JPS58108762A - Film for tape carrier - Google Patents

Abstract

PURPOSE:To allow the cleaning of the top end of a probe so as not to generate testing errors, by providing a probe polishing region wherein a polishing part is provided at the position corresponded to the pad of lead wires formed on a film surface. CONSTITUTION:On the film 1 for a tape carrier, normally regions 2, 2... wherein tape carrier patterns are previously provided are continuously provided. This region 2 is formed on the aperture for an IC chip 3, lead wires 4 formed on the film surface, an IC chip 5 connected to the lead wire 4, and the pad 6 connected to external lead wires when forming a tape carrier of this film 1. At an interval of suitable numbers, i.e. 20 or 50, the probe polishing region 7 of the same area as this region 2 is provided. This probe polishing region 7 does not have an aperture 3 as in the region 2, and, at the part 8 corresponded to the aperture 3, the film is left as it is. On the film surface, lead wires 4 the same as those of the region 2 are so formed that one end is positioned at the edge of this part 8, but pads 6 are not provided at the top end of the lead wire 4. At the position corresponded to the pad 6, polishing parts 9 polishing a probe not shown in the figure are provided.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a film for a tape carrier for manufacturing a tape carrier used for controlling a thermal head for heat-sensitive recording, etc.

Such tape carriers are equipped with IC chips such as LSL, M8I, and IC to control equipment, but generally these tape carriers are made by forming a plurality of tape carrier patterns on a long film in advance. After the IC chip is subjected to a bulk inspection, the film is cut along each tape carrier pattern to manufacture the IC chip.

By the way, in the electrical inspection of the IC chip, the pad at the tip of the lead wire on the film surface connected to the IC chip is
The IC tester's test needle is now held upright.

However, as the number of test ICs increases, metal pieces of pads and the like adhere to the tip of the test needle, increasing the contact resistance between the test needle and the pads, and increasing IC chip test errors.

For this reason, the tip of the test needle must be constantly cleaned, but cleaning every roll of tape carrier film is sufficient.

In view of these points, the present invention has been made with the overall purpose of providing a film for a tape carrier that can clean the tip of a test needle so as to prevent test errors from occurring. A lead wire formed on the film surface so that one end is located at the edge of the opening, an IC chip mounted in the opening and connected to the lead wire, and a pad protruding from the tip of the lead wire. A tape carrier film having a tape carrier pattern provided in advance is placed on the tape carrier film, and at an appropriate number of the regions, the film surface is placed so that one end is located at the edge of the portion of the pattern that overlaps with the opening. At the same time, a lead wire is formed on the pad, and a test needle polishing area consisting of a polishing part metal is provided at a position corresponding to the pad, and the test needle '5I is brought into contact with the polishing part of the test needle polishing area to clean the test needle. It is designed to allow you to do this.

The present invention will be explained below with reference to embodiments shown in the drawings. The tape carrier film 1 is a long film wound into a roll, and the film 1 is usually provided with a tape carrier pattern in advance. area 2, 2・
... are provided consecutively.

This region 2 includes an iC chip opening 3 formed in the film surface, a lead wire 4 formed in the film surface such that one end is located at the edge of the opening 30, and a lead wire 4 mounted in the opening 3. It consists of an IC chip 5 continuous with the lead wire 4, and a pad 6 which is protruded from the tip of the lead wire 4 and is connected to an external lead wire when a tape carrier is formed from the film 1.

In the present invention, in particular, needle polishing regions 7 having the same size as the regions 2 are provided at every suitable number of the regions 2, that is, every 20 or 50 regions. This test needle polishing area 7 has an opening 3 like the area 2.
The film is left as it is in the portion 8 corresponding to the opening 3. Further, a lead wire 4 similar to the lead #4 of the area 2 is formed on the film surface so that one end is located at the edge of this portion 8, but the tip of this lead acid 4 is padded. 6 is not provided. A polishing section 9 (not shown) for polishing a test needle is provided at a position corresponding to the pad 6. This sharpening section 9 is
It is made by pasting an abrasive sheet or applying an abrasive. ;? , %', film 1 on both ends of film 10
Paniforations 10 and HL are provided at equal pitches for sending the 10 and HL.

Next, the operation of the above-described embodiment will be explained.

An IC tester (not shown) that conducts an electrical test of the IC chip 5 has a test needle, and the IC chip 5 is placed in the area 2 that is placed and stopped under the IU of the IC tester. After the force is detected by an optical sensor or the like, the inspection needle descends and hits the pad 6, and the IC chip 5 is inspected.

By the way, if the inspection of the valley region v2 continues, the metal member 71 etc. will adhere to the tip of the test needle and the contact resistance between the test needle and the pad 6 will change. Since test needle polishing regions 7 are provided at appropriate intervals, all the wires attached to the tip of the test needle are removed in the test needle polishing regions 7.

That is, the IC tester detects the presence of the IC chip 5 and then lowers it with the test needle, but the test needle polishing area 7fζ has a part 8 corresponding to the opening 3 instead of the IC chip 5. Since a film remains, the IC tester detects this film and lowers the test needle.

Then, the test needle descends and the tip of the test needle comes into contact with the polishing part 9, so that the foreign matter, such as abrasions, adhering to the tip of the test needle is removed. Therefore, the tip of the test needle is
Since the C chip 5 is cleaned every time the C chip 5 is tested, the electrical test of the IC chip 5 using the test needle can always be performed accurately.

As explained above, the film for a tape carrier according to the present invention includes an opening for an IC chip, a lead wire formed on the film surface so that one end is located at the edge of the opening, and a lead wire mounted inside the opening. In a film for a tape carrier having a region in which a tape carrier pattern consisting of an IC chip connected to the lead wire and a pad protruding from the tip of the lead wire is provided in advance, at an appropriate number of intervals in the region, A lead wire is formed on the film surface so that one end thereof is located at the edge of the portion corresponding to the opening of the pattern, and a test needle polishing area is provided in which a polishing part is provided at a position corresponding to the pad. The test needle of the IC tester can be automatically cleaned after each test, and IC chips can be tested accurately at all times.

[Brief explanation of the drawing]

The drawing is a perspective view showing an embodiment of a tape carrier film according to the present invention. DESCRIPTION OF SYMBOLS 1...Tape carrier film, 2...Area, 3
... Opening, 4... Lead wire, 5... IC chip, 6... Pa: 1 rad, 7... Inspection side polishing area, 9... Sharpening section. Applicant's agent Kiyoshi Inomata (7) Procedural amendment February 1, 1980 Commissioner of the Japan Patent Office Shima 1) Haruki Tono1, Indication of the case 1982 Patent Application No. 2084602, Name of the invention Tape carrier Film 3, Patent applicant (674) Ricoh Co., Ltd. related to the case of the person making the amendment -7, "Detailed Description of the Invention" column of the specification to be amended. 8. Contents of amendment (1) JL S LJ on page 2, line 3 of the specification has been changed to [LSI
Correct it with J. (2) 1 on the bottom line of page 4 of the same book. ” should be corrected as follows. 1. Further, when the tape carrier film 1 is provided with an opening 3, a dummy, for example, a defective IC chip 5 is mounted thereon. 1 (3) No pad 6 is provided at the tip of the third or fourth line of page 5 of the same book. Then, correct "to 1 tip." (4) On page 6, line 9 of the same book, [Since the IC tester has left this film, Since a dummy, for example, a defective IC chip 5 is mounted, the IC tester corrects this film or the dummy IC chip 5. that's all

Claims (1)

[Claims] an opening for an IC chip, a lead wire formed on the film surface so that one end is located at the edge t of the opening, an IC chip mounted in the opening and connected to the lead wire, and a tip of the lead wire. In a film for a tape carrier having a region in which a tape carrier pattern consisting of protruding pads is provided in advance, at an appropriate number of intervals in the region, one end is located at the edge of the portion corresponding to the opening of the pattern. A film for a tape carrier, characterized in that lead wires are formed on the film surface, and a test needle polishing area is provided in which a polishing part is provided at a position corresponding to the pad.