JPS5797464A - Measuring device for semiconductor element - Google Patents

Measuring device for semiconductor element

Info

Publication number
JPS5797464A
JPS5797464A JP17602580A JP17602580A JPS5797464A JP S5797464 A JPS5797464 A JP S5797464A JP 17602580 A JP17602580 A JP 17602580A JP 17602580 A JP17602580 A JP 17602580A JP S5797464 A JPS5797464 A JP S5797464A
Authority
JP
Japan
Prior art keywords
mounting table
main body
roll
semiconductor element
out wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17602580A
Other languages
Japanese (ja)
Inventor
Katsuji Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17602580A priority Critical patent/JPS5797464A/en
Publication of JPS5797464A publication Critical patent/JPS5797464A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To make preparations through simple manual operation and to perform measurement under stable conditions by holding the measurement in readiness by pushing up a mounting table body by utilizing a roll after mounting a semiconductor element, whose electric characteristics are to be measured, on the mounting table body temporarily. CONSTITUTION:A mounting table 17 on which a semiconductor element 1 whose electric characteristics are to be measured is mounted has a recessed groove wherein the external lead-out wire 3 of the element 1 is held and is fixed to a mounting table body 18. This main body 18 is held on a fixed shaft 11 through a slidably supported bearing 19 and, while the reverse surface of the main body 18 is in contact with the roll 15 of an operating arm 14, moves up and down through the rotation of the operating arm 14. The main body 18 is placed at a lower-limit position and after the element is mounted temporarily while its external lead-out wire 3 is alignes to the recessed groove of the mounting table 17, the operating arm 16 is rotated to push up the main body 18 through the roll 15 to an upper-limit position. In this state, the external lead-out wire 3 comes into contact with a contact piece 21 to perform measurement by an electric characteristic measuring instrument.
JP17602580A 1980-12-10 1980-12-10 Measuring device for semiconductor element Pending JPS5797464A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17602580A JPS5797464A (en) 1980-12-10 1980-12-10 Measuring device for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17602580A JPS5797464A (en) 1980-12-10 1980-12-10 Measuring device for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5797464A true JPS5797464A (en) 1982-06-17

Family

ID=16006402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17602580A Pending JPS5797464A (en) 1980-12-10 1980-12-10 Measuring device for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5797464A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713014A (en) * 1986-12-23 1987-12-15 Hughes Aircraft Company Quick-release multi-module terminating assembly
EP4066997A1 (en) 2021-04-01 2022-10-05 Meggiorin, Andrea An improved roller

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713014A (en) * 1986-12-23 1987-12-15 Hughes Aircraft Company Quick-release multi-module terminating assembly
EP4066997A1 (en) 2021-04-01 2022-10-05 Meggiorin, Andrea An improved roller

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