JPS58114442A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS58114442A
JPS58114442A JP21398081A JP21398081A JPS58114442A JP S58114442 A JPS58114442 A JP S58114442A JP 21398081 A JP21398081 A JP 21398081A JP 21398081 A JP21398081 A JP 21398081A JP S58114442 A JPS58114442 A JP S58114442A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
dislocations
film
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21398081A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221137B2 (enrdf_load_stackoverflow
Inventor
Junji Sakurai
桜井　潤治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP21398081A priority Critical patent/JPS58114442A/ja
Publication of JPS58114442A publication Critical patent/JPS58114442A/ja
Publication of JPH0221137B2 publication Critical patent/JPH0221137B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
JP21398081A 1981-12-26 1981-12-26 半導体装置の製造方法 Granted JPS58114442A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21398081A JPS58114442A (ja) 1981-12-26 1981-12-26 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21398081A JPS58114442A (ja) 1981-12-26 1981-12-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS58114442A true JPS58114442A (ja) 1983-07-07
JPH0221137B2 JPH0221137B2 (enrdf_load_stackoverflow) 1990-05-11

Family

ID=16648246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21398081A Granted JPS58114442A (ja) 1981-12-26 1981-12-26 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS58114442A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083810A (en) * 1993-11-15 2000-07-04 Lucent Technologies Integrated circuit fabrication process

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542671A (en) * 1977-06-03 1979-01-10 Ibm Method of producing semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542671A (en) * 1977-06-03 1979-01-10 Ibm Method of producing semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6083810A (en) * 1993-11-15 2000-07-04 Lucent Technologies Integrated circuit fabrication process

Also Published As

Publication number Publication date
JPH0221137B2 (enrdf_load_stackoverflow) 1990-05-11

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