982-01-29 1982-01-29 Mask alignment device Pending JPS58131732A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57013851A JPS58131732A (en) 1982-01-29 1982-01-29 Mask alignment device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57013851A JPS58131732A (en) 1982-01-29 1982-01-29 Mask alignment device

Publications (1)

Publication Number Publication Date
JPS58131732A true JPS58131732A (en) 1983-08-05

Family

ID=11844776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57013851A Pending JPS58131732A (en) 1982-01-29 1982-01-29 Mask alignment device

Country Status (1)

Country Link
JP (1) JPS58131732A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537656A (en) * 2002-08-27 2005-12-08 オブデュキャット、アクチボラグ Device for transferring a pattern to an object

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537656A (en) * 2002-08-27 2005-12-08 オブデュキャット、アクチボラグ Device for transferring a pattern to an object
US7754131B2 (en) 2002-08-27 2010-07-13 Obducat Ab Device for transferring a pattern to an object

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