JPS58116735A - 投影焼付方法 - Google Patents

投影焼付方法

Info

Publication number
JPS58116735A
JPS58116735A JP56215336A JP21533681A JPS58116735A JP S58116735 A JPS58116735 A JP S58116735A JP 56215336 A JP56215336 A JP 56215336A JP 21533681 A JP21533681 A JP 21533681A JP S58116735 A JPS58116735 A JP S58116735A
Authority
JP
Japan
Prior art keywords
wafer
projection printing
magnification
printing apparatus
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56215336A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0119252B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Junji Isohata
磯端　純二
Teruya Sato
光弥 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP56215336A priority Critical patent/JPS58116735A/ja
Priority to US06/440,429 priority patent/US4496239A/en
Priority to GB08232724A priority patent/GB2115167B/en
Priority to DE19823243499 priority patent/DE3243499A1/de
Publication of JPS58116735A publication Critical patent/JPS58116735A/ja
Publication of JPH0119252B2 publication Critical patent/JPH0119252B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP56215336A 1981-12-29 1981-12-29 投影焼付方法 Granted JPS58116735A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56215336A JPS58116735A (ja) 1981-12-29 1981-12-29 投影焼付方法
US06/440,429 US4496239A (en) 1981-12-29 1982-11-09 Projection exposure apparatus
GB08232724A GB2115167B (en) 1981-12-29 1982-11-16 Correcting errors in projection printing
DE19823243499 DE3243499A1 (de) 1981-12-29 1982-11-24 Projektionsbelichtungsgeraet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56215336A JPS58116735A (ja) 1981-12-29 1981-12-29 投影焼付方法

Publications (2)

Publication Number Publication Date
JPS58116735A true JPS58116735A (ja) 1983-07-12
JPH0119252B2 JPH0119252B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-04-11

Family

ID=16670604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56215336A Granted JPS58116735A (ja) 1981-12-29 1981-12-29 投影焼付方法

Country Status (4)

Country Link
US (1) US4496239A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS58116735A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3243499A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB2115167B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6449227A (en) * 1987-08-19 1989-02-23 Hitachi Ltd Stepper

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978533A (ja) * 1982-10-27 1984-05-07 Canon Inc 露光装置
JPS5999722A (ja) * 1982-11-29 1984-06-08 Canon Inc 半導体焼付露光制御方法
JPS59144127A (ja) * 1983-02-07 1984-08-18 Canon Inc 像調整された光学装置
US4588288A (en) * 1983-07-01 1986-05-13 Canon Kabushiki Kaisha Static pressure bearing and transport device utilizing the same
US4564284A (en) * 1983-09-12 1986-01-14 Canon Kabushiki Kaisha Semiconductor exposure apparatus
US4624551A (en) * 1983-09-17 1986-11-25 Nippon Kogaku K.K. Light irradiation control method for projection exposure apparatus
DE3447488A1 (de) * 1984-10-19 1986-05-07 Canon K.K., Tokio/Tokyo Projektionseinrichtung
JPS61160934A (ja) * 1985-01-10 1986-07-21 Canon Inc 投影光学装置
US4748477A (en) * 1985-04-30 1988-05-31 Canon Kabushiki Kaisha Exposure apparatus
JPS61278141A (ja) * 1985-05-31 1986-12-09 Canon Inc 投影倍率調整方法
US4719705A (en) * 1986-06-24 1988-01-19 The Perkin-Elmer Corporation Reticle transporter
KR920002820B1 (ko) * 1987-05-27 1992-04-04 마쯔시다덴기산교 가부시기가이샤 주사형 투영 노광장치
US4989031A (en) * 1990-01-29 1991-01-29 Nikon Corporation Projection exposure apparatus
JPH04122013A (ja) * 1990-09-13 1992-04-22 Canon Inc 露光装置
US5206515A (en) * 1991-08-29 1993-04-27 Elliott David J Deep ultraviolet photolithography and microfabrication
JP2864060B2 (ja) * 1991-09-04 1999-03-03 キヤノン株式会社 縮小投影型露光装置及び方法
JPH06183561A (ja) * 1992-12-18 1994-07-05 Canon Inc 移動ステージ装置
US6753948B2 (en) 1993-04-27 2004-06-22 Nikon Corporation Scanning exposure method and apparatus
JP3210145B2 (ja) 1993-07-14 2001-09-17 キヤノン株式会社 走査型露光装置及び該装置を用いてデバイスを製造する方法
JP3101473B2 (ja) * 1993-11-05 2000-10-23 キヤノン株式会社 露光方法及び該露光方法を用いるデバイス製造方法
JP3506158B2 (ja) 1995-04-14 2004-03-15 株式会社ニコン 露光装置及び走査型露光装置、並びに走査露光方法
KR100226599B1 (ko) * 1995-09-04 1999-10-15 미따라이 하지메 구동제어장치 및 방법
US6455821B1 (en) 2000-08-17 2002-09-24 Nikon Corporation System and method to control temperature of an article
JP3652329B2 (ja) * 2002-06-28 2005-05-25 キヤノン株式会社 走査露光装置、走査露光方法、デバイス製造方法およびデバイス
JP4315420B2 (ja) * 2003-04-18 2009-08-19 キヤノン株式会社 露光装置及び露光方法
KR20050080376A (ko) * 2004-02-09 2005-08-12 삼성전자주식회사 투사광학계 및 그것을 갖는 화상 투사 장치
US7649611B2 (en) 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2593841A2 (en) * 2010-07-15 2013-05-22 Centre de Recherche Public - Gabriel Lippmann Methods and systems for detecting, setting, monitoring, determining, storing and compensating the spatial situation of a mobile unit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648470A (en) * 1970-05-28 1972-03-14 Gary E Schultz Materials composition arrangement for thermoelectric heating and cooling
GB1578259A (en) * 1977-05-11 1980-11-05 Philips Electronic Associated Methods of manufacturing solid-state devices apparatus for use therein and devices manufactured thereby
JPS5453867A (en) * 1977-10-06 1979-04-27 Canon Inc Printing device
JPS5459545A (en) * 1977-10-21 1979-05-14 Canon Kk Fluid bearing
US4202623A (en) * 1979-01-08 1980-05-13 The Perkin-Elmer Corporation Temperature compensated alignment system
US4370054A (en) * 1981-04-02 1983-01-25 Canon Kabushiki Kaisha Projection exposure apparatus
JPS5825637A (ja) * 1981-08-08 1983-02-15 Canon Inc 投影焼付装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6449227A (en) * 1987-08-19 1989-02-23 Hitachi Ltd Stepper

Also Published As

Publication number Publication date
JPH0119252B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-04-11
US4496239A (en) 1985-01-29
GB2115167A (en) 1983-09-01
DE3243499C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-12-24
DE3243499A1 (de) 1983-07-14
GB2115167B (en) 1986-05-08

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