JPS58104166A - Continuous measuring method for thickness of electroless plating - Google Patents

Continuous measuring method for thickness of electroless plating

Info

Publication number
JPS58104166A
JPS58104166A JP20000281A JP20000281A JPS58104166A JP S58104166 A JPS58104166 A JP S58104166A JP 20000281 A JP20000281 A JP 20000281A JP 20000281 A JP20000281 A JP 20000281A JP S58104166 A JPS58104166 A JP S58104166A
Authority
JP
Japan
Prior art keywords
sensors
thickness
plating
plated
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20000281A
Other languages
Japanese (ja)
Inventor
Takashi Kanamori
Hideo Sawai
Toshiko Suwa
Original Assignee
Oki Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Ind Co Ltd filed Critical Oki Electric Ind Co Ltd
Priority to JP20000281A priority Critical patent/JPS58104166A/en
Publication of JPS58104166A publication Critical patent/JPS58104166A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1664Process features with additional means during the plating process
    • C23C18/1671Electric field

Abstract

PURPOSE:To measure deposition thickness continuously and accurately by providing multipolar sensors which measure the film thickness of the objects to be plated continuously by sensing the change in the resistance value of deposited metal and converting the same to the film thickness, selecting the sensors by each piece from the lapse of time with the common electrode maintained at the ground potential and measuring the resistance values of the sensors. CONSTITUTION:Multipolar sensors having plural pieces of measuring systems are used as sensors 9, and the sensors are selected by each piece in making measurement, so that the sensors once used from the start up to the end of plating are no longer used. Since there are no differences in the plating deposition thickness of the surfaces of be plated of an object 2 to be plated and the sensors 9, the thickness of electroless plating can be measured accurately. Further, a plating soln. 1, the common electrode of the sensors 9 and the earth terminal of a resistance measuring circuit 26 are grounded; therefore, the stable measurement is possible.
JP20000281A 1981-12-14 1981-12-14 Continuous measuring method for thickness of electroless plating Pending JPS58104166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20000281A JPS58104166A (en) 1981-12-14 1981-12-14 Continuous measuring method for thickness of electroless plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20000281A JPS58104166A (en) 1981-12-14 1981-12-14 Continuous measuring method for thickness of electroless plating

Publications (1)

Publication Number Publication Date
JPS58104166A true JPS58104166A (en) 1983-06-21

Family

ID=16417156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20000281A Pending JPS58104166A (en) 1981-12-14 1981-12-14 Continuous measuring method for thickness of electroless plating

Country Status (1)

Country Link
JP (1) JPS58104166A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0113395A2 (en) * 1982-12-10 1984-07-18 International Business Machines Corporation Monitoring electroless plating
EP0194103A2 (en) * 1985-02-28 1986-09-10 C. UYEMURA & CO LTD Method and apparatus for detecting start of electroless plating
JPS61264180A (en) * 1985-05-18 1986-11-22 Canon Inc Automatic monitoring device for electroless plating device
JPS62287080A (en) * 1986-06-06 1987-12-12 Canon Inc Device for automatically monitoring electroless plating
EP0255063A2 (en) * 1986-07-28 1988-02-03 International Business Machines Corporation Controlling resistivity of plated metal
JPS63195274A (en) * 1987-02-09 1988-08-12 Canon Inc Method for controlling electroless plating

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0113395A2 (en) * 1982-12-10 1984-07-18 International Business Machines Corporation Monitoring electroless plating
EP0194103A2 (en) * 1985-02-28 1986-09-10 C. UYEMURA & CO LTD Method and apparatus for detecting start of electroless plating
JPS61264180A (en) * 1985-05-18 1986-11-22 Canon Inc Automatic monitoring device for electroless plating device
JPS62287080A (en) * 1986-06-06 1987-12-12 Canon Inc Device for automatically monitoring electroless plating
EP0255063A2 (en) * 1986-07-28 1988-02-03 International Business Machines Corporation Controlling resistivity of plated metal
JPS63195274A (en) * 1987-02-09 1988-08-12 Canon Inc Method for controlling electroless plating

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